Provided are a blister package and a method of making thereof. The blister package includes a rupturable substrate; and a blister layer overlayed by the substrate, thereby making a cavity between the rupturable substate and the blister layer. The rupturable substrate at least partially forms an engraving or etching that reduces push through force required for dispensing a product stored inside the cavity for customer dispensing. The rupturable substate and the blister layer are made of the same or same class plastic or polymer thereby making the blister package recyclable.