A micro-electro-mechanical device formed in a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region above the first buried cavity; and a second buried cavity extending in the sensitive region. A decoupling trench extends from a first face of the monolithic body as far as the first buried cavity and laterally surrounds the second buried cavity. The decoupling trench separates the sensitive region from a peripheral portion of the monolithic body.

A micro-electromechanical system (MEMS) structure is useful as an actuator for moving an image sensor for optical image stabilization. The MEMS actuator includes one or more micromechanical arm arrays. Each arm array includes a first array of spaced-apart fingers formed from a piezoelectric material, and a second array of spaced-apart fingers formed from an electrically conductive material. The distal ends of the first array of fingers and the distal ends of the second array of fingers are interposed between each other. Micro-springs connect the interposed distal ends of each set of adjacent fingers together. A metal cap is present above the distal ends of the first array of fingers and the distal ends of the second array of fingers. Micro-springs connect the metal cap to the distal end of each finger of the first array of fingers. This structure has increased stability and strength.

The present disclosure relates to a method of manufacturing a layered structure for a MEMS apparatus, a layered structure manufactured by the method, and a MEMS apparatus 200 (300, 400, 500) comprising the layered structure. For the layered structure, a high-temperature curing step is provided in the manufacturing process, for example, after structuring the functional layer 3. The structured regions and trenches of the functional layer 3 and in particular the spring structure formed in the functional layer 3 have smoothened side walls and/or rounded corners in regions 3a after the curing step, so that their fracture limits can thus be increased and early fractures of the functional layer 3 during operation of the MEMS apparatus 200 (300, 400, 500) can be avoided.