A method of making an ejector device. The method includes providing a substrate and forming one or more ejector conduits on the substrate. The one or more ejector conduits comprise: a first end configured to accept a print material; a second end comprising an ejector nozzle, the ejector nozzle comprising a first electrode pair that includes a first electrode and a second electrode, at least one surface of the first electrode being exposed in the ejector nozzle and at least one surface of the second electrode being exposed in the ejector nozzle; and at least one passageway for allowing the print material to flow from the first end to the second end. A method of printing a three-dimensional object and a method for jetting print material from a printer jetting mechanism are also disclosed.

A fluid ejection apparatus includes a plurality of fluid ejectors. Each fluid ejector includes a pumping chamber, and an actuator configured to cause fluid to be ejected from the pumping chamber. The fluid ejection apparatus includes a feed channel fluidically connected to each pumping chamber; and at least one compliant structure formed in a surface of the feed channel. The at least one compliant structure has a lower compliance than the surface of the feed channel.

A liquid ejection head substrate includes a base layer, a heating resistance element provided over the base layer to generate a heat energy for ejecting a liquid, a first insulation layer covering the heating resistance element, and a protective layer having, on the first insulation layer, a first region which overlaps the heating resistance element via the first insulation layer and a second region which does not overlap the heating resistance element and formed of a material including a metal which is eluted by an electrochemical reaction. The liquid ejection head substrate further includes a second insulation layer provided over a region overlying the base layer and not provided with the protective layer and over the second region of the protective layer.

A liquid discharge head includes: a flow passage substrate which is formed with individual flow passages, the individual flow passages including nozzles and pressure chambers communicated with the nozzles respectively; actuators which are fixed to a surface of the flow passage substrate and which overlap with the pressure chambers respectively in an orthogonal direction; and a protective substrate which is fixed to the surface and which covers the actuators. The protective substrate has at least one wall portion for defining actuator accommodating chambers which accommodate the actuators respectively. The wall portion overlaps in the orthogonal direction with a partition wall for partitioning two pressure chambers in the flow passage substrate. The wall portion is adhered to the surface via an adhesive portion. A protective film is formed at portions of the protective substrate and the adhesive portion which define the actuator accommodating chambers.

A liquid ejecting head includes a liquid flow channel including nozzles constituting a nozzle row configured to eject a liquid, a dummy flow channel including dummy nozzles constituting a dummy nozzle row not configured to eject liquid, and a closing section formed by an adhesive and closing the dummy flow channel.

A die for a printhead is provided in examples. The die includes a number of fluidic actuator arrays, proximate to a number of fluid feed holes. A number of address lines are disposed proximate to a number of logic circuits on a low-voltage side of the fluid feed holes. An address decoder circuit is coupled to at least a portion of the address lines to select a fluidic actuator in a fluidic actuator array for firing. The address decoder circuit is customized to select a different address for each fluidic actuator in the fluidic actuator array. A logic circuit triggers a driver circuit located in a high-voltage side of the plurality of fluid feed holes opposite the low-voltage side, based, at least in part, on a bit value for the fluidic actuator array, the fluidic actuator selected by the address decoder circuit, and a firing signal.

A bonded substrate includes: a first substrate; and a second substrate having a bonding surface bonded to the first substrate, wherein the second substrate includes a recess having a bottom surface recessed from a surface opposite to the bonding surface, and a difference between the maximum height and the minimum height of the bottom surface from the surface opposite to the bonding surface of the recess is less than 10 .Math.m.

A liquid discharge apparatus includes a substrate stage configured to move while holding a substrate, a discharge unit including nozzles for discharging a liquid, a control unit configured to control the discharge unit to discharge the liquid from the discharge unit, and a position acquisition unit configured to acquire a position of a movement target object at a predetermined timing while the substrate stage or the discharge unit is moved as the movement target object. The control unit controls a discharge timing for discharging the liquid from the discharge unit, based on a difference between the position of the movement target object acquired by the position acquisition unit at the predetermined timing and a target position of the movement target object at the predetermined timing.

A liquid discharge head includes: a nozzle plate having a nozzle from which a liquid is to be discharged in a discharge direction, the nozzle having a cylindrical hole having periodical convex portions and concave portions on a sidewall of the nozzle in the discharge direction, a diameter of an outermost portion of the nozzle in the discharge direction being smaller than an average diameter of minimum values and maximum values of diameters of the cylindrical shape. The average diameter is obtained by: Average diameter = (Sum of minimum values + Sum of maximum values) / (Count of minimum values + Count of maximum values).

A highly reliable liquid ejection head comprises a substrate made of silicon and having a first surface and a second surface opposite to the first surface, an ejection port forming member bonded to the first surface of the substrate and formed with an ejection port for ejecting liquid, and a bonded member configured to be bonded to the second surface of the substrate. A through flow path is formed in the substrate, which is configured to pass through the substrate and to supply liquid to the ejection port. A first protective film made of a metal oxide is formed on an inner surface of the through flow path, and a second protective film made of a silicon compound is formed on all of the second surface of the substrate.