A thermal print head includes a semiconductor substrate, a resistor layer and a wiring layer. The resistor layer is formed on the semiconductor substrate and has a plurality of heat generating portions arranged in the main scanning direction. The wiring layer is formed on the semiconductor substrate to be included in a conduction path for energizing the plurality of heat generating portions. The conduction path includes a path or paths provided by the semiconductor substrate itself.

A semiconductor component is used which has a semiconductor substrate, a transistor arranged on the semiconductor substrate, and connected with a first terminal with a first potential, an anti-fuse element connected between a second terminal with a second potential different from the first potential and the transistor, and a noise detection circuit electrically connected with respect to the second terminal, and for detecting a noise and outputting a detection signal. The transistor is to be turned off on the basis of the detection signal outputted from the noise detection circuit.

A semiconductor component is used which has a semiconductor substrate, a transistor arranged on the semiconductor substrate, and connected with a first terminal with a first potential, an anti-fuse element connected between a second terminal with a second potential different from the first potential and the transistor, and a noise detection circuit electrically connected with respect to the second terminal, and for detecting a noise and outputting a detection signal. The transistor is to be turned off on the basis of the detection signal outputted from the noise detection circuit.