B06B1/0666

Variable thickness diaphragm for a wideband robust piezoelectric micromachined ultrasonic transducer (PMUT)

A diaphragm for a piezoelectric micromachined ultrasonic transducer (PMUT) is presented having resonance frequency and bandwidth characteristics which are decoupled from one another into independent variables. Portions of at least the piezoelectric material layer and backside electrode layer are removed in a selected pattern to form structures, such as ribs, in the diaphragm which retains stiffness while reducing overall mass. The patterned structure can be formed by additive, or subtractive, fabrication processes.

Increased MUT coupling efficiency and bandwidth via edge groove, virtual pivots, and free boundaries

Methods for improving the electromechanical coupling coefficient and bandwidth of micromachined ultrasonic transducers, or MUTs, are presented as well as methods of manufacture of the MUTs improved by the presented methods.

Piezoelectric element, piezoelectric actuator, ultrasonic probe, ultrasonic apparatus, electronic apparatus, liquid jet head, and liquid jet apparatus
11800809 · 2023-10-24 · ·

A piezoelectric element includes a first electrode layer, a piezoelectric layer, and a second electrode layer. The first electrode layer, the piezoelectric layer, and the second electrode layer are stacked in sequence on one another. The first electrode layer has a first part overlapping the piezoelectric layer in a plan view, and a second part at least partially separated from the first part and not overlapping the piezoelectric layer in the plan view. The second electrode layer has a third part overlapping the piezoelectric layer in the plan view, and a fourth part separated from the third part. The fourth part is in contact with the first part and the second part.

Microelectromechanical membrane transducer with active damper

A microelectromechanical membrane transducer includes: a supporting structure; a cavity formed in the supporting structure; a membrane coupled to the supporting structure so as to cover the cavity on one side; a cantilever damper, which is fixed to the supporting structure around the perimeter of the membrane and extends towards the inside of the membrane at a distance from the membrane; and a damper piezoelectric actuator set on the cantilever damper and configured so as to bend the cantilever damper towards the membrane in response to an electrical actuation signal.

Acoustic transduction unit, manufacturing method thereof and acoustic transducer
11813641 · 2023-11-14 · ·

The present disclosure provides an acoustic transduction unit, a manufacturing method thereof and an acoustic transducer. The acoustic transduction unit includes a substrate, and a first electrode, a vibrating film and a second electrode sequentially arranged on the substrate, a cavity is formed between the first electrode and the vibrating film, orthographic projections of the first electrode, the cavity, the vibrating film and the second electrode on the substrate are at least partially overlapped with each other at a first overlapping region, and a hollowed-out pattern is formed in the vibrating film, and the orthographic projection of the hollowed-out pattern on the substrate and the orthographic projection of the cavity on the substrate are overlapped with each other, and the orthographic projection of the hollowed-out pattern on the substrate is distributed in a discontinuous manner around the first overlapping region.

MICROMECHANICAL COMPONENT, SOUND TRANSDUCER DEVICE, AND METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT
20230354714 · 2023-11-02 ·

A micromechanical component for a sound transducer device. The micromechanical component includes a substrate, a diaphragm, at least one piezoelectric element, and at least one electrical contact connection. The diaphragm can vibrate and is connected to the substrate. The at least one piezoelectric element is disposed between the diaphragm and the substrate and is connected to the diaphragm. The at least one piezoelectric element is designed to produce and/or detect vibrations of the diaphragm in the ultrasonic range. The at least one electrical contact connection is electrically connected to the at least one piezoelectric element. The micromechanical component can be connected, using flip chip technology, to a control circuit such that the at least one piezoelectric element can be electrically connected to the control circuit by means of the at least one electrical contact connection.

Ultrasound transducer and housing for same
11716577 · 2023-08-01 · ·

An ultrasound energy delivery system is provided that includes a transducer and a housing.

Variable thickness diaphragm for a wideband robust piezoelectric micromachined ultrasonic transducer (PMUT)

A diaphragm for a piezoelectric micromachined ultrasonic transducer (PMUT) is presented having resonance frequency and bandwidth characteristics which are decoupled from one another into independent variables. Portions of at least the piezoelectric material layer and backside electrode layer are removed in a selected pattern to form structures, such as ribs, in the diaphragm which retains stiffness while reducing overall mass. The patterned structure can be formed by additive, or subtractive, fabrication processes.

DISPLAY DEVICE, METHOD FOR PRODUCING DISPLAY DEVICE, AND GESTURE RECOGNITION METHOD

A display device, a method for producing a display device, and a gesture recognition method are disclosed. The display device includes a display module including a base and an array substrate, a resin layer, a first electrode layer, a pixel definition layer, a light-emitting unit layer, a second electrode layer disposed opposite to the first electrode layer, and an encapsulation layer. The light-emitting unit layer is between the first electrode layer and the second electrode layer and includes a plurality of light-emitting units respectively in a plurality of openings of the pixel definition layer, and an ultrasonic sensor including the second electrode layer, a piezoelectric material layer between the first electrode layer and the pixel definition layer, and a third electrode layer between the pixel definition layer and the resin layer. The piezoelectric material layer includes a plurality of piezoelectric material units separated by the plurality of light-emitting units.

Ultrasonic sensor

An ultrasonic sensor includes: an element storage case including a case-side diaphragm having a thickness direction along a directional axis; and an ultrasonic element accommodated in the element storage case and spaced apart from the case-side diaphragm. The ultrasonic element includes an element-side diaphragm having the thickness direction along the directional axis and provided by a thin part of a semiconductor substrate. The semiconductor substrate is arranged to provide a closed space between the case-side diaphragm and the element-side diaphragm. The semiconductor substrate is fixed and supported by the element-storage case.