There is provided a conveying device that reliably discharges only scrap when simultaneously conveying the scrap and a pressed product without sacrificing cycle time. A conveying device for use in press forming includes: a conveying part that holds a product part and a scrap part of a workpiece after a cutting process, and conveys the product part and the scrap part to a next process; a nozzle part that is provided in the conveying part, and discharges compressed fluid toward the scrap part; and a controller that performs a control to release holding of the scrap part during conveyance of the workpiece and to blow compressed fluid toward the scrap part.

An apparatus for unstacking plate-like parts with at least one supply station, in which at least one part stack of plate-like parts is located and with an unstacking device which is assigned to the supply station and is for the singularised unstacking of the part stack and for bringing an unstacked part along a run-through direction onto a function station which is arranged downstream. The unstacking device includes a carrier device with at least one runner rail which is aligned along the run-through direction and on which an unstacking slide is movably guided in the run-through direction between the supply station and the function station. The unstacking slide includes a carrier structure on which several gripping units are arranged. The gripping units each include at least one gripping head which can be moved in the height direction for lifting the parts out of the part stack.

A produce packing robot is provided comprising a plurality of heads for picking up items of produce from a plurality of pick-up locations, and moving the items of produce and dropping them off at a plurality of drop-off locations. The plurality of heads move together in a first direction on a common rail. The robot may also comprise a range imaging camera and controller for sensing the location of the drop-off points dynamically.

A feeding unit to feed a component in an automatic manufacturing machine, which has at least one holding head designed to receive and hold the component; a conveyor to cyclically move the holding head along an application path; and a rotation station arranged along the feeding path and in which the holding head rotates relative to the equipment and around a rotation axis to vary the orientation of the component. The conveyor has a closed curve guide arranged in a fixed position along the application path; and an equipment supporting the holding head and provided with at least one slide coupled to the guide so as to freely slide along the guide. An actuation system controls rotation of the holding head around the first rotation axis and has a cam and a cam follower roller, which can be coupled to the cam and mechanically connected to the holding head.

A robot is provided, which includes a base, a first robot fixed to the base at a base end thereof, and a second robot fixed to the base at a base end thereof. The first robot has a first robotic arm and a first robot hand attached to a tip end of the first robotic arm. The second robot has a second robotic arm and a second robot hand attached to a tip end of the second robotic arm. The first robot hand includes a conveyor, and the second robot hand includes a holding part configured to hold a workpiece. The second robot places the workpiece held by the holding part on a transferring surface of the conveyor of the first robot and releases the workpiece.

The present disclosure provides an apparatus and method for positioning an object. The apparatus can include gripping elements or arms to grip the object and actuators to move the object. Methods for positioning the object can include rotating the object about a first and second axis to achieve the desired position.

A wafer separating apparatus is provided which includes a wafer supporting member having an upper surface on which a bonded wafer formed of two wafers bonded with each other is placed; an arm portion arranged outside of the wafer supporting member, the arm portion being movable closer to and away from a bonded portion of the bonded portion of the bonded wafer supported by the supporting portion; and an inflating portion provided in an distal end portion of the arm portion, the inflating portion being inflatable in a direction intersecting the upper surface of the wafer supporting member.

A variable pitch device includes a body, a drive unit fixed to the body, a plurality of movable fingers disposed movably along a longitudinal direction of the body, and a driving force transmission mechanism that transmits a driving force of the drive unit to the movable fingers. The driving force transmission mechanism is formed of a connecting block connected to an end block driven in a vertical direction, a cam plate accommodated in the body and connected to the connecting block, and four finger pins inserted through first to fourth cam grooves of the cam plate. The finger pins are disposed movably in the longitudinal direction along guide holes of the body and connected to the movable fingers.

Using a suction gripper cluster device is disclosed, including: causing airflows to be generated by a plurality of airflow generators of a respective plurality of suction gripper mechanisms included in a suction gripper cluster device comprising a plurality of suction gripper mechanisms, wherein the plurality of airflow generators is configured to cause the airflows to enter respective intake ports of the plurality of suction gripper mechanisms and exit respective outlet ports of the respective plurality of suction gripper mechanisms in response to receiving air at a respective air input port of the respective plurality of suction gripper mechanisms; causing a target object to be captured by the suction gripper cluster device using the airflows; activating a positioning actuator mechanism to position the suction gripper cluster device; and causing the target object to be ejected from the suction gripper cluster device.

A pick-and-place head for picking a plurality of work-pieces from at least one first location and for placing the plurality of work-pieces at least one second location is disclosed. The pick-and-place head exhibits a plurality of nozzles, wherein each nozzle is configured to engage one of the work-pieces by action of a vacuum. At least one nozzle has an individual vacuum supply and at least two further nozzles have a shared vacuum supply. A corresponding method is also disclosed, the method including the steps of approaching at least one of the plurality of work-pieces with a respective nozzle and then starting generation of a vacuum at each respective nozzle. The generation of vacuum in at least one nozzle is achieved by an individual vacuum supply, and generation of vacuum in at least two further nozzles is achieved by a shared vacuum supply of the at least two further nozzles.