According to one embodiment, an ultrasonic device includes an ultrasonic transmitter. The ultrasonic transmitter includes a first element, a second element, and a driver. The first element is flexing-vibratable at a first resonant frequency. The second element is flexing-vibratable at a second resonant frequency different from the first resonant frequency. The driver is configured to supply a first electrical signal to the first element and to supply a second electrical signal to the second element. The first electrical signal includes a first signal having the first resonant frequency. The second electrical signal includes a second signal having the second resonant frequency.

An ultrasound transducer and a method of making this transducer, where the transducer includes at least two piezoelectric elements, oriented adjacent to each other in a stack. Each piezoelectric element includes a first surface which includes an electrode of a first polarity, a second surface which includes an electrode of a second polarity, a thickness between the first surface and the second surface, and an ultrasound transmitting surface. This surface does not include an electrode. The transducer also includes a first electrical connection between a surface of a first of the at least two piezoelectric elements of the first polarity and a surface of a second of the at least two piezoelectric elements of the first polarity and a second electrical connection between a surface of a first of the at least two piezoelectric elements of the second polarity and a surface of a second of the at least two piezoelectric elements of the second polarity.

An ultrasound probe including: a circuit substrate (23) having a recess in a first region on the lower surface side; a buffer layer (400) composed of an insulating material on a second region different from the first region of circuit substrate (23); and an element array layer (22) including a first piezoelectric element (100) for ultrasound transmission formed in the first region of the circuit substrate (23) without the buffer layer (400), and a second piezoelectric element (200) for ultrasound reception formed in the second region of the circuit substrate (23) on the buffer layer (400). The first piezoelectric element (100) vibrates in a flexural vibration mode on the circuit substrate (23), and the second piezoelectric element (200) vibrates in a thickness vibration mode on the circuit substrate (23).

A deployable invasive device includes a transducer with a plurality of elements linked by at least one shape memory material configured to move the plurality of elements relative to one another between a first configuration and a second configuration in response to a stimulus. The shape memory material comprises at least one active region configured to facilitate transition between the first configuration and the second configuration. The deployable invasive device includes at least one integrated circuit configured to process signals from at least one of the plurality of elements and a plurality of conductive traces on or in the shape memory material and extending through the active region. The conductive traces are configured to conduct signals to the at least one integrated circuit, wherein the conductive traces are configured to conform as the shape memory material moves the elements between the first configuration and the second configuration.

An ultrasound probe includes: an ultrasound transducer including plural piezoelectric elements; an acoustic lens layer configured to radiate the ultrasound emitted from the plural piezoelectric elements to outside; a back layer that faces the acoustic lens layer with the ultrasound transducer interposed between the back layer and the acoustic lens layer; and a wiring member having at least a part that is arranged at a first position between the acoustic lens layer and the ultrasound transducer or at a second position that faces the ultrasound transducer with the back layer interposed between the second position and the ultrasound transducer. The wiring member includes: a resin layer having electrically insulating; and an electrically conducting layer that is provided on the resin layer and includes plural signal wirings.

Planar phased ultrasound transducer including a first layer including a sheet of piezoelectric material, a piezo frame surrounding an outer perimeter of the sheet of piezoelectric material, and an epoxy material placed between the piezo frame and the sheet of piezoelectric material. The transducer includes a flex frame secured to a back side of the first layer.

An ultrasound probe includes: an ultrasound transducer including plural piezoelectric elements; an acoustic lens layer configured to radiate the ultrasound emitted from the plural piezoelectric elements to outside; a back layer that faces the acoustic lens layer with the ultrasound transducer interposed between the back layer and the acoustic lens layer; and a wiring member having at least a part that is arranged at a first position between the acoustic lens layer and the ultrasound transducer or at a second position that faces the ultrasound transducer with the back layer interposed between the second position and the ultrasound transducer. The wiring member includes: a resin layer having electrically insulating; and an electrically conducting layer that is provided on the resin layer and includes plural signal wirings.

An ultrasonic transducer probe comprises an array transducer and a microbeamformer ASIC (46a, 46b) containing transmit amplifiers and receive circuitry for operation of the array transducer. For higher power operation, the drive current of the amplifiers is increased, rather than the transmit voltage. The elements of the array present a low impedance to the transmit amplifiers for increased drive current by their construction of thin layers (12) of piezoelectric material which are electrically coupled in parallel to an amplifier while being mechanically coupled in series for ultrasound transmission.

Planar phased ultrasound transducer including a first layer including a sheet of piezoelectric material, a piezo frame surrounding an outer perimeter of the sheet of piezoelectric material, and an epoxy material placed between the piezo frame and the sheet of piezoelectric material. The transducer includes a flex frame secured to a back side of the first layer.

A structure of an acoustic transducer array probe for transmission of acoustic waves from a front radiation surface into an acoustic load material, where said acoustic waves can have frequencies in a high frequency (HF) band and further lower frequency (LF1, . . . , LFn, . . . , LFN) bands with N1, arranged in order of decreasing center frequency. The acoustic waves are transmitted from separate high and lower frequency arrays stacked together with matching layers in a thickness dimension into a layered structure, with at least a common radiation surface for said high and lower frequency bands. At least for said common radiation surface at least one lower frequency LFn electro-acoustic structure (n=1, . . . , N) comprises a piezoelectric array with an acoustic isolation section to its front face. The acoustic isolation section includes to the front a section composed of a sequence of L3 matching layers with interchanging low and high characteristic impedances, where the front layer of said section is one of i) a lower characteristic impedance layer, and ii) a higher characteristic impedance layer, and where at least one lower characteristic impedance layer is made of a homogeneous material.