B42D25/445

Security structure
10583682 · 2020-03-10 · ·

The present disclosure relates to a security structure including a non-opaque, preferably transparent, substrate. The substrate supports metal elements forming a revealing pattern. The metal is thin enough for the metal to be non-opaque. A lacquer is placed at least partially, preferably exactly, on top of the metal elements. The lacquer may be in contact with the metal elements.

LAMINATE COMPRISING A RELIEF STRUCTURE FORMING LAYER AND A MANUFACTURING METHOD FOR SAME
20200070467 · 2020-03-05 ·

This invention aims to provide a novel laminate in which a first layer is formed with high positional accuracy, and to provide a manufacturing method thereof. In the laminate of this invention, a relief structure forming layer includes a first region having an indented structure extending in a first direction or a direction tilted by an angle within 10 degrees to the left or right from the first direction in a plan view, and a second region including an indented structure extending in a second direction orthogonal to the first direction or a direction tilted by an angle within 65 degrees to the left or right from the second direction in a plan view. The first layer contains a first material which is different from a material of the relief structure forming layer, and has a surface shape corresponding to that of the relief structure forming layer.

LAMINATE COMPRISING A RELIEF STRUCTURE FORMING LAYER AND A MANUFACTURING METHOD FOR SAME
20200070467 · 2020-03-05 ·

This invention aims to provide a novel laminate in which a first layer is formed with high positional accuracy, and to provide a manufacturing method thereof. In the laminate of this invention, a relief structure forming layer includes a first region having an indented structure extending in a first direction or a direction tilted by an angle within 10 degrees to the left or right from the first direction in a plan view, and a second region including an indented structure extending in a second direction orthogonal to the first direction or a direction tilted by an angle within 65 degrees to the left or right from the second direction in a plan view. The first layer contains a first material which is different from a material of the relief structure forming layer, and has a surface shape corresponding to that of the relief structure forming layer.

DOUBLE METAL SECURITY ELEMENT HAVING TRANSPARENT PATTERN
20200016919 · 2020-01-16 ·

A security element includes comprises a transparent film, a first layer and a second layer. The first layer includes a first metal arranged on the transparent film in a first pattern. The second layer includes a second metal being a baser metal than the first metal arranged over the first layer in a second pattern. Each of the first and second patterns is composed of metallic regions and metal-free regions. The metal-free regions of the second pattern overlap with the metal-free regions of the first pattern. The metallic regions of the first pattern overlap with the metal-free regions of the second pattern.

DOUBLE METAL SECURITY ELEMENT HAVING TRANSPARENT PATTERN
20200016919 · 2020-01-16 ·

A security element includes comprises a transparent film, a first layer and a second layer. The first layer includes a first metal arranged on the transparent film in a first pattern. The second layer includes a second metal being a baser metal than the first metal arranged over the first layer in a second pattern. Each of the first and second patterns is composed of metallic regions and metal-free regions. The metal-free regions of the second pattern overlap with the metal-free regions of the first pattern. The metallic regions of the first pattern overlap with the metal-free regions of the second pattern.

Laminate comprising a relief structure forming layer and a manufacturing method for same
10518500 · 2019-12-31 · ·

A laminate in which a first layer is formed with high positional accuracy, and a manufacturing method thereof is provided. In the laminate of this invention, a relief structure forming layer includes a first region having an indented structure extending in a first direction or a direction tilted by an angle within 10 degrees to the left or right from the first direction in a plan view, and a second region including an indented structure extending in a second direction orthogonal to the first direction or a direction tilted by an angle within 65 degrees to the left or right from the second direction in a plan view. The first layer contains a first material which is different from a material of the relief structure forming layer, and has a surface shape corresponding to that of the relief structure forming layer.

Laminate comprising a relief structure forming layer and a manufacturing method for same
10518500 · 2019-12-31 · ·

A laminate in which a first layer is formed with high positional accuracy, and a manufacturing method thereof is provided. In the laminate of this invention, a relief structure forming layer includes a first region having an indented structure extending in a first direction or a direction tilted by an angle within 10 degrees to the left or right from the first direction in a plan view, and a second region including an indented structure extending in a second direction orthogonal to the first direction or a direction tilted by an angle within 65 degrees to the left or right from the second direction in a plan view. The first layer contains a first material which is different from a material of the relief structure forming layer, and has a surface shape corresponding to that of the relief structure forming layer.

MASK EXPOSURE METHOD, TRANSPARENT CONDUCTIVE METALLIZATION AND PIGMENT
20240042788 · 2024-02-08 ·

The invention relates to a mask exposure method comprising the following steps:the providing of a carrier substrate; the print application of a radiation-crosslinkable washable dye layer to the full area of the carrier substrate;the exposure of the radiation-crosslinkable washable dye layer in defined regions to radiation by means of a radiation mask, such that the washable dye is cured in the defined regions;the applying of a metallization over the full area;the removing of the non-radiation-exposed washable dye outside the defined regions together with the metal present thereon with the aid of a solvent, such that the resultant carrier substrate has cured washable dye with metal applied thereto only in defined regions.

MASK EXPOSURE METHOD, TRANSPARENT CONDUCTIVE METALLIZATION AND PIGMENT
20240042788 · 2024-02-08 ·

The invention relates to a mask exposure method comprising the following steps:the providing of a carrier substrate; the print application of a radiation-crosslinkable washable dye layer to the full area of the carrier substrate;the exposure of the radiation-crosslinkable washable dye layer in defined regions to radiation by means of a radiation mask, such that the washable dye is cured in the defined regions;the applying of a metallization over the full area;the removing of the non-radiation-exposed washable dye outside the defined regions together with the metal present thereon with the aid of a solvent, such that the resultant carrier substrate has cured washable dye with metal applied thereto only in defined regions.

SYSTEMS AND METHODS FOR THE GENERATION AND USAGE OF AUTHENTICATION IMAGES IN CONJUNCTION WITH LOW-RESOLUTION PRINT DEVICES

Systems and methods applicable, for instance, to the generation and usage of authentication images. In one aspect, unauthorized attempts to duplicate authentication images can be thwarted. In another aspect, there can be provision for authorized authentication image generation using low-resolution print devices.