An asset verification system, comprising: a reader comprising a holder configured to hold an asset in a tag-reading position, a light source consisting of at least one light to provide illumination to the asset, magnifying optics configured with an effective magnification for both sufficiently separating dots in a tag in the body of the asset and viewing the tag at an effective magnification greater than 10×, reflective optics for conveying an image of the tag through the reader, and, position controls for adjusting the positioning of the asset with respect to the magnifying optics; a multi-function hardware device comprising an optical sensor for reading the tag of the asset projected to the optical sensor by the reader; and, a database having information related to the asset including an association of the tag to the asset stored thereon.

A method of selectively removing at least part of a first phase from a surface of a nanocomposite includes at least a first phase and a second phase, each phase having a respective threshold fluence under a given number of applied laser pulses for removal of the phase by laser ablation. The threshold fluence of the first phase is less than the threshold fluence of the second phase. The method includes irradiating the surface of the nanocomposite with a laser beam having a laser beam diameter, a laser pulse duration, and a laser pulse energy during the irradiation. The laser fluence during the irradiation is less than the threshold fluence of the second phase and greater than the threshold fluence of the first phase. The laser beam diameter is greater than an average grain size of the first phase at the surface of the nanocomposite.

Embodiments of the present disclosure are directed to methods, systems and devices, for precise and reduced spot-size capabilities using a laser to alter surfaces without chemical treatment, chemical waste, or chemical residues is provided for microfluidic systems (e.g., lab-on-a-disk, for example). In some embodiments, hydrophobic and super-hydrophilic areas can be created on surfaces in the same material at different areas and positions merely by using different laser settings (e.g., spot size, wavelength, spacing, and/or pulse duration). Accordingly, capillary forces that are a recurrent issue in a microfluidic devices (e.g., a centrifugal microfluidic disk) can be controlled for practical applications, including, for example when users handle the disks and insert a sample, the moment the substrate/device (e.g., disk) is placed in a system (e.g., a centrifugal system), capillary forces can take place and move the fluids, which becomes a problem for sequential bioassays taking place in substrate/device (e.g., disk). Thus, in some embodiments, the systems, devices and methods increase fluid control in microfluidic devices.

The present disclosure provides a stealth dicing method and apparatus. With the method, the focusing element focuses the laser beam on the surface of material to be diced, and the dynamic-equilibrium plasma channel is formed in the material to be diced by means of self-focusing and defocusing effect of plasma generated by ionizing the material to be diced. The modified layer may be formed in the material to be diced throughout the plasma channel, so as to realize stealth dicing.

A method of processing a wafer having a plurality of devices provided in respective areas demarcated on a face side of the wafer by a plurality of projected dicing lines. The method includes coating the face side with a protective film agent and thereafter drying the protective film agent into a protective film covering the face side, applying a laser beam having a wavelength absorbable by the wafer to the wafer along the projected dicing lines on the face side, thereby producing a plurality of laser-processed slots in the wafer, cleaning away the protective film, applying ultraviolet rays to the face side to remove an organic substance deriving from the protective film and remaining on the face side, and covering coverage areas corresponding to the respective devices on the face side with an encapsulating resin.

The present application describes a laser turning system (1) for producing a timepiece component, the system including a rotary spindle (3) for moving a bar of material (50) and a galvanometric scanner (12) capable of emitting a femtosecond laser beam scanning a generating profile of the component to be machined in the bar of material (50).

A laser turning system (1) for producing a component (60) having a length less than 250 mm and/or a diameter less than 10 mm, the system including a rotary spindle (3) for moving a bar of material and a galvanometric scanner (12) capable of emitting a femtosecond laser beam scanning a generating profile of the component to be machined in the bar of material.

A substrate comprises glass, sapphire, silicon and/or aluminosilicate, and has at least one recess or through-opening. The at least one recess or through-opening is formed by anisotropic removal of substrate material by etching a portion of the substrate that has been modified by a pulse of laser radiation in a direction of a thickness of the substrate. The modified portion of the substrate extends along a beam axis of the laser radiation. The pulse of laser radiation was applied with a focus extending from a first focal depth positioned past one side of the substrate to a second focal depth located at an opposite side of the substrate.

A method using femtosecond laser for nano precision preparation. Initial damage nanoholes formed by using femtosecond laser multiphoton excitation are used as a seed structure, and the energy and polarization state of subsequent laser pulses are adjusted in real time, such that uniform and directional optical near-field enhancement is generated near the seed structure and finally the high-precision removal of machined materials is realized. Benefiting from the high localization of near-field spot energy in space, the method uses femtosecond laser pulses having the wavelength of 800 nm to achieve a machining accuracy having the minimum linewidth of only 18 nm, and the linewidth resolution reaches 1/40 of the wavelength; and the method using femtosecond laser for nano precision preparation does not need a vacuum environment, having good air/solution machining compatibility.

Systems, devices, and techniques for creating blind annular vias for metallized vias are described. For example, a vortex beam may be applied to an optically transmissive substrate, where the vortex beam may modify a portion of the substrate in an annular shape. The annular shape may extend from a surface of the substrate to a depth that is less than a thickness of the substrate, and the annular shape may have an annular width (e.g., a ring width) that is the same for various diameters of the annular shape. A blind annular via may be formed by etching the modified portion of the substrate, where the blind annular via may include a pillar comprising the same material as the surrounding substrate. In addition, a metallized annular via may be created by filling the blind annular via with a conductive material, and removing a portion of the substrate opposite the surface.