A thermal print head includes a semiconductor substrate, a resistor layer with heat generating portions arranged in the main scanning direction, a wiring layer included in a conduction path for energizing the heat generating portions, and a protective layer covering the resistor layer and the wiring layer. The semiconductor substrate includes a projection protruding from the obverse surface of the substrate and elongated in the main scanning direction. The projection has first and second inclined side surfaces spaced apart from each other in the sub-scanning direction. The heat generating portions are arranged to overlap with the first inclined side surface of the projection as viewed in plan view.

A thermal head includes a substrate; a plurality of heating elements; a plurality of electrodes; a first covering layer; and a covering member. The thermal head further includes a second covering layer extending from the first covering layer onto the end surface. The housing is in contact with the second covering layer.

A thermal print head includes a semiconductor substrate, a resistor layer with heat generating portions arranged in the main scanning direction, a wiring layer included in a conduction path for energizing the heat generating portions, and a protective layer covering the resistor layer and the wiring layer. The semiconductor substrate includes a projection protruding from the obverse surface of the substrate and elongated in the main scanning direction. The projection has first and second inclined side surfaces spaced apart from each other in the sub-scanning direction. The heat generating portions are arranged to overlap with the first inclined side surface of the projection as viewed in plan view.

A thermal print head includes a semiconductor substrate, a resistor layer and a wiring layer. The resistor layer is formed on the semiconductor substrate and has a plurality of heat generating portions arranged in the main scanning direction. The wiring layer is formed on the semiconductor substrate to be included in a conduction path for energizing the plurality of heat generating portions. The conduction path includes a path or paths provided by the semiconductor substrate itself.

Disclosed is a thermal transfer ribbon for use with a media processing device. The thermal transfer ribbon includes a carrier layer and a transfer layer operatively coupled to the carrier layer. The transfer layer includes an environmental indicator material encapsulated in a plurality of microcapsules. The plurality of microcapsules prevent the environmental indicator material from producing an observable effect in response to exposure to a predetermined environmental condition. The environmental indicator material is released from the plurality of microcapsules in response to the plurality of microcapsules being ruptured. After the environmental indicator material is released and exposed to the predetermined environmental condition, the environmental indicator material produces the observable effect. The observable effect results from a change in the environmental indicator material from an original state to a second state in response to the predetermined environmental condition.

Provided is a thermal print head including: a substrate having a convex part thereon; a wiring layer over the convex part; a heat storage layer over the wiring layer; a heating resistive part that is formed over the heat storage layer and is arranged along a main scanning direction; a first electrode in contact with the heating resistive part on one side in a sub-scanning direction; a second electrode in contact with the heating resistive part on another side in the sub-scanning direction; and a connection wiring formed in an opening that passes through the heating resistive part and the heat storage layer and reaches the wiring layer, in which the first electrode is electrically connected to the wiring layer via the connection wiring.

A recording device includes a recording section configured to perform recording on a medium; a control substrate 60 configured to be involved in the operation of the recording section; and a storage section including a metal partition 70 and covering the control substrate 60, wherein the control substrate 60 is in contact with the convex member 72 constitutes at least a part of the partition 70 via the elastic member 80 having heat conductivity.

The thermal print head having COF structure is disclosed. According to the present invention, productivity can be improved with a low step of a protective resin by using a COF method, the height of the thermally compressed COF can be minimized in comparison with the surface of the ceramic substrate by electrically connecting the ceramic substrate and the COF through thermal compression using ACF, and the height of the thermally compressed COF can be minimized in comparison with the surface of the ceramic substrate.

Disclosed is a thermal transfer ribbon for use with a media processing device. The thermal transfer ribbon includes a carrier layer and a transfer layer operatively coupled to the carrier layer. The transfer layer includes an environmental indicator material encapsulated in a plurality of microcapsules. The plurality of microcapsules prevent the environmental indicator material from producing an observable effect in response to exposure to a predetermined environmental condition. The environmental indicator material is released from the plurality of microcapsules in response to the plurality of microcapsules being ruptured. After the environmental indicator material is released and exposed to the predetermined environmental condition, the environmental indicator material produces the observable effect. The observable effect results from a change in the environmental indicator material from an original state to a second state in response to the predetermined environmental condition.

A thermal head includes a substrate, a bonding material, an electrically conductive member, and an aluminum electrode. The bonding material is positioned on the substrate and contains gold and tin. The electrically conductive member is positioned on the bonding material. The aluminum electrode is positioned on the substrate and electrically connected to the electrically conductive member via the bonding material.