Patent classifications
B81C2201/0149
Nanostructured article
A nanostructured article having a first layer with a nanostructured surface is described. The nanostructured surface includes a plurality of pillars extending from a base surface of the first layer. The pillars have an average height greater than an average lateral dimension of the pillars. An average center-to-center spacing between pillars is no more than 2000 nm. The average lateral dimension is no less than 50 nm. Each pillar in the plurality of pillars has at least a lower portion and an upper portion where the lower portion is between the upper portion and the base surface, and the upper and lower portions have differing compositions. The nanostructured article includes a second layer disposed over the plurality of pillars and extending continuously to the base surface.
MIGRATION OF NANO METALS IN SEMISOLID AND SOLID MATRIX UNDER THE INFLUENCE OF SELECTIVELY TRIGGERED HETEROGENEOUS NUCLEATION AND GROWTH
Use of heterogeneous nucleation allows the localized reduction of metal salt and also cross-link the carbon precursor in the same region. This cross-linked matrix act as the secondary heterogeneous sites for spontaneous Nano particle synthesis and growth during the process of pyrolysis. Selectively creating heterogeneous sites and reducing the metal precursor using highly focused energy beams create various metal-carbon composites with controlled metal positioning. This is such a unique process where a pretreatment process will control the fabrication of complex metal-carbon composite nano and microstructures. This greatly simplifies the fabrication process, facilitating nanostructures like Nano metal bulbs, nanometal pointed nanogaps and metal sandwich structures with such process. With several advantages ranging from electronics, catalysis, optics and several other bio-functionalization technologies, this enables materials with unique and hybrid advantages. Moreover, fabrication of micro and Nano level structures provides a CMEMS and BIOMEMS relevant approach for wide range of applications.
METHODS OF FORMING STRUCTURES
A method of forming a structure comprises forming a pattern of self-assembled nucleic acids over a material. The pattern of self-assembled nucleic acids is exposed to at least one repair enzyme to repair defects in the pattern. The repaired pattern of self-assembled nucleic acids is transferred to the material to form features therein. A method of decreasing defect density in self-assembled nucleic acids is also disclosed. Self-assembled nucleic acids exhibiting an initial defect density are formed over at least a portion of a material and the self-assembled nucleic acids are exposed to at least one repair enzyme to repair defects in the self-assembled nucleic acids. Additional methods are also disclosed.
SELF-ASSEMBLY PATTERNING FOR FABRICATING THIN-FILM DEVICES
A method (200) for fabricating patterns on the surface of a layer of a device (100), the method comprising: providing at least one layer (130, 230); adding at least one alkali metal (235) comprising Cs and/or Rb; controlling the temperature (2300) of the at least one layer, thereby forming a plurality of self-assembled, regularly spaced, parallel lines of alkali compound embossings (1300, 1305) at the surface of the layer. The method further comprises forming cavities (236, 1300) by dissolving the alkali compound embossings. The method (200) is advantageous for nanopatterning of devices (100) without using templates and for the production of high efficiency optoelectronic thin-film devices (100).
MICRO-ASSEMBLER SYSTEM FOR CONTROLLING PLACEMENT OF MICRO-OBJECTS
Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause phototransistors or electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler.
Self-assembly patterning for fabricating thin-film devices
A method (200) for fabricating patterns on the surface of a layer of a device (100), the method comprising: providing at least one layer (130, 230); adding at least one alkali metal (235) comprising Cs and/or Rb; controlling the temperature (2300) of the at least one layer, thereby forming a plurality of self-assembled, regularly spaced, parallel lines of alkali compound embossings (1300, 1305) at the surface of the layer. The method further comprises forming cavities (236, 1300) by dissolving the alkali compound embossings. The method (200) is advantageous for nanopatterning of devices (100) without using templates and for the production of high efficiency optoelectronic thin-film devices (100).
Block copolymer
The present application provides a block copolymer and uses thereof. The block copolymer of the present application exhibits an excellent self-assembling property or phase separation property, can be provided with a variety of required functions without constraint and, especially, etching selectivity can be secured, making the block copolymer effectively applicable to such uses as pattern formation.
PATTERN-FORMING METHOD AND PATTERNED SUBSTRATE
A pattern-forming method includes forming a prepattern and including a first polymer is formed on a silicon-containing film on a substrate. An underlayer film including a second polymer is formed in recessed portions of the prepattern. A composition for directed self-assembled film formation including a third polymer is applied on the underlayer film and the prepattern. The first polymer includes a first structural unit. The second polymer includes: a molecular chain including the first structural unit and a second structural unit that differs from the first structural unit; and an end structure that bonds to one end of the molecular chain and includes at least one selected from the group consisting of an amino group, a hydroxy group and a carboxy group. The third polymer is a block copolymer including a block of the first structural unit and a block of the second structural unit.
Methods of forming structures
A method of forming a structure comprises forming a pattern of self-assembled nucleic acids over a material. The pattern of self-assembled nucleic acids is exposed to at least one repair enzyme to repair defects in the pattern. The repaired pattern of self-assembled nucleic acids is transferred to the material to form features therein. A method of decreasing defect density in self-assembled nucleic acids is also disclosed. Self-assembled nucleic acids exhibiting an initial defect density are formed over at least a portion of a material and the self-assembled nucleic acids are exposed to at least one repair enzyme to repair defects in the self-assembled nucleic acids. Additional methods are also disclosed.
UV-ASSISTED STRIPPING OF HARDENED PHOTORESIST TO CREATE CHEMICAL TEMPLATES FOR DIRECTED SELF-ASSEMBLY
A processing method is disclosed that enables an improved directed self-assembly (DSA) processing scheme by allowing the formation of improved guide strips in the DSA template that may enable the formation of sub-30 nm features on a substrate. The improved guide strips may be formed by improving the selectivity of wet chemical processing between different organic layers or films. In one embodiment, treating the organic layers with one or more wavelengths of ultraviolet light may improve selectivity. The first wavelength of UV light may be less than 200 nm and the second wavelength of UV light may be greater than 200 mn.