A physical quantity sensor includes a movable body, a support portion supporting the movable body through a connecting portion, and a substrate that is disposed so as to overlap the movable body in plan view and provided with a first fixed electrode and a second fixed electrode along a first direction orthogonal to a longitudinal direction of the connecting portion. In plan view, a dummy electrode that is disposed next to the first fixed electrode and is at the same potential as the movable body is provided on the substrate. The first fixed electrode and the dummy electrode includes a first electrode material layer provided on the substrate, and a second electrode material layer provided on the substrate and on the first electrode material layer. The second electrode material layer constituting the first fixed electrode and the second electrode material layer constituting the dummy electrode are provided between the first electrode material layer constituting the first fixed electrode and the first electrode material layer constituting the dummy electrode, in plan view. A distance between the second electrode material layer constituting the first fixed electrode and the second electrode material layer constituting the dummy electrode is smaller than a distance between the first electrode material layer constituting the first fixed electrode and the first electrode material layer constituting the dummy electrode, in plan view.

A method comprising: adhering a first surface of a mask to a carrier substrate via a first adhesive layer; forming a second adhesive layer on at least one of a second surface of the mask or a third surface of a wafer having a second alignment mark; bringing the carrier substrate and the wafer towards each other along a vertical axis such that the second surface of the mask and the third surface of the wafer is separated by an alignment gap based on a thickness of the second adhesive layer; performing an alignment operation based on imaging the first alignment mark and the second alignment mark; configuring the second surface of the mask to adhere to the third surface of the wafer via the second adhesive; and disconnecting the carrier substrate from the mask.

A method comprising: adhering a first surface of a mask to a carrier substrate via a first adhesive layer; forming a second adhesive layer on at least one of a second surface of the mask or a third surface of a wafer having a second alignment mark; bringing the carrier substrate and the wafer towards each other along a vertical axis such that the second surface of the mask and the third surface of the wafer is separated by an alignment gap based on a thickness of the second adhesive layer; performing an alignment operation based on imaging the first alignment mark and the second alignment mark; configuring the second surface of the mask to adhere to the third surface of the wafer via the second adhesive; and disconnecting the carrier substrate from the mask.

A method for producing a micromechanical device having a damper structure. The method includes: (A) providing a micromechanical wafer having a rear side; (B) applying a liquid damper material onto the rear side; (C) pressing a matrix against the rear side in order to form at least one damper structure in the damper material; (D) curing the damper material; and (E) removing the matrix.

A method, system, apparatus, and/or device to creating a set of miniaturized electrode pillars. The method, system, apparatus, and/or device may include patterning a set of miniaturized electrode pillars on a substrate and coating the set of miniaturized electrode pillars with an interstitial filler disposed between the set of miniaturized electrode pillars. The interstitial filler may insulate the set of miniaturized electrode pillars from each other and bolster the set of miniaturized electrode pillars.

A physical quantity sensor includes a movable body, a support portion supporting the movable body through a connecting portion, and a substrate that is disposed so as to overlap the movable body in plan view and provided with a first fixed electrode and a second fixed electrode along a first direction orthogonal to a longitudinal direction of the connecting portion. In plan view, a dummy electrode that is disposed next to the first fixed electrode and is at the same potential as the movable body is provided on the substrate. The first fixed electrode and the dummy electrode includes a first electrode material layer provided on the substrate, and a second electrode material layer provided on the substrate and on the first electrode material layer. The second electrode material layer constituting the first fixed electrode and the second electrode material layer constituting the dummy electrode are provided between the first electrode material layer constituting the first fixed electrode and the first electrode material layer constituting the dummy electrode, in plan view. A distance between the second electrode material layer constituting the first fixed electrode and the second electrode material layer constituting the dummy electrode is smaller than a distance between the first electrode material layer constituting the first fixed electrode and the first electrode material layer constituting the dummy electrode, in plan view.

A manufacturing method of a physical quantity sensor includes forming first and second fixed electrodes, and a dummy electrode on a substrate; and a movable body forming. The electrode forming includes forming a first mask layer on the substrate, forming a first electrode material layer by forming a first conductive layer on the substrate and the first mask layer, forming a second conductive layer on the substrate and the first electrode material layer, forming a second mask layer by forming a mask material layer on the second conductive layer, and removing a part of a section of the mask material layer not overlapping the first electrode material layer in plan view, and forming a second electrode material layer by etching the second conductive layer, with the second mask layer as a mask such that the second conductive layer is provided on the first electrode material layer and on the substrate.

A method of patterning a cylindrical tool, including providing a stamp including a base and a layer of solid state ionic conductor thereon, applying a negative of a predetermined pattern of features on a major surface of the solid state ionic conductor, providing a cylindrical tool having a metallic surface positioned proximate the stamp, and applying an electric field between the metallic surface and a cathode while moving the stamp against the metallic surface in rolling line contact so as to impart the predetermined pattern of features onto the metallic surface, wherein the cathode is either the base or a conductive element positioned adjacent to the base. The positive of the predetermined pattern of features may include a multiplicity of nano-sized features.

A method for preparing a flexible electrode is provided. The method comprises sequentially forming a flexible base layer and an intermediate conductive layer on a carrier plate; treating an elastomeric template having an electrode pattern with an acid, followed by transferring and printing the electrode pattern onto the intermediate conductive layer to form an electrode inducing layer; forming a titanium dioxide-polydopamine composite layer in a gap of the electrode inducing layer; forming a platinum electrode layer on the titanium dioxide-polydopamine composite layer; removing the carrier plate. The invention solves the problems of slow formation of a polydopamine film and slow formation of a platinum electrode layer. A flexible electrode is further provided.

The invention relates to a method for producing a substrate structured by nanowires, characterized in that no lubricant and no lithographic resist mask is used in the method, and only by moving a donor substrate having nanowires relative to a substrate and by locally tribological properties on the surface of the substrate, a specified number of nanowires is deposited selectively at locally defined points of the substrate. The invention further relates to a substrate that can be produced using the method according to the invention, and which selectively contains a specified number of nanowires on a surface at locally defined points. The invention further relates to the use of the substrate according to the invention in microelectronics, microsystems technology, and/or micro-sensor systems.