B41J2/33545

Thermal print head
09796189 · 2017-10-24 · ·

A thermal print head includes a semiconductor substrate, a resistor layer with heat generating portions arranged in the main scanning direction, a wiring layer included in a conduction path for energizing the heat generating portions, and a protective layer covering the resistor layer and the wiring layer. The semiconductor substrate includes a projection protruding from the obverse surface of the substrate and elongated in the main scanning direction. The projection has first and second inclined side surfaces spaced apart from each other in the sub-scanning direction. The heat generating portions are arranged to overlap with the first inclined side surface of the projection as viewed in plan view.

Thermal print head and thermal printer
09744774 · 2017-08-29 · ·

The present invention provides a thermal print head and a thermal printer that can deliver improved printing quality. The thermal print head includes a main substrate with a main surface, heating elements arranged along a main scanning direction, and a protection layer that covers the heating elements. A belt-shaped heating glaze layer is between the main surface and the heating elements, extends along the main scanning direction, and bulges towards the direction where the main surface faces. The surface shape of the protection layer has an equivalent radius of curvature Re between 6200 m and 15000 m. The equivalent radius of curvature Re is calculated by Hq and Wq. Hq is of the maximum height Hm of the bulging portion of the protection layer including the heating glaze layer. Wq is the width of the bulging portion along a sub-scanning direction, measured at a height equal to Hm minus Hq.

THERMAL PRINT HEAD
20170182795 · 2017-06-29 ·

A thermal print head includes a semiconductor substrate, a resistor layer with heat generating portions arranged in the main scanning direction, a wiring layer included in a conduction path for energizing the heat generating portions, and a protective layer covering the resistor layer and the wiring layer. The semiconductor substrate includes a projection protruding from the obverse surface of the substrate and elongated in the main scanning direction. The projection has first and second inclined side surfaces spaced apart from each other in the sub-scanning direction. The heat generating portions are arranged to overlap with the first inclined side surface of the projection as viewed in plan view.

THERMAL PRINT HEAD
20170182794 · 2017-06-29 ·

A thermal print head includes a semiconductor substrate, a resistor layer and a wiring layer. The resistor layer is formed on the semiconductor substrate and has a plurality of heat generating portions arranged in the main scanning direction. The wiring layer is formed on the semiconductor substrate to be included in a conduction path for energizing the plurality of heat generating portions. The conduction path includes a path or paths provided by the semiconductor substrate itself.

THERMAL PRINT HEAD AND THERMAL PRINTER
20170182793 · 2017-06-29 ·

The present invention provides a thermal print head and a thermal printer that can deliver improved printing quality. The thermal print head includes a main substrate with a main surface, heating elements arranged along a main scanning direction, and a protection layer that covers the heating elements. A belt-shaped heating glaze layer is between the main surface and the heating elements, extends along the main scanning direction, and bulges towards the direction where the main surface faces. The surface shape of the protection layer has an equivalent radius of curvature Re between 6200 m and 15000 m. The equivalent radius of curvature Re is calculated by Hq and Wq. Hq is of the maximum height Hm of the bulging portion of the protection layer including the heating glaze layer. Wq is the width of the bulging portion along a sub-scanning direction, measured at a height equal to Hm minus Hq.

THERMAL HEAD AND THERMAL PRINTER

A thermal head includes a substrate, a heat storage layer located on the substrate, and a heat generating part located on the heat storage layer. A transport direction of a recording medium is defined as a first direction, a direction opposite to the first direction is defined as a second direction, and in the heat storage layer, a thickness of a portion located under an end portion of the heat generating part on a side of the second direction is thicker than a thickness of a portion located under an end portion of the heat generating part on a side of the first direction.

THERMAL PRINT HEAD AND METHOD FOR MANUFACTURING THEREOF
20250058566 · 2025-02-20 ·

The present disclosure provides a thermal print head. The thermal print head includes: a substrate; a glaze layer; a wiring layer; a heat element; and a protective layer. The glaze layer is disposed on the substrate. The wiring layer is disposed on the glaze layer. The wiring layer has a common electrode and a plurality of individual electrodes. The common electrode has protrusions arranged in intervals along a first direction in a plan view and extending along a second direction perpendicular to the first direction in the plan view. The plurality of individual electrodes have tip portions extending along the second direction. The protrusions and the tip portions are alternately arranged in intervals along the first direction in the plan view. The heat element extends along the first direction in the plan view, is disposed on the glaze layer, and overlaps with the protrusions and the tip portions.

INSULATING SUBSTRATE
20250074838 · 2025-03-06 ·

An insulating substrate comprises a ceramic substrate having a major surface, a plurality of first ribs formed on the major surface, and a glaze layer disposed on the major surface so as to cover the plurality of first ribs. The plurality of first ribs in plan view extend in a first direction and are spaced in a second direction orthogonal to the first direction and thus aligned.

Thermal print head, manufacturing method of the same, and thermal printer
12358302 · 2025-07-15 · ·

Provided is a thermal print head including: a substrate having a convex part thereon; a wiring layer over the convex part; a heat storage layer over the wiring layer; a heating resistive part that is formed over the heat storage layer and is arranged along a main scanning direction; a first electrode in contact with the heating resistive part on one side in a sub-scanning direction; a second electrode in contact with the heating resistive part on another side in the sub-scanning direction; and a connection wiring formed in an opening that passes through the heating resistive part and the heat storage layer and reaches the wiring layer, in which the first electrode is electrically connected to the wiring layer via the connection wiring.

Thermal print head
12570092 · 2026-03-10 · ·

A thermal print head includes: a substrate including a main surface; an insulating film arranged on the main surface; a first wiring layer arranged on the insulating film; a first interlayer insulating film arranged on the first wiring layer; a heat-generating body film; and a second wiring layer arranged on the first interlayer insulating film with the heat-generating body film interposed therebetween, wherein a bump is formed on the main surface, wherein the bump extends along a first direction in a plan view, wherein the second wiring layer extends along a second direction orthogonal to the first direction to intersect the bump in a plan view, and includes first, second, third, and fourth wirings arranged along the first direction, wherein the second wiring is located between the first wiring and the third wiring, and wherein the third wiring is located between the second wiring and the fourth wiring.