An acoustic transducer is provided. The acoustic transducer includes a housing, a backing, a piezocomposite element adjacent the backing within the housing, and a diaphragm covering on an outward facing surface of the piezocomposite element.

An ultrasonic Lamb wave transducer for non-invasive measurement and for emitting and/or receiving an ultrasonic Lamb wave pulse, an emission and a reception of the ultrasonic Lamb wave having an emission direction and a reception direction, respectively, the ultrasonic Lamb wave pulse being defined by at least one parameter, includes: at least one piezocomposite actuator for controlling the emission direction of the ultrasonic Lamb wave by emitting acoustic radiation at frequencies that are appropriate for generating ultrasonic Lamb waves.

An ultrasonic transducer includes a piezoceramic element, a first acoustic matching layer with extending sidewall attaching the lateral surface of the piezoceramic element, wherein the thickness of the first acoustic matching layer is smaller than wavelength of an ultrasonic wave emitted by the piezoceramic element in the first acoustic matching layer in an operating frequency of the ultrasonic transducer, and the height of the sidewall of the first acoustic matching layer is larger than 1/20 height of the lateral surface of the piezoceramic element, and a second acoustic matching layer attaching the first acoustic matching layer.

An embodiment of the present invention provides an ultrasonic wave amplifying unit which can improve ultrasonic power in air, wherein the ultrasonic wave amplifying unit includes multiple rings having a concentric axis and each having a first width, and a slit having a second width is formed between the rings and an air layer is formed between the multiple rings and an ultrasonic wave generator generating ultrasonic waves or a transfer medium transferring the ultrasonic waves.

An ultrasonic transducer module including a first electrode layer, a second electrode layer, a first piezoelectric material layer, a third electrode layer, a fourth electrode layer, a second piezoelectric material layer, and an insulation layer is provided. The first piezoelectric material layer is disposed between the first electrode layer and the second electrode layer. The second electrode layer is disposed between the first piezoelectric material layer and the third electrode layer. The second piezoelectric material layer is disposed between the third electrode layer and the fourth electrode layer. The insulation layer is disposed between the second electrode layer and the third electrode layer.

Provided is an ultrasound transducer 1 in which a plurality of piezoelectric elements (3) are arranged on a backing material along an arrangement direction, the ultrasound transducer (1) including a plurality of acoustic matching layers (4, 5, 6, 7) laminated on each piezoelectric element (3), in which at least one acoustic matching layer (4) among the plurality of acoustic matching layers (4, 5, 6, 7) consists of at least one acoustic matching piece (4A, 4B) having a width narrower than a width of the piezoelectric element (3) in the arrangement direction.

A piezoelectric sensor assembly, a manufacturing method thereof, a display panel and an electronic device including the same are provided. The piezoelectric sensor assembly includes: a base substrate; a plurality of ultrasonic transducers, wherein a spacing area is provided between two adjacent ultrasonic transducers; and an acoustic matching layer, wherein the acoustic matching layer includes a plurality of acoustic matching areas, and an orthographic projection of at least one acoustic matching area on the base substrate falls into an orthographic projection of the ultrasonic transducer corresponding to the acoustic matching area on the base substrate, wherein an isolation cavity is provided between two adjacent acoustic matching areas.

An acoustic matching structure is used to increase the power radiated from a transducing element with a higher impedance into a surrounding acoustic medium with a lower acoustic impedance. The acoustic matching structure consists of a thin, substantially planar cavity bounded by a two end walls and a side wall. The end walls of the cavity are formed by a blocking plate wall and a transducing element wall separated by a short distance (less than one quarter of the wavelength of acoustic waves in the surrounding medium at the operating frequency). The end walls and side wall bound a cavity with diameter approximately equal to half of the wavelength of acoustic waves in the surrounding medium. In operation, a transducing element generates acoustic oscillations in the fluid in the cavity. The transducing element may be an actuator which generates motion of an end wall in a direction perpendicular to the plane of the cavity to excite acoustic oscillations in the fluid in the cavity, and the cavity geometry and resonant amplification increase the amplitude of the resulting pressure oscillation. The cavity side wall or end walls contain at least one aperture positioned away from the center of the cavity to allow pressure waves to propagate into the surrounding acoustic medium.

An ultrasonic sensor includes metal member having flat plate, piezoelectric element bonded to first surface of flat plate, first acoustic matching layer adhered to second surface of flat plate, and adhesive that adheres first acoustic matching layer to flat plate. First acoustic matching layer of the ultrasonic sensor has opening on a surface adhered to flat plate and void that communicates with opening, in which adhesive is filled in void, adhesive solidifies in void, and thus an anchor effect can be obtained.

An ultrasonic probe includes: an acoustic element that generates an ultrasonic wave and detects the ultrasonic wave; a support that supports the acoustic element on a side opposite to a test object side; and a heat dissipation material disposed on a side of the support opposite to the acoustic element, wherein an attenuation/thermal conduction material made of an attenuating material containing a thermally conductive material is disposed in contact with the heat dissipation material.