Some disclosed implementations include an ultrasonic sensor stack and an acoustic resonator. The acoustic resonator may be configured to enhance ultrasonic waves transmitted by the ultrasonic sensor stack in an ultrasonic frequency range that is suitable for ultrasonic fingerprint sensors. In some examples, the acoustic resonator may include one or more low-impedance layers residing between a first higher-impedance layer and a second higher-impedance layer. Each of the one or more low-impedance layers may have a lower acoustic impedance than an acoustic impedance of the first higher-impedance layer or an acoustic impedance of the second higher-impedance layer. At least one low-impedance layer may have a thickness corresponding to a multiple of a half wavelength at a peak frequency of the acoustic resonator. The peak frequency may be within a frequency range from 1 MHz. to 20 MHz.

A transducer is described that includes a substrate configured to be deposited on a solid object, and a transparent medium coupled to the substrate and configured to oscillate at a pre-selected frequency upon receipt of an electrical excitation or a mechanical excitation and to provide a first acoustic wave. The transducer also includes an actuator configured to receive an electrical power, and to provide the electrical excitation or the mechanical excitation to the transparent medium, wherein at least a portion of the solid object is viewable through the transparent medium, and the first acoustic wave is at least partially transmitted through an interface of the transparent medium. A system and a non-transitory, computer-readable medium storing instructions to cause the system to perform a method to use the transducer for generating acoustic waves in a transparent medium are also disclosed.

An ultrasonic probe according to one embodiment comprises: a plurality of sound absorbing bodies that form a sound absorbing layer; at least one ground connection part that is joined between the sound absorbing bodies; at least one center connection part that is joined between the sound absorbing bodies and has an electrode; a plurality of side connection parts that are joined between the sound absorbing bodies and disposed outside the center connection part and have an electrode; and a plurality of piezoelectric bodies that are disposed in front of the sound absorbing layer to be electrically connected to the ground connection part, the center connection part, and the side connection parts.

An ultrasonic transducer and a manufacturing method thereof, an ultrasonic transducer array and a display device. The ultrasonic transducer includes a substrate, a first electrode on the substrate, an insulation layer on a side of the first electrode away from the substrate, and a second electrode on a side of the insulation layer away from the first electrode. The second electrode is disposed opposite to the first electrode, and the ultrasonic transducer further includes a through hole penetrating both the substrate and the first electrode and a chamber in the insulation layer. The chamber is opposite to the first electrode and the second electrode, respectively, the chamber is communicated with the through hole, and the second electrode is not in contact with the chamber.

An ultrasonic sensor is a sensor that transmits an ultrasonic wave to a target object and receives the ultrasonic wave reflected by the target object, the ultrasonic sensor including an ultrasonic array chip on which ultrasonic elements that transmit and receive the ultrasonic wave are arranged in an array shape. Each of the ultrasonic elements includes a vibrating section and a piezoelectric element provided in the vibrating section, vibrates the vibrating section to transmit the ultrasonic wave, and outputs a reception signal of the ultrasonic wave by the vibration of the vibrating section. A resonance frequency of the ultrasonic element is 2000 kHz or less.

A vibration generating device includes a first piezoelectric device including at least one slit, a first electrode on a first surface of the first piezoelectric device, and a second electrode on a second surface opposite to the first surface of the first piezoelectric device.

The present invention discloses an SOC PMUT suitable for high-density system integration, an array chip and a manufacturing method thereof. With the SOC PMUT suitable for high-density system integration, vertical stacking and monolithic integration of a SOC PMUT array with CMOS auxiliary circuits is realized by means of direct bonding of active wafers and a vertical multi-channel metal wiring structure; in addition, the extension to the package layer is implemented by means of TSVs, without any bonding mini-pad on the periphery of the array for communication with the CMOS. Thus, the bottleneck of metal interconnections in conventional ultrasonic transducers is overcome, the chip area occupied by metal interconnections in ultrasonic transducers is greatly reduced, the metal wiring length is reduced, thus the resulting adverse effects of an electrical parasitic effect on the performance of the ultrasonic transducer array are reduced.

Provided is a telehaptic device which includes a piezoelectric sensor module and a piezoelectric actuator module that are spaced apart from each other, wherein the piezoelectric sensor module includes a first flexible substrate, a first support substrate connected to the first flexible substrate, a piezoelectric sensor array on the first flexible substrate, and a first wireless communication circuit on the first support substrate, the piezoelectric actuator module includes a second flexible substrate, a second support substrate connected to the second flexible substrate, a piezoelectric actuator array on the second flexible substrate, and a second wireless communication circuit on the second support substrate, the piezoelectric sensor array includes piezoelectric sensors, the piezoelectric sensors being spaced apart according to a first pitch, the piezoelectric actuator array includes piezoelectric actuators, the piezoelectric actuators being spaced apart according to a second pitch, the first pitch and the second pitch are the same.

A mounting structure includes: a first substrate that has a first surface on which a functional element is provided; a wiring portion that is provided at a position, which is different from a position of the functional element on the first surface, and is conductively connected to the functional element; a second substrate that has a second surface that is opposite to the first surface; and a conduction portion that is provided on the second surface, is connected to the wiring portion, and is conductively connected the functional element. The shortest distance between the functional element and the second substrate is longer than the longest distance between the second substrate and a position where the wiring portion is connected to the conduction portion.

An apparatus may include a vibration member and a vibration device configured to vibrate the vibration member. The vibration device may be configured to comprise a first vibration portion and a second vibration portion which is different from the first vibration portion.