Patent classifications
B06B1/067
High frequency ultrasound transducer having an ultrasonic lens with integral central matching layer
High frequency ultrasound transducers configured for use with high frequency ultrasound diagnostic imaging systems are disclosed herein. In one embodiment, an ultrasound transducer includes a concave lens having an average thickness in a center portion that that is substantially equal to an odd multiple a ?-wavelength of the center frequency of the ultrasound transducer.
Phased array ultrasonic transducers with solderless stack bonding assembly
Disclosed is an NDT/NDI probe array and manufacturing method. The probe array includes a sheet of flexible circuit 10 with a plurality of lower pins 102 and corresponding, electrically connected, upper pins 104. The probe further comprises a backing block 12, a layer of piezoelectric ceramic 16 having a plurality of conductive elements 162, a matching layer 18 and a frame 14. An adhesive material such as epoxy is applied to the circuit, the backing, the ceramic and the matching layer, and all are aligned and stack pressed at least partially into the frame and permanently bonded in such a fashion that each of the lower pins of the flexible circuit is firmly and permanently in contact with a corresponding one of the conductive elements of the ceramic.
METHODS AND SYSTEMS FOR MANUFACTURING AN ULTRASOUND PROBE
Systems and methods described herein generally relate to forming a conductive layer of an ultrasound probe. The systems and methods form an ultrasound probe that includes a piezoelectric layer, and first and second matching layers. The first matching layer is interposed between the second matching layer and the piezoelectric layer. The second matching layer formed from a material having a select acoustic impedance from a laser activated molded interconnect device (MID) or a three-dimensional printer. The second matching layer being electrically coupled to the piezoelectric layer.
METHODS AND SYSTEMS FOR MODULAR TRANSDUCER PROBE WITH REDUCED FOOTPRINT
Various methods and systems are provided for an electro-acoustic module for a transducer probe. In one example, the electro-acoustic module may include an acoustic stack and at least one application-specific integrated circuit (ASIC) electrically coupled to the acoustic stack by an interconnect having a fan-out architecture. The electro-acoustic module may have an active aperture substantially equal to an overall size of the electro-acoustic module in at least one or an azimuth and an elevation direction.
ULTRASONIC PROBE, ULTRASONIC DIAGNOSTIC APPARATUS, AND METHOD FOR MANUFACTURING BACKING MATERIAL
An ultrasonic probe includes: a piezoelectric element; and a backing material including a matrix resin and thermally conductive particles, arranged on one direction side with respect to the piezoelectric element, wherein a ratio of thermal conductivity of the backing material in a thickness direction to the thermal conductivity of the backing material in a horizontal direction is 3 or more.
SENSOR ASSEMBLY WITH SET ACOUSTIC MATCHING LAYER THICKNESS FOR INTRALUMINAL SENSING DEVICE
An intraluminal sensing device may include an elongate member, a sensor, an acoustic matching layer, and a housing. The elongate member may be configured to be positioned within a body lumen of a patient. The sensor may be configured to obtain physiological data while positioned within the body lumen and may include a proximal surface and an opposite, distal surface. The acoustic matching layer may be disposed on the distal surface. The housing may be positioned at a distal portion of the elongate member and may terminate at a distal end. The housing may include a hollow interior with a planar surface, and the sensor may be positioned within the hollow interior such that the proximal surface of the sensor is disposed on the planar surface. A thickness of the acoustic matching layer may be defined by a distance between the distal surface and the distal end.
ULTRASONIC PROBE
Provided is an ultrasonic probe having a buffer structure capable of preventing internal components from being damaged by an external impact. The ultrasonic probe includes a transducer module transmitting and receiving an ultrasonic wave, a case which has an opened one side and is configured to accommodate the transducer module, a lens provided at the one side of the case, and a protective member accommodated in the case and positioned to face at least one surface of the transducer module, wherein the protective member protrudes further forward compared to the piezoelectric layer.
MULTILAYER BODY THAT INCLUDES PIEZOELECTRIC BODY
A multilayer body includes a piezoelectric body and a first acoustic matching layer in direct or indirect contact with the piezoelectric body. The first acoustic matching layer includes a plastic foam containing a plurality of closed pores. An average pore size of the closed pores is not smaller than 1 m and not larger than 100 m. The first acoustic matching layer has a density of not less than 10 kg/m.sup.3 and not more than 100 kg/m.sup.3.
RESIN COMPOSITION FOR ACOUSTIC WAVE PROBE, AND ACOUSTIC LENS USING THE SAME, ACOUSTIC WAVE PROBE, ACOUSTIC WAVE MEASUREMENT APPARATUS, ULTRASOUND DIAGNOSTIC APPARATUS, PHOTOACOUSTIC WAVE MEASUREMENT APPARATUS, AND ULTRASOUND ENDOSCOPE
Provided are a resin composition for an acoustic wave probe including, a polymer which has a structural unit having a siloxane bond and a structural unit having a urea bond, an acoustic lens using the same, the acoustic wave probe, acoustic wave measurement apparatus, ultrasound diagnostic apparatus, photoacoustic wave measurement apparatus, and ultrasound endoscope.
Ultrasonic device, ultrasonic probe, ultrasonic diagnostic apparatus, and method of manufacturing ultrasonic device
An ultrasonic device includes a substrate, a first piezoelectric body, a second piezoelectric body, and an acoustic matching section. The substrate has a first surface that is a flat surface. The first piezoelectric body is disposed on the first surface of the substrate. The second piezoelectric body is disposed on the first surface of the substrate. The second piezoelectric body has a different thickness from a thickness of the first piezoelectric body as measured from the first surface of the substrate. The acoustic matching section is disposed on the first piezoelectric body and the second piezoelectric body. The acoustic matching section has a first side facing the first piezoelectric body and the second piezoelectric body, and a second side opposite from the first side. A surface of the acoustic matching section on the second side is a flat surface parallel with the first surface of the substrate.