Patent classifications
B41J2/34
Thermal printhead and method of manufacturing the same
A thermal printhead includes a substrate, a protrusion formed on an obverse surface of the substrate and extending in a main scanning direction, a heat storage layer formed on a top surface of the protrusion, and a plurality of heat-generating parts arranged along the main scanning direction on the heat storage layer. The substrate and the protrusion are integrally formed from a single-crystal semiconductor.
METHOD FOR MANUFACTURING THERMAL PRINT HEADS
The present invention provides a method for manufacturing thermal print heads. By forming a molybdenum antioxidation layer on the electrode pattern layer, the oxidation or erosion phenomena on the electrode pattern layer (formed by aluminum or aluminum-copper alloy) in the manufacturing process can be prevented, and hence improving the reliability and lifetime of thermal print heads.
METHOD FOR MANUFACTURING THERMAL PRINT HEADS
The present invention provides a method for manufacturing thermal print heads. By forming a molybdenum antioxidation layer on the electrode pattern layer, the oxidation or erosion phenomena on the electrode pattern layer (formed by aluminum or aluminum-copper alloy) in the manufacturing process can be prevented, and hence improving the reliability and lifetime of thermal print heads.
Method and apparatus for protecting a print head in a thermal printer
The method and apparatus for protecting the printhead heating elements in a thermal printer includes preparing the printer for label dispensing and then covering the printhead heating elements such that the label run or thermal material passing over the same does not contact the printhead heating elements. The cover for the printhead heating elements can take various forms. In one implementation, the cover is a sleeve configured to fit over the entire printhead assembly of the thermal printer. In another implementation, the cover is a shim placed between the printhead and a label run path. The printhead cover has a low coefficient of friction.
THERMAL PRINT HEAD
The present invention provides a thermal print head capable of better performing printing on a printing medium.
The thermal print head includes: a substrate (1), formed with single crystal semiconductor; a resistor layer (4), including a plurality of heating portions (41) arranged in a main scan direction; and a wiring layer (3), configuring a charging path to the plurality of heating portions. The substrate includes: a main surface (11), being a surface opposite to the resistor layer; and a convex portion (13), disposed as protruding from the main surface and extending in the main scan direction. The convex portion includes: an inclining surface (132), inclining relative to the main surface and extending in a linear manner when viewing from the main scan direction; and a curving surface (131), disposed, in a protruding direction of the convex portion, on a position farther away from the main surface than the inclining surface, and curving in a manner that protrudes toward the protruding direction. Each of the plurality of heating portions includes a heating curving portion (411) formed on a portion corresponding to the curving surface.
THERMAL PRINTHEAD AND METHOD OF MANUFACTURING THE SAME
A thermal printhead includes a substrate, a protrusion formed on an obverse surface of the substrate and extending in a main scanning direction, a heat storage layer formed on a top surface of the protrusion, and a plurality of heat-generating parts arranged along the main scanning direction on the heat storage layer. The substrate and the protrusion are integrally formed from a single-crystal semiconductor.
THERMAL PRINTHEAD AND METHOD OF MANUFACTURING THE SAME
A thermal printhead includes a substrate, a protrusion formed on an obverse surface of the substrate and extending in a main scanning direction, a heat storage layer formed on a top surface of the protrusion, and a plurality of heat-generating parts arranged along the main scanning direction on the heat storage layer. The substrate and the protrusion are integrally formed from a single-crystal semiconductor.
THERMAL PRINT HEAD AND METHOD OF MANUFACTURING THE SAME
A thermal print head includes a substrate; a protrusion formed on an obverse surface of the substrate and extending in a main scanning direction; heat generating parts disposed on a top surface of the protrusion and arranged along the main scanning direction; and columnar heat storage members embedded in the protrusion and disposed in a given area having a width in a sub-scanning direction and being elongated in the main scanning direction. Each of the columnar heat storage members is elongated in a thickness direction of the substrate and has an upper end and a lower end, with the upper end being disposed at the same level of the top surface of the protrusion.
THERMAL PRINT HEAD AND METHOD OF MANUFACTURING THE SAME
A thermal print head includes a substrate; a protrusion formed on an obverse surface of the substrate and extending in a main scanning direction; heat generating parts disposed on a top surface of the protrusion and arranged along the main scanning direction; and columnar heat storage members embedded in the protrusion and disposed in a given area having a width in a sub-scanning direction and being elongated in the main scanning direction. Each of the columnar heat storage members is elongated in a thickness direction of the substrate and has an upper end and a lower end, with the upper end being disposed at the same level of the top surface of the protrusion.
THERMAL PRINTHEAD
A thermal printhead includes a substrate having an obverse surface, a projection formed on the obverse surface and extending in a primary scanning direction, a plurality of heating elements arranged in the primary scanning direction on the top of the projection, a groove dented from the top of the projection and extending in the primary scanning direction, and a heat storage member filling at least an opening of the groove.