An ultrasound probe includes a first assembly having a first case, a second assembly coupled with the first assembly, having a second case, and configured to be rotatable between a first position of being unfolded with respect to the first assembly and a second position of being folded on the first assembly, a first acoustic module disposed in the inside of the first case, a second acoustic module disposed in the inside of the second case, and a first space reducing portion disposed in at least one of a portion of the first case toward the second assembly and a portion of the second case toward the first assembly, and configured to reduce a space between the first acoustic module and the second acoustic module when the second assembly is at the first position.

A device for picking and placing semiconductor chips includes a liquid having a first surface and a second surface and a layer of semiconductor chips disposed over the first surface. Characteristically, the first surface is a liquid-air interface. The device also includes a focused ultrasonic transducer positioned to focus acoustic wave on the layer of semiconductor chips such that a droplet including at least one semiconductor chip is ejected through the liquid-air per each actuation of the focused ultrasonic transducer through droplet ejection. The focused ultrasonic transducer includes a piezoelectric substrate having a top face and a bottom face, a Fresnel acoustic lens including a plurality of annular rings of air cavities disposed on the top face, and a first patterned circular electrode disposed over the top face and a second patterned circular electrode disposed over the bottom face. The first patterned circular electrode overlaps the second patterned circular electrode.

A mounting structure includes a first substrate that has a first surface on which a functional element is provided, a wiring that is provided at a position which is different from a position of the functional element on the first surface, and is connected to the functional element, a second substrate that has a second surface facing the first surface, and a conductor that is provided on the second surface, and is connected to the wiring and the functional element, in which the shortest distance between the functional element and the second substrate is longer than a distance between a position where the wiring is connected to the conductor, and the second substrate.

An ultrasonic probe has a transduction layer in which a plurality of transducers are placed, a backing layer provided at a rear side of the transduction layer with a wiring layer therebetween, and a plurality of heat dissipation members provided in the backing layer. The plurality of heat dissipation members extend in a line form in the backing layer, and are placed with an aligned direction of extension. An area occupancy percentage of the heat dissipation member at a center region of the backing layer is larger than that at an outer side of the center region. The center region is not positioned at ends of the cross section intersecting the direction of extension of the heat dissipation member, includes a center of gravity of the cross section, and occupies an area less than or equal to a half of an area of the cross section.

An ultrasound transducer according to the disclosure includes: a piezoelectric element; and a support member that supports the piezoelectric element, in which: the piezoelectric element includes a flat piezoelectric body, a first electrode that is laminated on at least one side of the piezoelectric body in a thickness direction, and a second electrode that is laminated on at least the other side of the piezoelectric body in the thickness direction; the support member includes a first terminal that is connected to the first electrode of the piezoelectric element, and a second terminal that is connected to the second electrode of the piezoelectric element; and the first terminal and the second terminal respectively include portions that do not overlap the piezoelectric element in the thickness direction.

An ultrasound transducer for use in intravascular ultrasound (IVUS) imaging systems including a single crystal composite (SCC) layer is provided. The transducer has a front electrode on a side of the SCC layer; and a back electrode on the opposite side of the SCC layer. The SCC layer may have a bowl shape including pillars made of a single crystal piezoelectric material embedded in a polymer matrix. Also provided is an ultrasound transducer as above, with the back electrode split into two electrodes electrically isolated from one another. A method of forming an ultrasound transducer as above is also provided. An IVUS imaging system is provided, including an ultrasound emitter and receiver rotationally disposed within an elongate member; an actuator; and a control system controlling emission of pulses and receiving ultrasound echo data associated with the pulses. The ultrasound emitter and receiver include an ultrasound transducer as above.

High frequency ultrasound transducers configured for use with high frequency ultrasound diagnostic imaging systems are disclosed herein. In one embodiment, an ultrasound transducer includes a concave lens having an average thickness in a center portion that that is substantially equal to an odd multiple a ¼-wavelength of the center frequency of the ultrasound transducer.

An ultrasonic probe has a transduction layer in which a plurality of transducers are placed, a backing layer provided at a rear side of the transduction layer with a wiring layer therebetween, and a plurality of heat dissipation members provided in the backing layer. The plurality of heat dissipation members extend in a line form in the backing layer, and are placed with an aligned direction of extension. An area occupancy percentage of the heat dissipation member at a center region of the backing layer is larger than that at an outer side of the center region. The center region is not positioned at ends of the cross section intersecting the direction of extension of the heat dissipation member, includes a center of gravity of the cross section, and occupies an area less than or equal to a half of an area of the cross section.

A multilayer body includes a piezoelectric body and a first acoustic matching layer in direct or indirect contact with the piezoelectric body. The first acoustic matching layer includes a plastic foam containing a plurality of closed pores. An average pore size of the closed pores is not smaller than 1 μm and not larger than 100 μm. The first acoustic matching layer has a density of not less than 10 kg/m.sup.3 and not more than 100 kg/m.sup.3.

An ultrasound probe includes: an ultrasound transducer that includes a piezoelectric element configured to transmit and receive ultrasound waves to and from a subject; and an adjustment layer that is laminated on the piezoelectric element, the adjustment layer being provided with a cut surface that is cut by a blade configured to cut the piezoelectric element, the adjustment layer including an adjustment material configured to improve cutting performance of the blade.