Patent classifications
B81C2201/0105
ULTRASONIC TRANSDUCER, MANUFACTURING METHOD THEREOF, AND ULTRASONIC IMAGING DEVICE
A highly-sensitive ultrasonic transducer with good yield is provided. The ultrasonic transducer includes a cavity layer, a pair of electrodes positioned above and below the cavity layer, insulating layers disposed above and below each of the pair of electrodes, and a filled hole that penetrates, in a vertical direction, at least a portion of the insulating layers positioned above the cavity layer. When the ultrasonic transducer is viewed from above, each electrode of the pair of electrodes includes, at a position that overlaps the embedded hole, a non-electrode region where the electrodes are not formed.
MICRO CHECK VALVE AND SYSTEM WITH MULTIPLE MICRO CHECK VALVES AND METHOD FOR THE PRODUCTION THEREOF
The invention concerns a micro check valve (10) comprising a substrate body (12) having a top side (16) and an underside (14), wherein at least the top side (16) has a sealing bar (34) between a first trough (30) and a second trough (32). The substrate body (12) also has a passage (24) which leads from the underside (14) of the substrate body (12) to the top side (16) of the substrate body (12) and ends on the top side (16) of the substrate body (12) in the first trough (30). In addition arranged on the top side (16) of the substrate body (12) is a diaphragm (18) which is mounted flexibly at least in the region of the sealing bar (34) and the first and second troughs (30, 32). The diaphragm (18) also has at least one through opening (42) arranged above the second trough (32).
The invention further concerns a system having a plurality of micro check valves (10) and a method for the production thereof.
METHODS OF SEPARATING GOOD PROBE STRUCTURES FROM DEFECTIVE PROBE STRUCTURES IN AN ELECTROCHEMICAL FABRICATION SYSTEM
Electronic test probes formed in a batch have a plurality of multi-material layers wherein at least one of the materials is a sacrificial material and at least one other material is a structural material. Successfully formed or good test probes are separated from unsuccessfully formed or bad test probes
ACOUSTIC DEVICE AND METHOD OF FORMING THE SAME
Various embodiments may provide an acoustic device. The acoustic device may include a substrate, an electrically conductive first membrane, a first spacer holding the first membrane to form a first acoustic chamber between the substrate and the first membrane. The acoustic device may additionally include an electrically conductive second membrane, a second spacer holding the second membrane to form a second acoustic chamber between the first membrane and the second membrane, and a plurality of electrical pads in electrical connection with the first membrane and the second membrane.
MEMS DEVICES AND PROCESSES
The application describes MEMS devices and associated methods of fabrication. The MEMS devices comprise a filter configured and arranged to inhibit the entry of particles into at least a region of the interior of the substrate cavity from a region underlying the substrate.
Piezoelectric acoustic MEMS transducer and fabrication method thereof
A piezoelectric MEMS transducer formed in a body of semiconductor material, which has a central axis and a peripheral area and comprises a plurality of beams, transverse to the central axis and having a first end, coupled to the peripheral area of the body, and a second end, facing the central axis; a membrane, transverse to the central axis and arranged underneath the plurality of beams; and a pillar, parallel to the central axis and rigid with the second end of the beams and to the membrane. The MEMS transducer further comprises a plurality of piezoelectric sensing elements arranged on the plurality of beams.
MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) THERMAL SENSOR
The structure of a micro-electro-mechanical system (MEMS) thermal sensor and a method of fabricating the MEMS thermal sensor are disclosed. A method of fabricating a MEMS thermal sensor includes forming first and second sensing electrodes with first and second electrode fingers, respectively, on a substrate and forming a patterned layer with a rectangular cross-section between a pair of the first electrode fingers. The first and second electrode fingers are formed in an interdigitated configuration and suspended above the substrate. The method further includes modifying the patterned layer to have a curved cross-section between the pair of the first electrode fingers, forming a curved sensing element on the modified patterned layer to couple to the pair of the first electrodes, and removing the modified patterned layer.
MEMS MICROPHONE AND METHOD OF MANUFACTURING THE SAME
A MEMS microphone includes a substrate defining a cavity, a diaphragm being spaced apart from the substrate, covering the cavity, and configured to generate a displacement of the diaphragm in response to an applied acoustic pressure, an anchor extending from an end portion of the diaphragm, and fixed to an upper surface of the substrate to support the diaphragm and a back plate disposed over the diaphragm, the back plate being spaced apart from the diaphragm such that an air gap is maintained between the back plate and the diaphragm, and defining a plurality of acoustic holes, wherein the anchor has a repetitive concave-convex shape in a direction toward a center of the diaphragm so that the anchor acts as a resistance to an acoustic wave.
MEMS device, manufacturing method of the same, and integrated MEMS module using the same
A MEMS device is provided. The MEMS device includes a substrate having at least one contact, a first dielectric layer disposed on the substrate, at least one metal layer disposed on the first dielectric layer, a second dielectric layer disposed on the first dielectric layer and the metal layer and having a recess structure, and a structure layer disposed on the second dielectric layer and having an opening. The opening is disposed on and corresponds to the recess structure, and the cross-sectional area at the bottom of the opening is smaller than the cross-sectional area at the top of the recess structure. The MEMS device also includes a sealing layer, and at least a portion of the sealing layer is disposed in the opening and the recess structure. The second dielectric layer, the structure layer, and the sealing layer define a chamber.
Curved cantilever design to reduce stress in MEMS actuator
The present disclosure relates to an integrated chip structure including a MEMS actuator. The MEMS actuator includes an anchor having a first plurality of branches extending outward from a central region of the anchor. The first plurality of branches respectively include a first plurality of fingers. A proof mass surrounds the anchor and includes a second plurality of branches extending inward from an interior sidewall of the proof mass. The second plurality of branches respectively include a second plurality of fingers interleaved with the first plurality of fingers as viewed in a top-view. One or more curved cantilevers are coupled between the proof mass and a frame wrapping around the proof mass. The one or more curved cantilevers have curved outer surfaces having one or more inflection points as viewed in the top-view.