A device and method utilizes interconnecting layers separated by an insulating layer. A layered structure comprises a first and a second layer of electrically conductive material, and a third layer of electrically insulating material between them. A via trench is fabricated that extends from the second layer through the third layer into the first layer, a surface on the first layer of electrically conductive material forming a bottom surface of the via trench. An ink-jetting set-up for a mixture of liquid carrier and nanoparticles of conductive material is formed, and a specific process period is determined. Capillary flow of nanoparticles to peripheral edges of an ink-jetted blob of said mixture is induced. The mixture is ink-jetted into a blob on the via trench; the layered structure is heated to evaporate the liquid carrier. The interconnection element is higher at a certain point than between opposing side walls.

Embodiments of the present disclosure digital microfluidic arrays that may be fabricated by a printing method, whereby digital microfluidic electrodes arrays are printed, via a printing method such as inkjet printing, onto a suitable substrate. In some embodiments, a substrate and/or ink is prepared or modified to support the printing of electrode arrays, such as via changes to the surface energy. In some embodiments, porous and/or fibrous substrates are prepared by the addition of a barrier layer, or, for example, by the addition or infiltration of a suitable material to render the surface capable of supporting printed electrodes. Various example embodiments involving hybrid devices formed by the printing of digital microfluidic arrays onto a substrate having a hydrophilic layer are disclosed.