An ultrasonic MEMS acoustic transducer formed in a body of semiconductor material having first and second surfaces opposite to one another. A first cavity extends in the body and delimits at the bottom a sensitive portion, which extends between the first cavity and the first surface of the body. The sensitive portion houses a second cavity and forms a membrane that extends between the second cavity and the first surface of the body. An elastic supporting structure extends between the sensitive portion and the body and is suspended over the first cavity.

An ultrasonic device according to an aspect of the present disclosure includes a substrate in which an opening section piercing through the substrate in a thickness direction is provided, a vibration plate provided on the substrate to close the opening section, a piezoelectric element provided in a position corresponding to the opening section on a first surface at the opposite side of the substrate side of the vibration plate, and an elastic layer provided in contact with a second surface at the substrate side of the vibration plate at the inner side of the opening section of the substrate. The elastic layer includes a curved surface recessed to the vibration plate side at the opposite side of the vibration plate side.

An ultrasonic element includes an element substrate including a first surface, a second surface having a front-back relation with the first surface, an opening section piercing through the element substrate from the first surface to the second surface, and a partition wall section surrounding the opening section, a supporting film provided on the first surface of the element substrate to cover the opening section and including a third surface facing the opening section and a fourth surface having a front-back relation with the third surface, a piezoelectric element provided on the fourth surface of the supporting film and disposed in a region overlapping the opening section of the supporting film in a plan view from a film thickness direction extending from the third surface to the fourth surface, a sealing plate provided to be opposed to the fourth surface of the supporting film and joined to the supporting film by an adhesive member via a beam section projecting toward the supporting film, and a wall section provided on the fourth surface of the supporting film and provided to project toward the sealing plate between the beam section and the piezoelectric element.

An ultrasound imaging device includes an ultrasound transducer module disposed within a housing and a flowable acoustic damping material disposed on at least one surface located within an interior of the housing. The flowable acoustic damping material may be a Teflon-containing gel material, in contact with at least one internal surface of the imaging device to provide acoustic damping.

An electronic device includes a substrate layer having a front surface and a back surface opposite the front surface, a plurality of ultrasonic transducers formed on the front surface of the substrate layer, wherein the plurality of ultrasonic transducers generate backward waves during operation, the backward waves propagating through the substrate layer, and a plurality of substrate structures formed within the back surface of the substrate layer, the plurality of substrate structures configured to modify the backward waves during the operation.

A method of manufacturing an array transducer arrangement, an array transducer arrangement for use in a high temperature environment, a method of manufacturing an array transducer arrangement for use in a high temperature environment, apparatus for selectively emitting ultrasonic waves in a high temperature environment, a method of producing a porous backing layer for a high temperature array transducer arrangement, and a backing layer for an array transducer arrangement are disclosed. The method of manufacturing an array transducer arrangement comprises: providing a piezoelectric layer; arranging a backing layer on a first face of the piezoelectric layer; and cutting a plurality of primary kerfs through the piezoelectric layer and into the backing layer to provide a plurality of piezoelectric elements; whereby the primary kerfs define a pitch of the plurality of piezoelectric elements.

A touch panel and a display apparatus include a backlight apparatus serving as a supporting substrate, a transparent protective plate that is arranged spaced apart from the backlight apparatus and includes an operating surface on an opposite side of the backlight apparatus; a plurality of vibrators for vibrating the transparent protective plate; and a resilient supporting member arranged between the backlight apparatus and the transparent protective plate to support the transparent protective plate and extend and contract diagonally across a thickness direction of the transparent protective plate.

A transducer assembly includes: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements; a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.

A backing element of a ultrasonic probe, a backing layer of a ultrasonic probe, and a manufacturing method thereof, the backing layer formed by arranging a plurality of members each having a shape of a polygonal column in a one-dimensional manner or in a two-dimensional manner while each of the plurality of members is provided with a conductive trace formed at one side surface thereof, thereby electrically connecting an ultrasonic transducer array, which is being acoustically connected to the backing layer, in a further simple and definite manner.

A piezoelectric actuator includes a vibrating plate including a first surface that closes an opening provided in a substrate and a second surface in which a plurality of piezoelectric elements is provided, a suppression part configured to suppress a vibration of the vibrating plate, and a first wall and a second wall protruding from the first surface to the opening. When a portion where the first electrode, the piezoelectric layer and the second electrode overlap each other is an active part of the piezoelectric element, the first wall and the second wall are provided to sandwich the active part in plan view from the stacking direction of the first electrode, the piezoelectric layer and the second electrode, and the second wall is different from the first wall at least in one of the width, height, length and physical property.