Three-dimensional polymeric article (100) having first (101) and second (102) opposed major surfaces, a first dimension perpendicular to a second dimension, a thickness orthogonal to the first and second dimensions, and a plurality of alternating first (107) and second (109) polymeric regions along the first or second dimensions, wherein the first (107) and second (108) regions extend at least partially across the second dimension, wherein the first regions (107) are in a common plane (115) and wherein some of the second regions (108) project outwardly from the plane (115) in a first direction (generally perpendicular from the plane), and some of the second regions (108) project outwardly from the plane (115) in a second direction that is generally 180 degrees from the first direction, where the first regions (107) have a first crosslink density, wherein the second regions (108) have a second crosslink density, and wherein the second crosslink density of the second regions (108) are less than the first crosslink density of the first regions (107). Embodiments of the articles are useful for example, for providing a dual-sided, textured wrapping film such that greater grip is realized both on an item wrapped by the film and the wrapped item itself.

Embodiments relate generally to systems, devices, and methods for depositing an electrode and an electrolyte on a microelectromechanical system (MEMS) electrochemical sensor. A method may comprise providing a blade on a surface of a substrate; providing a ridge along the perimeter of the substrate; pressing the electrode and the electrolyte onto the blade and the ridge; cutting the electrode into multiple electrodes; positioning the electrolyte to contact the surface, the blade, and the ridge; and positioning the multiple electrodes to contact the surface, the blade, and the ridge.

In accordance with an embodiment, a method producing a microelectromechanical system (MEMS) device includes: providing a substrate comprising a first substrate surface and an opposite second substrate surface, wherein the substrate comprises a sacrificial layer arranged at the first substrate surface; depositing a membrane material layer onto the sacrificial layer; the membrane material layer forms a free-standing membrane structure covering the cavity; and creating nanostructures in at least one of a first membrane surface or an opposite second membrane surface of the membrane material layer, wherein the nanostructures protrude from the respective membrane surface of the membrane material layer, and the nanostructures are created by applying a laser structuring process.

Three-dimensional polymeric article (100) having first (101) and second (102) opposed major surfaces, a first dimension perpendicular to a second dimension, a thickness orthogonal to the first and second dimensions, and a plurality of alternating first (107) and second (109) polymeric regions along the first or second dimensions, wherein the first (107) and second (108) regions extend at least partially across the second dimension, wherein the first regions (107) are in a common plane (115) and wherein some of the second regions (108) project outwardly from the plane (115) in a first direction (generally perpendicular from the plane), and some of the second regions (108) project outwardly from the plane (115) in a second direction that is generally 180 degrees from the first direction, where the first regions (107) have a first crosslink density, wherein the second regions (108) have a second crosslink density, and wherein the second crosslink density of the second regions (108) are less than the first crosslink density of the first regions (107). Embodiments of the articles are useful for example, for providing a dual-sided, textured wrapping film such that greater grip is realized both on an item wrapped by the film and the wrapped item itself.

The present disclosure provides a CMOS structure, including a substrate, a metallization layer over the substrate, a sensing structure over the metallization layer, and a signal transmitting structure adjacent to the sensing structure. The sensing structure includes an outgassing layer over the metallization layer, a patterned outgassing barrier over the outgassing layer; and an electrode over the patterned outgassing barrier. The signal transmitting structure electrically couples the electrode and the metallization layer.

The present disclosure provides a CMOS structure, including a substrate, a metallization layer over the substrate, a sensing structure over the metallization layer, and a signal transmitting structure adjacent to the sensing structure. The sensing structure includes an outgassing layer over the metallization layer, a patterned outgassing barrier over the outgassing layer; and an electrode over the patterned outgassing barrier. The signal transmitting structure electrically couples the electrode and the metallization layer.

A manufacturing method for a micromechanical window structure including the steps: providing a substrate, the substrate having a front side and a rear side; forming a first recess on the front side; forming a coating on the front side and on the first recess; and forming a second recess on the rear side, so that the coating is at least partially exposed, whereby a window is formed by the exposed area of the coatings.

An approach includes a method of fabricating a switch. The approach includes forming a fixed electrode, forming a first cantilevered electrode, forming a second cantilevered electrode aligned vertically over the first fixed electrode, and which has an end that overlaps and is operable to directly contact an end of the first cantilevered electrode upon an application of a voltage to the fixed electrode, and forming a hermetically sealed volume encapsulating the first fixed electrode, the second fixed electrode, the first cantilevered electrode, and the second cantilevered electrode.

An approach includes a method of fabricating a switch. The approach includes forming a first fixed electrode and a second fixed electrode, forming a first cantilevered electrode aligned vertically over the first fixed electrode, forming a second cantilevered electrode aligned vertically over the second fixed electrode, and which has an end that overlaps and is operable to directly contact an end of the first cantilevered electrode upon an application of a voltage to at least one of the first fixed electrode and the second fixed electrode, and forming a hermetically sealed volume encapsulating the first fixed electrode, the second fixed electrode, the first cantilevered electrode, and the second cantilevered electrode.

An approach includes a method of fabricating a switch. The approach includes forming a first fixed electrode and a second fixed electrode, forming a first cantilevered electrode aligned vertically over the first fixed electrode, forming a second cantilevered electrode aligned vertically over the first fixed electrode and which has an end that overlaps the first cantilevered electrode, forming a third cantilevered electrode aligned vertically over the second fixed electrode and operable to directly contact the first cantilevered electrode upon an application of a voltage to the second fixed electrode, and forming a hermetically sealed volume encapsulating the first fixed electrode, the second fixed electrode, the first cantilevered electrode, and the second cantilevered electrode.