Various methods and systems are provided for fabricating a backing material for an acoustic probe. In one example, the backing material may include an additively manufactured meta-structure formed from layers of a tessellation pattern. A geometry of the tessellation pattern and an alignment of the layers may affect acoustic properties of the backing material.

Acoustic absorbers are formed for ultrasound transducers. The acoustic absorber provides desired attenuation, impedance, and thermal conductivity qualities based on a filler of rubber, ceramic, and metal particles. The relative amounts of the different fillers may be adjusted to tune the acoustic attenuation, thermal conductivity, and/or acoustic impedance.

Disclosed is a method of manufacturing a piezoelectric pillar enabling highly accurate recognition of a three-dimensional shape and having improved durability while preventing thermal deformation of a mold. The method includes charging a piezoelectric material into at least one filling hole formed in a mold and sintering the piezoelectric material by heating only the piezoelectric material provided in the filling hole to a sintering temperature of the piezoelectric material. Further disclosed and an electronic device including the piezoelectric pillar and a method of manufacturing the electronic device.

An acoustic microelectronic device includes a support, a set of at least one membrane suspended on a face of the support above a cavity by an anchoring zone, and at least one acoustic insulation trench arranged adjacent to the membrane. The device includes at least one bridge connecting the portions of two opposite edges of the trench and located overhanging at least one zone of the trench so as to form, in the zone of the trench, an acoustic insulation box below the bridge.

Fingerprint identification modules, methods for forming the fingerprint identification modules and electronic devices are provided. The method may include providing a substrate, containing a signal process circuit formed therein; providing a carrier substrate; forming one or more piezoelectric transducers on the carrier substrate, wherein a piezoelectric transducer of the one or more piezoelectric transducers includes a first electrode, a piezoelectric layer on the first electrode and a second electrode on the piezoelectric layer; forming a permanent bonding layer, containing one or more cavities, on one of the carrier substrate and the substrate; bonding the carrier substrate with the substrate using the permanent bonding layer, wherein the permanent bonding layer is between the one or more piezoelectric transducers and the substrate, and each piezoelectric transducer covers one cavity; and removing the carrier substrate.

Behind an electronic circuit, a thermally anisotropic main backing is provided. The main backing has two outer surfaces (low thermal conductivity surfaces) perpendicular to an X direction. In a first gap located adjacent to one of the outer surfaces, an FPC and a first group of electric components are arranged. In a second gap located adjacent to the other one of the outer surfaces, the FPC and a second group of electric components are arranged.

A downhole ultrasonic transducer (10) used to transmit and/or receive ultrasonic waves in a hydrocarbon well where a fluid is present comprises: a metal housing (11) defining an internal cavity (12) isolated from the fluid of the hydrocarbon well (100) by a membrane wall (13) made of metal or metal alloy; a piezoelectric element (14) mounted inside the internal cavity (12), the piezoelectric element (14) having a front side (20) mechanically coupled on the membrane wall (13); wherein: the internal cavity (12) is at a pressure unrelated to a hydrocarbon well pressure; a back side (21) of the piezoelectric element (14) is arranged to be free to oscillate in the internal cavity (12) so as to generate a high acoustic impedance mismatch between the piezoelectric element (14) and the internal cavity (12) at the back side (21) and to maximize acoustic transmission at the front side (20); and a thickness (ei) of the membrane wall (13) is such that there is a common resonance between the membrane wall and the piezoelectric element thereby achieving high acoustic transmission through the membrane wall (13), and such that the membrane wall (13) is suitable to resist to the hydrocarbon well pressure.

An ultrasonic transducer and an ultrasonic probe including the same are provided. The ultrasonic transducer includes a piezoelectric layer configured to convert an electric signal and an ultrasound into each other, and a dematching layer having a uniform thickness, the dematching layer being arranged on a partial region of the piezoelectric layer and configured to reflect the second ultrasound wave that is incident on the dematching layer.

This disclosure describes a monolithic integrated device that comprises a substrate layer being the base of the device, an inter-layer dielectric disposed on top of the substrate layer and below a passivation layer, an electronic circuitry formed within the inter-layer dielectric and supported by the substrate layer, the electronic circuitry comprises a plurality of metal layers formed by one or more spaced apart metals; and at least one micromachined ultrasonic transducer. Each micromachined ultrasonic transducer comprises a bottom electrode disposed on top of the passivation layer and connected to the electronic circuitry, a piezoelectric disposed on top of the bottom electrode, a top electrode disposed on top of the piezoelectric, and an elastic layer positioned on top of the top electrode. There is a cavity formed below the bottom electrode that extends from the passivation layer to a portion of the inter-layer dielectric.

This disclosure describes a monolithic integrated device that comprises a substrate layer being the base of the device, an inter-layer dielectric disposed on top of the substrate layer and below a passivation layer, an electronic circuitry formed within the inter-layer dielectric and supported by the substrate layer, the electronic circuitry comprises a plurality of metal layers formed by one or more spaced apart metals; and at least one micromachined ultrasonic transducer. Each micromachined ultrasonic transducer comprises a bottom electrode disposed on top of the passivation layer and connected to the electronic circuitry, a piezoelectric disposed on top of the bottom electrode, a top electrode disposed on top of the piezoelectric, and an elastic layer positioned on top of the top electrode. There is a cavity formed below the bottom electrode that extends from the passivation layer to a portion of the inter-layer dielectric.