A tacrolimus drug-eluting stent manufacturing method according to the present invention enables a tacrolimus drug to be strongly and stably bound onto a stent, while also not necessarily involving a separate step of introducing a surface-binding functional group for the binding of a drug onto a stent and a step of introducing, into the drug, a functional group capable of binding to the surface-binding functional group, and a tacrolimus drug-eluting stent manufactured by the manufacturing method has a greater total drug elution amount and has a more excellent delayed drug-elution property.

Methods, systems, devices, and substrates are described. In some examples, an apparatus may include optical components configured to adjust an input to a laser cutting optic for modifying a substrate (e.g., an optically transmissive substrate). In some examples, the optical components may include a beam deflector, a first optic configured to output a first laser beam with a first beam width, and a second optic configured to output a second laser beam with a second beam width. In some examples, the beam deflector may modify an optical path of a pulsed laser (e.g., through the first optic or through the second optic), which may result in an input to the laser cutting optic having a beam width corresponding to the first optic or the second optic. The different input beam widths may modify a line focus intensity of an output of the laser cutting optic when modifying the substrate.

A cutting method of a mother substrate includes: irradiating a laser to the mother substrate at first intervals along a first cutting line overlapping dummy areas positioned adjacent to sides of each of display panel areas on the mother substrate; and irradiating the laser to the mother substrate at second intervals different from the first intervals along the first cutting line overlapping edge areas positioned adjacent to corner portions of each of the display panel areas.

A method is for manufacturing a stone, in particular for a timepiece, from a mineral body of monocrystalline or polycrystalline type. The method includes an ablation step in which the body is subjected to a material ablation by scanning on at least one face of the body using ultra-short pulse laser radiation whose duration is less than one hundred picoseconds, and whose beam is guided by a precession system having at least three axes to at least partially cancel the angle of the laser cone, which is due to the focusing of the laser. A mineral stone of monocrystalline or polycrystalline type, in particular for a horological movement, is likely to be obtained by the method. The stone includes in particular a face provided with a peripheral rim, in particular for laterally clamping an endstone in a bearing.

A molded body is a molded body that includes a marked surface provided on a portion of a surface of the molded body, and in which a plurality of recesses and a plurality of projections are alternately arranged at a predetermined pitch in a predetermined direction in a planar form. The marked surface has a high light absorption rate compared to an area of the molded body other than the marked surface and is a water-repellent surface having a water contact angle of at least 120° or a hydrophilic surface having a water contact angle of at most 60°.

An article includes a ceramic material and features a machined surface that is characteristic of cold ablation laser machining, and the machined surface exhibits no visible oxidation. A laser machining apparatus and technique is based on cold-ablation, but is modified or augmented with an inert assist gas, to minimize deleterious surface modifications and mitigate the oxide formation associated with laser machining.

A spacer wafer for producing spacers of electro-optical converter housings is provided. The spacer wafer is a transparent glass plate having a multiplicity of openings separated from one another and distributed in a grid so that singulated spacers are obtainable by severing sections of the glass plate along separating lines between the openings. The openings have side walls with microstructuring that has a roughness with an average roughness value R.sub.a of less than 0.5 μm with a measurement distance of 500 μm.

Systems and methods described for embossing micro-scale features are provided. On various substrates. Micro-scaled features can contain nanometer to micrometer structural features. Various embodiments may relate to methods and systems that may allow substrates, non-limiting examples of which may include metals such as silver, copper, tin, gold, or the like, to be embossed to diffract light into various colors that can be refracted at various perspective angles. High-quality grooves can be machined down to the sub-micron or nanometer regime to generate embossment moulds for fast, single-step, repeated (e.g. in the order of tens to thousands) replication of gratings on bulk metallic substrates using a same embossing die without significant loss of embossing quality.

A method for bonding two elements, the method including receiving first and second elements, the first element being a composite material; applying a laser-based treatment to a surface of the first element to obtain a treated surface; patterning the treated surface to have plural trenches; applying an adhesive to one of the first and second elements; and joining the first element to the second element so that the adhesive is between the first and second elements.

A substrate having a first side and a second side opposite to the first side is processed by attaching a protective film to the first side and, after attachment, processing the substrate from the second side of the substrate. After processing from the second side, the second side is inspected for defects on the second side of the substrate. After inspection for defects, a support film is attached to the second side of the substrate. The protective film is removed from the first side of the substrate and, after removing the protective film, the first side of the substrate is inspected for defects on the first side of the substrate.