Patent classifications
B81C2201/0185
3D PRINTER, RESIN, AND INTERCONNECT
Custom 3d printer and resin for microfluidic flow channels and 3D printed high density, reversible, chip-to-chip microfluidic interconnects.
Optical Systems Fabricated by Printing-Based Assembly
Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.
3D printer, resin, and interconnect
Custom 3d printer and resin for microfluidic flow channels and 3D printed high density, reversible, chip-to-chip microfluidic interconnects.
A PRINTING METHOD OF MANUFACTURING NANOBEAM STRUCTURES
A method of manufacturing a nanobeam structure by printing, namely coaxial focused electrohydrodynamic jet printing. In this method, under the combined action of electric field, thermal field and flow field, a stable coaxial jet is formed and used to print linear bilayer encapsulated structure on a substrate with a prefabricated support structure. Within the coaxial jet, the nanoscale inner liquid consisting of functional material is encapsulated by the microscale outer liquid consisting of high viscous material, which has the capability to directly print functional nanobeam structures. This high viscous material eliminates the disturbance of external micro-environment, and plays a role of supporting the printed inner structure before complete solidification of the inner material. A nanobeam structure only consisting of inner function material is formed on the substrate when the outer high viscous encapsulated material is removed.
Transfer printing using shape memory polymers
A method of transfer printing comprises globally heating an array of stamps, where each stamp comprises a shape memory polymer with a light absorbing agent dispersed therein, and pressing the array of stamps to a donor substrate comprising a plurality of inks. Each stamp is thereby compressed from an undeformed adhesion-off configuration to a deformed adhesion-on configuration. The array of stamps is then cooled to rigidize the shape memory polymer and bind the plurality of inks to the stamps in the deformed adhesion-on configuration. The plurality of inks remain bound to the stamps while the array of stamps is positioned in proximity with a receiving substrate. A selected stamp in the array is then locally heated using a concentrated light source. The selected stamp returns to the undeformed adhesion-off configuration, and the ink bound to the selected stamp is released and transfer printed onto the receiving substrate.
Stretchable Form of Single Crystal Silicon for High Performance Electronics on Rubber Substrates
The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Stretchable semiconductors and electronic circuits of the present invention preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention may be adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.
METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS
The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
Optical systems fabricated by printing-based assembly
Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.
Flexible electrode and preparation method thereof
A method for preparing a flexible electrode is provided. The method comprises sequentially forming a flexible base layer and an intermediate conductive layer on a carrier plate; treating an elastomeric template having an electrode pattern with an acid, followed by transferring and printing the electrode pattern onto the intermediate conductive layer to form an electrode inducing layer; forming a titanium dioxide-polydopamine composite layer in a gap of the electrode inducing layer; forming a platinum electrode layer on the titanium dioxide-polydopamine composite layer; removing the carrier plate. The invention solves the problems of slow formation of a polydopamine film and slow formation of a platinum electrode layer. A flexible electrode is further provided.
SET-UP AND METHOD OF ELECTROHYDRODYNAMIC JET 3D PRINTING BASED ON RESULTANT EFFECT OF ELECTRIC FIELD AND THERMAL FIELD
The present invention belongs to the field of advanced manufacturing technology and relates to one set-up and method of electrohydrodynamic jet 3D printing based on resultant effect of electric field and thermal field. This method is used to fabricate micro/nano 3D structure, under the resultant effects of electro hydrodynamic force and thermal field. First of all, the ink reaches needle orifice at a constant speed under the resultant effect of fluid field and gravity field. Then a high voltage electric field is applied between needle and substrate. And the ink is dragged to form stable micro/nano scale jet which is far smaller than the needle size using the electric field shear force generated at needle orifice. The solvent evaporation rate of ink increases combined with the radiation of thermal field at the same time. Finally, the micro/nano scale 3D structure is fabricated on substrate with the accumulation of jet layer by layer. Compared with liquid jet printing technology, this method describing in present invention owns many advantages, including wide adaptability of material and manufacturing complex micro/nano scale 3D structures.