A blister pack formed by a blister board folio having a fold line dividing the folio into a first half with a first interior and a first exterior and a second half with a second interior and a second exterior. A blister coating extends around the perimeter of the folio and a series of glue dots are positioned on the interior sections. The blister coating defines a central region within the perimeter of the folio and the one glue dots are positioned adjacently to the blister coating. The fold line and the glue dots form a pocket for the insertion of a product. The folio may then be heat sealed to secure the product in the pocket.