A thermal print head includes: a head substrate on which a plurality of heating resistance units are formed; a heat sink thermally connected to the head substrate, a recess being formed in a back surface of the heat sink which faces a surface to which the head substrate is connected; a metal member arranged in the recess; and an adhesive arranged between a bottom surface of the recess and the metal member. The recess viewed from a direction perpendicular to the back surface includes: an area where the metal member is arranged, and a groove area where the metal member is not arranged. A portion of the adhesive is arranged in the groove area.

The thermal print head having COF structure is disclosed. According to the present invention, productivity can be improved with a low step of a protective resin by using a COF method, the height of the thermally compressed COF can be minimized in comparison with the surface of the ceramic substrate by electrically connecting the ceramic substrate and the COF through thermal compression using ACF, and the height of the thermally compressed COF can be minimized in comparison with the surface of the ceramic substrate.

Provided is a portable thermal printing device including: a support plate assembly; a heat insulation plate disposed on the support plate assembly; and a heating plate disposed on the heat insulation plate and including a uniform heating plate body, a covering layer, and a heating element disposed between the uniform heating plate body and the covering layer; and an electrical connection element detachably connected to the heating element via magnetic attraction and configured to connect to an external power source and supply power to the heating element. With such a simple structure, portable thermal printing operations can be achieved.