An ultrasonic transducer (200) includes: a piezoelectric vibrator assembly (10), an acoustic matching layer (20), a heat sink (30), and an acoustic absorption layer (40). The heat sink (30) comprises a body (31), and a head portion (32) and a tail portion (33). The body (31) has a central axis extending in a direction from the head portion (32) to the tail portion (33). A surface of the tail portion (33) of the heat sink (30) disposed away from the head portion (32) is a first surface (331). The first surface (331) is an oblique surface or a tapered surface. The angle between the first surface (331) and the central axis is an acute angle. The acoustic absorption layer (40) at least covers the first surface (331).

A piezoelectric vibration module has a first soft circuit board and a plurality of piezoelectric units. The first soft circuit board includes a plurality of cutting areas. Two adjacent cutting areas are spaced with a cut through groove. Each piezoelectric unit is respectively configured below each cutting area.

An ultrasonic imaging device includes a plurality of ultrasonic transducers arranged in rows and columns. Each transducer has a lower electrode and an upper electrode. In each row, any two neighboring transducers of the row respectively have their lower electrode and their upper electrode connected to each other, or their upper electrode and their lower electrode connected to each other and in each column, any two neighboring transducers in the column respectively have their lower electrode and their upper electrode connected to each other, or their upper electrode and their lower electrode connected to each other.

A method of fabricating a transducer includes embedding signal flexes and ground-return flexes inside a backing block. The method includes forming stack configurations with a height in elevation and a width perpendicular to the height. The forming includes: dicing a piezoelectric layer in the elevation into rows (separating the piezoelectric layer into portions); defining a beam pattern for the transducer by aligning the portions on the backing block; and forming gaps in-between each piezoelectric layer portion and each adjacently aligned piezoelectric layer portion. The method includes forming stacks by bonding one or more matching layers to the piezoelectric layer portions by utilizing a conductive surface of a first matching layer of the one or more matching layers. The method also includes forming cavities in the one or more matching layers in elevation, dicing the stacks along an elevation direction into multiple elements, and filling the cavities with a material.

An ultrasonic transducer device is provided. In some embodiments, the ultrasonic transducer device includes a substrate having a membrane support layer formed on a bottom cavity layer, and an opening in the membrane support layer so as to form a transducer cavity. In some embodiments, the opening comprises a truncated circle shape.

An ultrasonic transducer element package includes a first substrate, a second substrate, a support body, and first and second ultrasonic transducers. The first substrate has first and second openings that are aligned in a first direction. The second substrate has a third and fourth openings that are aligned in the first direction. The support body supports the first and second substrates. The first and second substrates are aligned in a second direction that intersects with the first direction, with a space therebetween. The first and Second ultrasonic transducer elements are configured at the first and second openings respectively.

A backing member includes: a resin layer which contains a filler; and a plurality of leads each of which is embedded in the resin layer to penetrate through the resin layer from an upper surface of the resin layer to a lower surface of the resin layer. Each of the leads includes a wiring portion, and a terminal portion connected to one end of the wiring portion. A width dimension and a depth dimension of the wiring portion are smaller than a width dimension and a depth dimension of the terminal portion, and an interval between adjacent ones of the wiring portions of the leads is wider than an average particle size of the filler.

Provided is an ultrasonic sensor including a piezoelectric elements arranged along a first direction and a second direction on a vibration plate, an insulation layer, and conductive lines. Each piezoelectric element including a first electrode, a piezoelectric layer, and a second electrode. The first electrode is partially removed in a regions between the piezoelectric elements. The second electrode is a separate electrode provided for each piezoelectric element. The insulation layer covers the second electrodes and has holes through which portions at opposite ends of the second electrodes along the first direction are partially exposed. Each conductive line is provided between adjacent ones of the second electrodes along the first direction and electrically connects, via the holes, the adjacent ones of the second electrodes.

An ultrasonic sensor includes a two-dimensional array of ultrasonic transducers including a plurality of sub-arrays of ultrasonic transducers, wherein a sub-array of ultrasonic transducers of the plurality of sub-arrays of ultrasonic transducers is independently controllable, and wherein a sub-array of ultrasonic transducers has an associated receive channel. A plurality of shift registers is configured to select a receive pattern of ultrasonic transducers of the two-dimensional array of ultrasonic transducers to activate during a receive operation. An array controller is configured to control selection of the ultrasonic transducers during the receive operation according to the receive pattern and configured to shift a position of the receive pattern within the plurality of shift registers such that the ultrasonic transducers activated during the receive operation moves relative to and within the two-dimensional array of ultrasonic transducers.

An ultrasonic sensor includes a two-dimensional array of ultrasonic transducers. A signal generator is configured to generate a plurality of transmit signals, wherein each transmit signal of the plurality of transmit signals has a different phase delay relative to other transmit signals of the plurality of transmit signals. A plurality of shift registers is configured to store a beamforming space including a beamforming pattern to apply to the two-dimensional array, wherein the beamforming pattern identifies a transmit signal of the plurality of transmit signals that is applied to each ultrasonic transducer of the beamforming space that is activated during a transmit operation. An array controller is configured to control activation of ultrasonic transducers during a transmit operation according to the beamforming pattern and configured to shift a position of the beamforming space within the plurality of shift registers such that the beamforming space moves within the two-dimensional array.