One example provides a fluidic die including a nozzle layer disposed on a substrate, the nozzle layer having an upper surface opposite the substrate and including a plurality of nozzles formed therein, each nozzle including a fluid chamber and a nozzle orifice extending through the nozzle layer from the upper surface to the fluid chamber. A conductive trace is exposed to the upper surface of the nozzle layer and extends proximate to a portion of the nozzle orifices, an impedance of the conductive trace indicative of a surface condition of the upper surface of the nozzle layer.

A method of applying a coating composition to a substrate utilizing a high transfer efficiency applicator include the steps of providing the high transfer efficiency applicator comprising an array of nozzles wherein each nozzle defines a nozzle orifice having a diameter of from 0.00002 m to 0.0004, providing the coating composition, and applying the coating composition to the substrate through the nozzle orifice without atomization such that at least 99.9% of the applied coating composition contacts the substrate to form a coating layer having a wet thickness of at least 5 microns, wherein the coating composition includes a carrier, a binder, and a radar reflective pigment or a LiDAR reflective pigment. The coating composition has an Ohnesorge number (Oh) of from about 0.01 to about 12.6, a Reynolds number (Re) of from about 0.02 to about 6,200, and a Deborah number (De) of from greater than 0 to about 1730.

A method of applying a coating composition to a substrate utilizing a high transfer efficiency applicator include the steps of providing the high transfer efficiency applicator comprising an array of nozzles wherein each nozzle defines a nozzle orifice having a diameter of from 0.00002 m to 0.0004, providing the coating composition, and applying the coating composition to the substrate through the nozzle orifice without atomization such that at least 99.9% of the applied coating composition contacts the substrate to form a coating layer having a wet thickness of at least 5 microns, wherein the coating composition includes a carrier, a binder, and a radar reflective pigment or a LiDAR reflective pigment. The coating composition has an Ohnesorge number (Oh) of from about 0.01 to about 12.6, a Reynolds number (Re) of from about 0.02 to about 6,200, and a Deborah number (De) of from greater than 0 to about 1730.

A liquid ejecting apparatus includes a drive element, and a drive circuit that outputs a drive signal that drives the drive element, wherein the drive circuit includes a modulation circuit that modulates a base drive signal to output a modulation signal, an amplifier circuit that amplifies the modulation signal to output an amplified modulation signal, a demodulation circuit that demodulates the amplified modulation signal to output the drive signal, and a substrate on which the modulation circuit, the amplifier circuit, and the demodulation circuit are provided, wherein the substrate includes a base material includes a metal and a first layer laminated on the base material, wherein the first layer includes a first propagation wire through which at least one of the amplified modulation signal and the drive signal propagates, and wherein the base material has a thickness greater than a thickness of the first layer.

A liquid discharge head is configured to discharge a liquid, and the liquid discharge head includes an actuator substrate and a holding substrate bonded to the actuator substrate. The actuator substrate includes a pressure generator, and a wiring electrode configured to electrically connect the pressure generator and an exterior of the liquid discharge head. The holding substrate includes an opening configured to expose the wiring electrode to the exterior of the liquid discharge head, and a detection surface adjacent to the opening, the detection surface having a higher reflectance than a surface of the wiring electrode of the actuator substrate.

An image-recording apparatus includes: a first tank defining a first storage chamber; a second tank defining a second storage chamber; a conveying mechanism for conveying sheets along a conveying path extending in a depthwise direction and a widthwise direction perpendicular to a vertical direction and the depthwise direction; and a recording head including a nozzle. Liquid in the first storage chamber is supplied through a communication port to the second storage chamber and then to the recording head through a liquid outlet port. The second storage chamber is positioned further in a first depthwise direction relative to the nozzle and further in a first widthwise direction relative to the conveying path. A volume of a prescribed space above a liquid level equal to a height of the communication port in the second storage chamber is greater than that of a liquid channel between the liquid outlet port and the nozzle.

A die for a printhead is provided in examples. The die includes a number of fluidic actuator arrays. A data block is associated with each of the plurality of fluidic actuator arrays. The die includes an interface comprising a data pad and a clock pad, wherein a data bit value present at the data pad is loaded into a first data block corresponding to a first fluidic actuator array on a rising clock edge and loaded into a second data block corresponding to a second fluidic actuator array on a falling clock edge.

A liquid ejection device includes: a nozzle through which a liquid is ejected; a liquid transfer tube through which the liquid is transferred to the nozzle; and a vibration generation unit configured to generate vibration, in which the vibration generation unit is in contact with one of the liquid, the nozzle, and the liquid transfer tube, and when the liquid ejected from the nozzle flies as a plurality of droplets in a state where the vibration generation unit does not generate vibration, and the number of the droplets passing through a predetermined position in a unit time is defined as a droplet frequency, a frequency of the vibration generated by the vibration generation unit is equal to or less than the droplet frequency.

An electronic assembly includes a substrate having a die and PCB mounted thereon. Wirebonds interconnect bond pads of the die with contact pads of the PCB, each wirebond having a first end portion bonded to a respective bond pad, an opposite second end portion bonded to a respective contact pad and an intermediate section extending between the first and second end portions. A dam encapsulant encapsulates each of the first and second end portions, a first fill encapsulant contacts the substrate and the dam encapsulant; and a second fill encapsulant overlies the first fill encapsulant. The first fill encapsulant has a lower modulus of elasticity than the second fill encapsulant and the dam encapsulant.

An electronic assembly includes a substrate having a die and PCB mounted thereon. Wirebonds interconnect bond pads of the die with contact pads of the PCB, each wirebond having a first end portion bonded to a respective bond pad, an opposite second end portion bonded to a respective contact pad and an intermediate section extending between the first and second end portions. A dam encapsulant encapsulates each of the first and second end portions, a first fill encapsulant contacts the substrate and the dam encapsulant; and a second fill encapsulant overlies the first fill encapsulant. The first fill encapsulant has a lower modulus of elasticity than the second fill encapsulant and the dam encapsulant.