MEMS ultrasonic transducer, MUT, device, comprising a semiconductor body with a first and a second main surface and including: a first chamber extending into the semiconductor body at a distance from the first main surface; a membrane formed by the semiconductor body between the first main surface and the first chamber; a piezoelectric element on the membrane; a second chamber extending into the semiconductor body between the first chamber and the second main surface; a central fluidic passage extending into the semiconductor body from the second main surface to the first chamber and traversing the second chamber; and one or more lateral fluidic passages extending into the semiconductor body from the second main surface to the second chamber. The one or more lateral fluidic passages, the central fluidic passage and the second chamber define a fluidic recirculation path that fluidically connects the first chamber with the outside of the semiconductor body.

An ultrasonic device includes a case, a piezoelectric element, a sound absorbing material, and a vibration-proof material. The case defines a housing space. The piezoelectric element is disposed in the housing space. The sound absorbing material is disposed on the piezoelectric element and is made of a foaming material. The vibration-proof material is disposed around the sound absorbing material and is in contact with an inner face of the case. Between the piezoelectric element and the sound absorbing material, a first space is formed.

Described are micromachined ultrasonic transducer (MUT) arrays with trenches, reducing cross-talk between MUTs to mitigate undesirable artifacts in ultrasound images, as well as methods of making the same.

An ultrasonic element includes an element substrate including a first surface, a second surface having a front-back relation with the first surface, an opening section piercing through the element substrate from the first surface to the second surface, and a partition wall section surrounding the opening section, a supporting film provided on the first surface of the element substrate to cover the opening section and including a third surface facing the opening section and a fourth surface having a front-back relation with the third surface, a piezoelectric element provided on the fourth surface of the supporting film and disposed in a region overlapping the opening section of the supporting film in a plan view from a film thickness direction extending from the third surface to the fourth surface, a sealing plate provided to be opposed to the fourth surface of the supporting film and joined to the supporting film by an adhesive member via a beam section projecting toward the supporting film, and a wall section provided on the fourth surface of the supporting film and provided to project toward the sealing plate between the beam section and the piezoelectric element.

A microelectromechanical membrane transducer includes: a supporting structure; a cavity formed in the supporting structure; a membrane coupled to the supporting structure so as to cover the cavity on one side; a cantilever damper, which is fixed to the supporting structure around the perimeter of the membrane and extends towards the inside of the membrane at a distance from the membrane; and a damper piezoelectric actuator set on the cantilever damper and configured so as to bend the cantilever damper towards the membrane in response to an electrical actuation signal.

An ultrasonic element includes a substrate in which an opening is formed, a vibrating plate provided at the substrate, the vibrating plate including a first surface in contact with the substrate, the vibrating plate blocking the opening, a piezoelectric element provided at a second surface on an opposite side from the first surface of the vibrating plate, a protective substrate facing the second surface and protecting the piezoelectric element, and a suppressing unit provided between the protective substrate and the vibrating plate, the suppressing unit being configured to suppress a vibration of the vibrating plate, in which in the piezoelectric element, a first electrode, a piezoelectric layer, and a second electrode are stacked in this order from the second surface, and an active part is a part of the vibrating plate where the first electrode, the piezoelectric layer, and the second electrode overlap, the suppressing unit is provided around the active part, and a slit is formed in the suppressing unit, in plan view from a stacking direction.

A method for monitoring a patient using an ultrasonic probe includes attaching a conformable two-dimensional piezoelectric transducer array having a plurality of phased array piezoelectric transducer elements on an epidermal surface of a patient so that the conformable two-dimensional piezoelectric transducer array conforms to a shape of the epidermal surface. The conformable two-dimensional piezoelectric transducer array is attachable to the epidermal surface by van der Waals forces alone. The plurality of phased array piezoelectric transducer elements is operated as a phased array to transmit a focused ultrasonic beam to a specified location in the patient to be monitored. Ultrasound waves are received from the patient using the array. An indication of the received ultrasound waves is displayed.

A piezoelectric actuator includes a vibrating plate including a first surface that closes an opening provided in a substrate and a second surface in which a plurality of piezoelectric elements is provided, a suppression part configured to suppress a vibration of the vibrating plate, and a first wall and a second wall protruding from the first surface to the opening. When a portion where the first electrode, the piezoelectric layer and the second electrode overlap each other is an active part of the piezoelectric element, the first wall and the second wall are provided to sandwich the active part in plan view from the stacking direction of the first electrode, the piezoelectric layer and the second electrode, and the second wall is different from the first wall at least in one of the width, height, length and physical property.

Described are transducer assemblies and imaging devices comprising: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements; a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.

The present invention relates to a layered structure, the method for obtaining it and its use as part of a piezoelectric ultrasonic transducer to operate in broadband pulse-echo mode and with high sensitivity and axial resolution in the presence of a pressurised gas at a pressure between 14 bar and 103 bar. Furthermore, the present invention relates to the transducer comprising said layered or stratified structure. Therefore, the present invention can be framed in the area of materials with applications such as sensors in ultrasonic systems.