A microchannel chip including a substrate, a partition layer formed on the substrate and defining a flow channel, and a cover member placed on the surface of the partition layer opposite to the surface in contact with the substrate. The cover member is formed from a resin material, and the resin material has a reduced modulus of 1.68 MPa or more and 44.3 MPa or less as measured by nanoindentation.

A device includes a substrate comprising a first standoff, a second standoff, a third standoff, a first cavity, a second cavity, and a bonding material covering a portion of the first, the second, and the third standoff. The first cavity is positioned between the first and the second standoffs, and the second cavity is positioned between the second and the third standoffs. The first cavity comprises a first cavity region and a second cavity region separated by a portion of the substrate extruding thereto, and wherein a depth associated with the first cavity region is greater than a depth associated with the second cavity. A surface of the first cavity is covered with a getter material.

A device includes a substrate comprising a first standoff, a second standoff, a third standoff, a first cavity, a second cavity, and a bonding material covering a portion of the first, the second, and the third standoff. The first cavity is positioned between the first and the second standoffs, and the second cavity is positioned between the second and the third standoffs. The first cavity comprises a first cavity region and a second cavity region separated by a portion of the substrate extruding thereto, and wherein a depth associated with the first cavity region is greater than a depth associated with the second cavity. A surface of the first cavity is covered with a getter material.

A method for attaching a bridging metal layer in supporting post via holes in an integrated circuit device is provided. The method include: (A) providing an integrated circuit wafer with a first coating layer as the outermost layer; (B) forming a sacrificial layer on the first coating layer and then forming a dielectric supporting layer on the sacrificial layer to obtain multiple supporting post via holes; (C) forming a bridging metal layer in the supporting post via holes and then forming a second coating layer; and (D) forming a connecting metal layer on the bridging metal layer and then forming a third coating layer on the bridging metal layer to obtain multiple supporting posts.

Disclosed herein is a MEMS sensor package that includes a substrate, an annular-shaped first dry film pattern stuck to one surface of the substrate, and a MEMS sensor chip including a tubular support and a detection part which is supported on the support so as to overlap a cavity of the support. The MEMS sensor chip is fixed to the substrate by sticking an annular mounting surface of the support to the first dry film pattern.