A method, system, apparatus, and/or device to creating a set of miniaturized electrode pillars. The method, system, apparatus, and/or device may include patterning a set of miniaturized electrode pillars on a substrate and coating the set of miniaturized electrode pillars with an interstitial filler disposed between the set of miniaturized electrode pillars. The interstitial filler may insulate the set of miniaturized electrode pillars from each other and bolster the set of miniaturized electrode pillars.

A micro electro mechanical system (MEMS) includes a circuit substrate, a first MEMS structure disposed over the circuit substrate, and a second MEMS structure disposed over the first MEMS structure.

Method of manufacturing a micromechanical component intended to cooperate with another micromechanical component, the method comprising the steps of providing a substrate, forming a mould on said substrate, said mould defining sidewalls arranged to delimit said micromechanical component, providing particles on at least said sidewalls, depositing a metal in said mould so as to form said micromechanical component, and liberating said micromechanical component from said mould and removing said particles.

In a thin film electrode separation method using thermal expansion coefficient, a first solution is coated on a substrate. The first solution coated on the substrate is hardened. The substrate is left in a predetermined time, to form a first thin film having a first thermal expansion coefficient on the substrate. A photoresist is coated on the substrate having the thin film formed thereon. The photoresist coated on the substrate is hardened, to form a photoresist film having a second thermal expansion coefficient. A metal and a passivation layer are formed on the photoresist film. The photoresist film is detached from the first thin film, using difference of a thermal expansion coefficient between the photoresist film and the first thin film.

A method for manufacturing a MEMS element, including the following: forming a least one stationary weight element and at least one moving weight element in the MEMS element, and positioning at least one fixing element at the stationary weight element and at the moving weight element, the fixing element being formed so as to be able to be severed.

Methods and apparatus for subtractively fabricating three-dimensional structures relative to a surface of a substrate and for additively depositing metal and dopant atoms onto the surface and for diffusing them into the bulk. A chemical solution is applied to the surface of the semiconductor substrate, and a spatial pattern of electron-hole pairs is generated by projecting a spatial pattern of illumination characterized by a specified intensity, wavelength and duration at each pixel of a plurality of pixels on the surface. Charge carriers are driven away from the surface of the semiconductor on a timescale short compared to the carrier recombination lifetime. Such methods are applied to creating a spatially varying doping profile in the semiconductor substrate, a photonic integrated circuit and an integrated photonic microfluidic circuit.

A robust and general fabrication/manufacturing method is described herein for the fabrication of periodic three-dimensional (3D) hierarchical nanostructures in a highly scalable and tunable manner. This nanofabrication technique exploits the selected and repeated etching of spherical particles that serve as resist material and that can be shaped in parallel for each processing step. The method enables the fabrication of periodic, vertically aligned nanotubes at the wafer scale with nanometer-scale control in three dimensions including outer/inner diameters, heights/hole-depths, and pitches. The method was utilized to construct 3D periodic hierarchical hybrid silicon and hybrid nanostructures such as multi-level solid/hollow nanotowers where the height and diameter of each level of each structure can be configured precisely as well as 3D concentric plasmonic supported metal nanodisk/nanorings with tunable optical properties on a variety of substrates.

In one embodiment of the present invention, an electronic device includes a first emitter/collector region and a second emitter/collector region disposed in a substrate. The first emitter/collector region has a first edge/tip, and the second emitter/collector region has a second edge/tip. A gap separates the first edge/tip from the second edge/tip. The first emitter/collector region, the second emitter/collector region, and the gap form a field emission device.

Method of manufacturing a micromechanical component intended to cooperate with another micromechanical component, the method comprising the steps of providing a substrate, forming a mould on said substrate, said mould defining sidewalls arranged to delimit said micromechanical component, providing particles on at least said sidewalls, depositing a metal in said mould so as to form said micromechanical component, and liberating said micromechanical component from said mould and removing said particles.

A micro electro mechanical system (MEMS) includes a circuit substrate, a first MEMS structure disposed over the circuit substrate, and a second MEMS structure disposed over the first MEMS structure.