Products, such as branding labels and currency, fabricated to include an optical security element. The optical security assembly may include a carrier film or substrate. An image element, e.g., a printed ink layer, is provided on a first surface of the carrier film/substrate, and the optical security assembly further includes an array or plurality of micro lenses on a second surface of the carrier film/substrate opposite the image element. In order to make the registration and print requirements easier, a mask is provided between the printed ink layer to define color pixels, and the printed ink layer is provided in the form of color blocks in a checkboard pattern with each block aligned with a portion of the mask and a subset of the holes or openings that define the viewable color pixels.

A semiconductor chip includes a plurality of superposed semiconductor levels. The semiconductor levels include a plurality of elementary circuits coupled to a common input node. Sensing circuits are coupled to elementary elements of different levels. The outputs of the sensing circuits are used to generate a number, which serves as an identification number of the semiconductor chip.

A semiconductor chip includes a plurality of superposed semiconductor levels. The semiconductor levels include a plurality of elementary circuits coupled to a common input node. Sensing circuits are coupled to elementary elements of different levels. The outputs of the sensing circuits are used to generate a number, which serves as an identification number of the semiconductor chip.

A hybrid security device for security documents and the like, with the microstructure for a first optically variable device (OVD) and the microstructure for a second OVD mutually interlace or interspersed. The first microstructure has a height profile that differs from that of the second microstructure by more than 0.5 microns. Suitable fabrication processes for the hybrid security device are also disclosed.

A hybrid security device for security documents and the like, with the microstructure for a first optically variable device (OVD) and the microstructure for a second OVD mutually interlace or interspersed. The first microstructure has a height profile that differs from that of the second microstructure by more than 0.5 microns. Suitable fabrication processes for the hybrid security device are also disclosed.

The invention relates to a method for producing a multilayer body (100, 200, 300, 400), as well as a multilayer body (100, 200, 300, 400) produced thereby. A single- or multi-layered first decorative ply (3) is applied to a carrier ply with a first (11) and a second (12) side. A metal layer (5) is applied to the side of the first decorative ply (3) facing away from the carrier ply and structured such that the metal layer (5) is provided with a first layer thickness in one or more first zones (8) and is provided with a second layer thickness different from the first layer thickness in one or more second zones (9), wherein in particular the second layer thickness is equal to zero. A single- or multi-layered second decorative ply (7) is applied to the side of the metal layer (5) facing away from the first decorative ply (3) and structured using the metal layer (5) as mask such that the first (3) or second (7) decorative ply is at least partially removed in the first (8) or second (9) zones.

The invention relates to a method for producing a multilayer body (100, 200, 300, 400), as well as a multilayer body (100, 200, 300, 400) produced thereby. A single- or multi-layered first decorative ply (3) is applied to a carrier ply with a first (11) and a second (12) side. A metal layer (5) is applied to the side of the first decorative ply (3) facing away from the carrier ply and structured such that the metal layer (5) is provided with a first layer thickness in one or more first zones (8) and is provided with a second layer thickness different from the first layer thickness in one or more second zones (9), wherein in particular the second layer thickness is equal to zero. A single- or multi-layered second decorative ply (7) is applied to the side of the metal layer (5) facing away from the first decorative ply (3) and structured using the metal layer (5) as mask such that the first (3) or second (7) decorative ply is at least partially removed in the first (8) or second (9) zones.

A semiconductor chip includes a plurality of superposed semiconductor levels. The semiconductor levels include a plurality of elementary circuits coupled to a common input node. Sensing circuits are coupled to elementary elements of different levels. The outputs of the sensing circuits are used to generate a number, which serves as an identification number of the semiconductor chip.

A semiconductor chip includes a plurality of superposed semiconductor levels. The semiconductor levels include a plurality of elementary circuits coupled to a common input node. Sensing circuits are coupled to elementary elements of different levels. The outputs of the sensing circuits are used to generate a number, which serves as an identification number of the semiconductor chip.

The invention relates to the field of the protection of security documents such as for example banknotes and identity documents against counterfeit and illegal reproduction. In particular, the invention relates to processes for producing optical effect layers (OELs) comprising a motif made of at least two areas made of a single hardened layer on a substrate comprising a photomask.