A liquid ejection head of the present invention has: an element substrate in which a liquid ejection port is formed, the element substrate having an energy generating element that generates energy for ejecting the liquid from the ejection port, and a plurality of wiring pads lined up in a predetermined direction; a flexible wiring substrate having a plurality of leads lined up in the predetermined direction and overlaid on and connected to the plurality of wiring pads respectively, and a base film overlaid on the plurality of leads; and a sealant that seals a plurality of connection portions of the plurality of wiring pads and the plurality of leads. The base film has a plurality of covering portions that respectively cover an opposite side of the plurality of leads from the plurality of connection portions, and an opening or slit formed between the plurality of covering portions.

A liquid ejection head includes a substrate having a liquid feeding port and an energy generating element, a substrate protective layer provided on the substrate, and a nozzle forming member provided on the substrate protective layer, and having an ejection port ejecting a liquid, and a liquid flow channel communicating with the liquid feeding port and the ejection port. The substrate protective layer comprises an ion scavenger.

According to one embodiment, a liquid ejection head includes an actuator with a plurality of pressure chambers and dummy chambers. The pressure chambers are each part of a groove that is disposed between an adjacent pair of sidewalls. Each pressure chamber is in fluid communication with a nozzle for ejecting a liquid. The dummy chambers are each between an adjacent pair of pressure chambers. A common chamber is fluidly connected to an end of each of the pressure chambers. A throttle portion is at the end portion of each pressure chamber. Each throttle portion blocks a part of a liquid flow path from the first common chamber to the pressure chamber. The first throttle portion is formed of a resin material.

A method for producing a silicon substrate comprising a silicon base material; and a wiring formation layer laminated on a base material surface of the silicon base material, and being provided with a wiring member, an electrode member comprising a noble metal, and a close contact member comprising a base metal between the wiring member and the electrode member, wherein the method comprises a step of forming a deposition film by a fluorocarbon gas, in etching of the silicon substrate; and a removal step of removing, by a removal solution, the deposition film formed by the fluorocarbon gas; the removal solution comprises a primary amine and an organic polar solvent; a content of water in the removal solution is 10 mass % or lower; and a content of tetramethylammonium hydroxide in the removal solution is 1 mass % or lower.

A fluid jet ejection device, a method of making a fluid jet ejection head, and a method of improving the plume characteristics of fluid ejected from the fluid jet ejection head. The pharmaceutical drug delivery device includes a cartridge body; and a fluid jet ejection cartridge disposed in the cartridge body. The fluid jet ejection cartridge contains a fluid and an ejection head attached to the fluid jet ejection cartridge. The ejection head contains a plurality of fluid ejectors thereon and a nozzle plate having a plurality of fluid ejection nozzles therein associated with the plurality of fluid ejectors. At least one of the plurality of fluid ejection nozzles has an orthogonal axial flow path relative to a plane defined by the nozzle plate and at least one of the plurality of fluid ejection nozzles has an angled axial flow path relative to a plane define by the nozzle plate.

A unit for supplying a substrate-treating liquid is provided with a first reservoir and a second reservoir between which a differential pressure is constantly maintained to establish a flow rate, along with a substrate-treating apparatus having the unit for supplying the substrate-treating liquid. The unit for supplying the substrate-treating liquid includes a supply reservoir module and a buffer reservoir module. The supply reservoir module includes a first reservoir for supplying the substrate-treating liquid to an inkjet head unit for jetting the substrate-treating liquid onto a substrate, and a second reservoir for recovering the substrate-treating liquid that remains unused in the inkjet head unit. The buffer reservoir module is configured to provide the substrate-treating liquid to the first reservoir. Differential pressure is constantly maintained between the first reservoir and the second reservoir.

A substrate processing apparatus and a substrate processing method are provided, which can improve the yield by minimizing the occurrence of stains. The substrate processing method includes forming on the substrate a plurality of ink patterns spaced apart from each other by jetting ink onto the substrate by using a plurality of nozzles, calculating the density of each of the plurality of ink patterns, and selecting at least one nozzle for jetting ink into one pixel area based on respectively calculated densities of the plurality of ink patterns.

Breakage of components is suppressed at the time of bonding. A print head with a metal film formed on laminated layers includes an electric wiring layer electrical connection with a metal film, a protective film covering and protecting the electric wiring layer, a groove separating the protective film and the electric wiring layer around the metal film, and a resin film applied to the groove.

Examples of molded substrates are described herein. In some examples, a molded substrate may support integrated circuitry. In some examples, the molded substrate and the integrated circuitry are included in a circuitry package for a replaceable print component. In some examples, the molded substrate is relatively flat. In some examples, molding remnants may be on the molded substrate.

Examples of molded substrates are described herein. In some examples, a molded substrate may support integrated circuitry. In some examples, the molded substrate and the integrated circuitry are included in a circuitry package for a replaceable print component. In some examples, the molded substrate is relatively flat. In some examples, molding remnants may be on the molded substrate.