The ultrasonic-wave irradiation unit provides excellent erosion resistance, ensuring a long service life, and achieves uniform oscillation displacement distribution, thereby minimizing uneven cleaning. The ultrasonic-wave irradiation unit comprises a diaphragm and a plurality of transducer units U1. Each transducer unit U1 includes a plurality of ultrasonic transducers, a resonator, and a connecting plate that transmits the oscillations of the ultrasonic transducers to the resonator. The connecting plate 61 has peaks and valleys along both side edges, forming alternating wide portions and narrow portions, with bolt insertion holes formed in the center of each wide portion. Adjacent connecting plates are arranged in a staggered manner in close proximity, such that the peaks of one plate fit into the valleys of the adjacent plate. The ultrasonic transducers and resonators are fastened and fixed to a plurality of bolts protruding through the bolt insertion holes of the connecting plate.

The present application provides an ultrasonic transducer and a method for preparing the same. The ultrasonic transducer includes a substrate layer, a piezoelectric layer, and an acoustic matching layer laminated in sequence along the thickness direction; the piezoelectric layer includes a substrate, the substrate includes a wiring area and a plurality of piezoelectric array elements distributed in a matrix along the row direction and the column direction, and two adjacent piezoelectric array elements are bonded by an insulating adhesive, and the upper and lower surfaces of the piezoelectric array elements and the insulating adhesive are formed by a vacuum-plated electrode layer to form row and column strip electrodes, which can be formed by cutting and photolithography. The end of the first electrode layer is electrically connected to the first conductive element; the end of the second electrode layer is electrically connected to the second conductive element.

An ultrasound probe includes: an ultrasound transducer including plural piezoelectric elements; an acoustic lens layer configured to radiate the ultrasound emitted from the plural piezoelectric elements to outside; a back layer that faces the acoustic lens layer with the ultrasound transducer interposed between the back layer and the acoustic lens layer; and a wiring member having at least a part that is arranged at a first position between the acoustic lens layer and the ultrasound transducer or at a second position that faces the ultrasound transducer with the back layer interposed between the second position and the ultrasound transducer. The wiring member includes: a resin layer having electrically insulating; and an electrically conducting layer that is provided on the resin layer and includes plural signal wirings.

In a chip-on-array approach, acoustic and electronic modules are separately formed. The acoustic stack is connected to one interposer, and the electronics are connected to another interposer. Different connection processes (e.g., using low temperature bonding for the acoustic stack and higher temperature-based interconnect for the electronics) may be used. This arrangement may allow for different pitches of the transducer elements and the I/O of the electronics by staggering vias in the interposers. The two interposers are then connected to form the chip-on-array.

In a chip-on-array approach, acoustic and electronic modules are separately formed. The acoustic stack is connected to one interposer, and the electronics are connected to another interposer. Different connection processes (e.g., using low temperature bonding for the acoustic stack and higher temperature-based interconnect for the electronics) may be used. This arrangement may allow for different pitches of the transducer elements and the I/O of the electronics by staggering vias in the interposers. The two interposers are then connected to form the chip-on-array.

An ultrasonic device includes a driving circuit to provide drive power, a first transducer array to generate ultrasonic waves, the first transducer array being connected to receive power from the driving circuit, and a second transducer array to detect reflected or elicited ultrasonic waves incident on the device from a target and generate a signal based on those waves, the second transducer array being acoustically transmissive and disposed over the first transducer array such that the generated ultrasonic waves pass through the second transducer array. The second array is tuned to operate on top of the first. The functions of the two arrays may be reversed and the array tuned to operate with the first array receiving and the second array transmitting.

For ultrasound transducers. graphene, such as flakes or sheets, is used in backers with a matrix of polymer. The graphene provides good attenuation at low frequencies and thermal conductivity.

Disclosed is a linear array ultrasonic probe, of which a first conductive layer is arranged on an outer wall of a backing body facing an array element layer by means of a gold spraying, electroplating, or chemical plating process, and/or a second conductive layer is arranged on a negative end by means of a gold spraying, electroplating, or chemical plating process, so that a thickness of at least one of the first conductive layer and the second conductive layer can be made thinner, for example, the thickness a5 micrometers.

An ultrasonic transducer array including a substrate, a membrane overlying the substrate, the membrane configured to allow movement at ultrasonic frequencies, and a plurality of anchors connected to the substrate and connected to the membrane. The membrane includes a piezoelectric layer, a plurality of first electrodes, and a plurality of second electrodes, wherein each ultrasonic transducer of a plurality of ultrasonic transducers includes at least a first electrode and at least a second electrode. The plurality of anchors includes a first anchor including a first electrical connection for electrically coupling at least one first electrode to control circuitry and a second anchor including a second electrical connection for electrically coupling at least one second electrode. The ultrasonic transducer array could be either a two-dimensional array or a one-dimensional array of ultrasonic transducers.