A system is configured to shield an interior chamber of a structure. The system may include a power source, an outer shield assembly operatively connected to the power source and coupled to an outer wall of the structure, and an inner shield assembly surrounding the internal chamber. The outer shield assembly generates a magnetic field through and around the structure. The inner shield assembly deflects radiation particles away from the interior chamber and re-directs portions of the magnetic field around the interior chamber.

Spacecraft materials comprising a polymer and a shielding material are described. The spacecraft material may form a radiation shield, to shield a spacecraft from cosmic rays. In certain configurations, the spacecraft material may be poured onto, and cured, directly on the individual components of the spacecraft to form a radiation shield.

In some aspects, this disclosure relates to improved Z-grade materials, such as those used for shielding, systems incorporating such materials, and processes for making such Z-grade materials. In some examples, the Z-grade material includes a diffusion zone including mixed metallic alloy material with both a high atomic number material and a lower atomic number material. In certain examples, a process for making Z-grade material includes combining a high atomic number material and a low atomic number material, and bonding the high atomic number material and the low atomic number together using diffusion bonding. The processes may include vacuum pressing material at an elevated temperature, such as a temperature near a softening or melting point of the low atomic number material. In another aspect, systems such as a vault or an electronic enclosure are disclosed, where one or more surfaces of Z-grade material make up part or all of the vault/enclosure.

A semiconductor integrated circuit, a radiation detection unit and a cooling unit are provided. Here, a radiation detection unit is provided near the semiconductor integrated circuit and detects a radiation quantity. The cooling unit cools the semiconductor integrated circuit according to the detected radiation quantity. In an environment where a radiation quantity is more, the generation of a malfunction can be restrained by cooling the semiconductor integrated circuit.

An alternating current to direct current (AC to DC) power converter assembly that converts a plurality of low voltage alternating current (AC) inputs into a high voltage DC power output. The converter includes two or more AC to DC power converters, each of the two or more AC to DC power converters including: a low power AC power input configured to receive an AC input from a low power AC power source; and a low power DC power output. The converter also includes two or more isolated DC to DC power converters, each DC to DC power converter electrically coupled at least one of the AC to DC power converters, wherein each DC to DC power converter includes an output and wherein each of the DC to DC power converters are connected in series to produce the high power DC power output.

A control device includes a computation section that computes information related to an effect of radiation received by a rover based on error information of a processing device provided to the rover, and a control section that performs control so as to reduce the effect of radiation received by the rover based on the information related to an effect of radiation computed by the computation section.

Disclosed is a micrometeoroid and debris protection system (MDPS) for a thermal control system on a spacecraft. The MDPS comprises a radiator face-sheet, a truss attached to the radiator face-sheet, and a thermally transparent bumper disposed on the truss. The thermally transparent bumper shields the radiator face-sheet from micrometeoroids and debris and enables thermal transfer from the radiator face-sheet through the thermally transparent bumper.

A ruggedizing apparatus for electronic equipment in a spacecraft is provided that can achieve both a radiation shielding effect and a heat-dissipation effect. The ruggedizing apparatus includes: a pressure vessel that is filled with a coolant and places at least a heat-generating electronic circuit of the electronic equipment within the pressure vessel, wherein the heat-generating electronic circuit is immersed in the coolant; and a forced liquid-flow generator placed within the pressure vessel, wherein the forced liquid-flow generator causes the coolant on the heat-generating electronic circuit to move away from the heat-generating electronic circuit.

A control system for an aerospace vehicle includes a voter and a plurality of control blocks. Each control block includes: a controller configured to receive an input signal and perform a control algorithm that includes an integral function on the input signal to provide an output signal; and a feedback controller that is configured to: receive the output signal from the controller, a reference signal from an external controller, and a plant feedback signal from an external plant; perform a feedback algorithm on the output signal to provide an feedback control signal; and perform a combinator algorithm using the reference signal, the plant feedback signal and the feedback control signal to provide the input signal to the controller; wherein the voter is configured to receive the output signals and perform a voting algorithm on the output signals to determine a control signal to provide to the external plant.

A radiation shielding assembly for an electronic component is provided. The assembly includes a printed wiring board and a radiation shield having first and second covers on the printed wiring board. The first cover has first cover walls and the second cover has second cover walls. The first cover walls define a housing and have first cover cavities. The second cover walls have second cover thru passages. The assembly has the electronic component disposed on the printed wiring board and within the housing. The electronic component has a perimeter on the printed wiring board where the printed wiring board has passages at the electronic component perimeter. The first walls are located at the electronic component perimeter to enclose the electronic component.