A versatile method to create hydrophobic 3-D surfaces with complex hierarchical microstructures that mimic the patterns found on springtail skin is disclosed. The method innovatively merges two fixed-spacing patterns at different scales to create patterns with varying spacing but does not require precise alignment. By utilizing localized stretching strain when gradually laminating a thin microstructured elastomer layer onto a wavy substrate, a pattern is created. To demonstrate this new fabrication process, we laminated a thin polydimethylsiloxane (PDMS) film having a plurality of microstructures thereon, on a wavy PDMS substrate with millimeter-scale inverted pyramidal holes. This resulted in hierarchical surface microstructures that display varying spacings along the peaks and the valleys of the wavy substrate.

The invention preferably relates to a method for producing a MEMS transducer comprising a membrane and a carrier, wherein the membrane exhibits a meander structure comprising vertical and horizontal sections. Here, a shaping component is first provided which is coated with a membrane layer system. The membrane layer system comprises at least one actuator layer comprising an actuator material. By structuring the membrane layer system, membranes are provided which can be attached to a carrier. The shaping component can be completely removed.

Furthermore, the invention preferably relates to a MEMS transducer which can be produced by means of the method.

A chip package includes a semiconductor substrate and a metal layer. The semiconductor substrate has an opening and a sidewall surrounding the opening, in which an upper portion of the sidewall is a concave surface. The semiconductor substrate is made of a material including silicon. The metal layer is located on the semiconductor substrate. The metal layer has plural through holes above the opening to define a MEMS (Microelectromechanical system) structure, in which the metal layer is made of a material including aluminum.

A method of liquid-mediated pattern transfer includes providing a substrate comprising (a) a semiconductor film adhered to the substrate and (b) a first patterned layer on the semiconductor film. The substrate is submerged in a delamination liquid, whereby the semiconductor film is delaminated from the substrate while the first patterned layer remains on the semiconductor film. A patterned semiconductor membrane ready for transfer is thus obtained. The patterned semiconductor membrane is transferred to a target substrate in a transfer liquid, and then the transfer liquid is removed (e.g., evaporated). The patterned semiconductor membrane adheres to the target substrate as the transfer liquid is removed.