A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

A laser processing head includes first and second contact points connected to a power source. The power source generates a current to flow through an electrode wire between the first and second contact points to heat the electrode wire. A laser source generates one or more laser beams having lasing power sufficient to at least partially melt the electrode wire. A coaxial laser head focuses the one or more laser beams at one or more focal points on a workpiece to at least partially melt the electrode wire.

The invention relates to a device for generating laser radiation (3) having a linear intensity distribution (11), comprising a plurality of laser light sources for generating laser radiation (3) and optical means for transforming laser radiation (3) exiting from the laser light sources into laser radiation (14) that has a linear intensity distribution (11) in a working plane (9), wherein the laser light sources are constructed as fundamental mode lasers and the device is designed such that each of the laser beams (3) exiting from the laser light sources does not overlap with itself.

Disclosed is a method and device for generating additive manufacturing control data. The control data are generated such that the energy beam has an intensity distribution, at the area of incidence on the build field, in a see tion plane running perpendicularly to the beam axis of the energy beam, which intensity distribution has at least one local minimum in a middle region along at least one secant of the intensity distribution in the section plane and has an intensity profile curve, running along the edge of the intensity distribution, which intensity profile curve has, at least at one point, a maximum value, and, at least at one point in a region opposite the maximum value on the intensity profile curve, a minimum value.

A method for separating a workpiece includes providing a machining laser beam that forms a plurality of focusing elements, introducing the focusing elements into a material of the workpiece, and moving the focusing elements parallel to an advancing line relative to the material. Material modifications are formed in the material along a machining surface that protrudes with respect to a partial region of the workpiece in a preferred direction. The method further includes subjecting the material to a heating laser beam that is moved relative to the material along a heating laser beam advancing line, thereby separating the material along the machining surface. The heating laser beam advancing line runs parallel to and is spaced apart from the advancing line with a positional offset that is anti-parallel to the preferred direction. The positional offset is at least 10% and at most 50% of a diameter of the heating laser beam.

Systems for processing a workpiece are disclosed herein. The systems may include: a laser cutting head configured to produce a laser beam spot pattern comprising a plurality of laser beam spots, where at least two laser beam spots of the plurality of laser beam spots being disposed within the laser beam spot pattern symmetrically from a centerline defined by a cutting path for processing the workpiece. Methods of processing a workpiece are disclosed herein. The methods may include emitting, by a laser cutting head, a laser beam spot pattern comprising at least two laser beam spots, each disposed within the laser beam spot pattern and symmetrically positioned away from a centerline of a processing path of the workpiece; and removing portions of the workpiece using the laser beam spot pattern along the cutting path of the workpiece.

A laser system for generating a line beam includes a plurality of laser sources to generate a plurality of laser beams, light pipes arranged to transmit and homogenize the laser beams to transform the laser beams into homogenized laser beams, and relay optics to direct and image the homogenized laser beams from the light pipes onto a common focal plane, whereby the homogenized laser beams form a line beam that, in the common focal plane, includes images of the output ends of the light pipes stitched together along a line-axis of the line beam. Adjacent images in the common focal plane are non-overlapping while having overlapping projections onto the line-axis or onto another axis that is orthogonal to a transport direction of a workpiece through the line beam. The overlapping projections average defocusing-induced seam-effects over a larger region and thus lessen their impact on the laser irradiation process.