Behind an electronic circuit, a backing member is provided. The backing member is composed of an auxiliary backing having a first thermal anisotropic property, and a main backing having a second thermal anisotropic property different from the first thermal anisotropic property. The auxiliary backing exhibits a heat diffusion effect in an X direction. The main backing exhibits a heat transfer effect in a Y direction.

The ultrasound probe includes a piezoelectric element including a piezoelectric composition and an electrode that applies a voltage to the piezoelectric composition. The piezoelectric composition has piezoelectric characteristics expressed by any coordinates included in a region formed by a polyhedron having a plurality of predetermined points as vertexes in Cartesian coordinates (k.sub.eff, .sub.33.sup.S, E.sub.c) including variables k.sub.eff, .sub.33.sup.S and E.sub.c.

An ultrasound transducer with at least one piezoelectric element configured to convert received acoustic signals into an electric potential, a shield connectable to ground and overlying the at least one piezoelectric element through which the acoustic signals pass, before being received by the at least one piezoelectric element, the shield having acoustic conductivity and electrical attenuation characteristics that enable the acoustic signals to propagate therethrough while reducing a 100 volt per centimeter electric field to below a threshold level so that the piezoelectric element is exposed to a threshold electrical potential at least less than or equal to 10 V, and a housing accommodating the at least one piezoelectric element and shield.

An ultrasonic apparatus includes an ultrasonic element substrate that includes an ultrasonic element array transmitting an ultrasonic wave in a first direction, and a first conductive film provided on the first direction side of the ultrasonic element array, a casing portion that has a conductive member provided to surround the ultrasonic element substrate on a side intersecting the first direction of the ultrasonic element substrate, and a support substrate that is provided on an opposite side to the first direction of the ultrasonic element substrate, supports the ultrasonic element substrate, and has conductivity.

There is provided an apodizing wedge structure for a LIPUS treatment head. The LIPUS treatment head includes a low-volume fraction piezoelectric composite disc. The apodizing wedge structure includes an annular body for contacting a surface of the piezoelectric disc, the annular body including an inner perimeter having an inner thickness and an outer perimeter having an outer thickness. The annular body includes an inclined surface forming a continuous slope extending from the inner perimeter to the outer perimeter, the inner thickness being smaller than the outer thickness. The apodizing wedge is configured to change an apparent thickness of the piezoelectric disc with respect to resonant properties of the piezoelectric disc when the apodizing wedge structure is in acoustic communication with the piezoelectric disc, thereby allowing the LIPUS treatment head to generate a uniform near field. LIPUS treatment heads and ultrasonic transducers including such an apodizing wedge structure are also provided.

Disclosed is an ultrasonic transducer and a manufacturing method thereof. The transducer comprises a piezoelectric composite array having an array of rigid posts made of a piezoelectric material, with kerf spaces between the posts filled with a low density aerogel material.

An ultrasonic apparatus includes an ultrasonic element substrate that includes an ultrasonic element array transmitting an ultrasonic wave in a first direction, and a first conductive film provided on the first direction side of the ultrasonic element array, a casing portion that has a conductive member provided to surround the ultrasonic element substrate on a side intersecting the first direction of the ultrasonic element substrate, and a support substrate that is provided on an opposite side to the first direction of the ultrasonic element substrate, supports the ultrasonic element substrate, and has conductivity.

A ultrasonic-oscillator unit including an ultrasonic-oscillator array in which a plurality of ultrasonic-oscillators are arranged in a semicylindrical shape; an electrode part of the ultrasonic-oscillator array provided on an end surface of the ultrasonic-oscillator array perpendicular to an arrangement surface of the plurality of ultrasonic-oscillators; and a backing material layer that is disposed on an inner back surface of the ultrasonic-oscillator array; and a cable wiring part in which a plurality of cables are respectively disposed on a plurality of wiring lines electrically connected to the plurality of electrodes of the electrode part. The width of the backing material layer perpendicular to the arrangement surface of the plurality of ultrasonic-oscillators becomes smaller toward a side opposite to the arrangement surface of the plurality of ultrasonic-oscillators. A cable wiring part electrically connected to the electrode part is provided along the width of the backing material layer.

An interposer includes: a circuit board stack in which circuit boards are stacked; and an outer board arranged on at least one of outer side surfaces of the circuit board stack. The circuit boards are arranged include first conductive lines having first ends exposed through a first side portion of the circuit boards and second ends exposed through a second side portion opposite the first side portion of the circuit boards. The outer board includes second conductive lines having first ends exposed through a different side from the first side portion of the circuit boards and second ends exposed through a side portion located on a same side as the second side portion of the circuit boards.

Disclosed are methods, devices, apparatuses, and systems for an under-display ultrasonic fingerprint sensor. A display device may include a platen, a display underlying the platen, and an ultrasonic fingerprint sensor underlying the display, where the ultrasonic fingerprint sensor is configured to transmit and receive ultrasonic waves via an acoustic path through the platen and the display. A light-blocking layer and/or an electrical shielding layer may be provided between the ultrasonic fingerprint sensor and the display, where the light-blocking layer and/or the electrical shielding layer are in the acoustic path. A mechanical stress isolation layer may be provided between the ultrasonic fingerprint sensor and the display, where the mechanical stress isolation layer is in the acoustic path.