Systems and methods for the manufacture of a solid wire using additive manufacturing techniques are disclosed. In one embodiment, a fine powdery material is sintered or melted or soldered or metallurgically bonded onto a metal strip substrate in a compacted solid form or a near-net shape (e.g., a near-net solid wire shape) before being turned into a final product through forming or drawing dies.

A method includes depositing a plurality of dopant particles within a predetermined region of a transparent material. The method also includes focusing a laser beam along an optical axis to a focal region that overlaps with at least a portion of the predetermined region. The focal region can irradiate at least a first dopant particle of the plurality of dopant particles. The method further includes adjusting a parameter of the laser beam to generate a plasma configured to form an inclusion within the transparent material. The method additionally includes scanning the focal region along a path within the transparent material to elongate the inclusion generally along the path.

A method for forming at least one freestanding microstructure on a diamond crystal includes the step of removing material from the diamond crystal so as to form a structured surface, wherein the removing of the material includes creating at least two trenches, each trench having a bottom and two side walls and wherein adjacent side walls of the at least two trenches form side walls of the structured surface. The method also includes the steps of depositing at least one masking layer on the structured surface, removing at least a portion of the at least one masking layer from the bottom of each of the at least two trenches, removing additional material from the diamond crystal at least along the side walls so as to deepen the trenches, and undercutting the diamond crystal so as to form the freestanding microstructure.

A method and apparatus for substrate dicing are described. The method includes utilizing a laser to dice a substrate along a dicing path to form a perforated line around each device within the substrate. The dicing path is created by exposing the substrate to bursts of laser pulses at different locations around each device. The laser pulses are delivered to the substrate and may have a pulse repetition frequency of greater than about 25 MHz, a pulse width of less than about 15 picoseconds, and a laser wavelength of about 1.0 μm to about 5 μm.

Disclosed is a method for an all-laser hybrid additive manufacturing. After a matrix is obtained by means of selective laser melting forming, a subtractive forming is carried out on the matrix by means of a pulse laser to form a cavity, and the cavity is then packaged to obtain a forming material with an internal cavity structure. A laser precision packaging method is used in the method based on the melting of the laser selective region. Also disclosed is the apparatus, comprising a laser unit (2), a control unit (4) and a forming unit (6). The laser unit is in light path connection with the forming unit, and the control unit is electrically connected with the laser unit and the forming unit respectively. The laser unit comprises a first laser light source to and a second laser light source. The forming unit comprises a welding unit (68), and the welding unit is controlled by the control unit and is matched with the laser unit for the additive manufacturing.

A method for manufacturing a cutting tool according to one embodiment is a method for manufacturing a cutting tool, the cutting tool including a base material and a diamond single crystal material fixed to the base material, the diamond single crystal material having a rake face, a flank face continuous with the rake face, and a cutting edge formed by a ridgeline serving as a boundary between the rake face and the flank face. The method for manufacturing a cutting tool according to one form of the present disclosure includes a flank face irradiation step of applying a laser to the diamond single crystal material along the cutting edge from a side of the flank face. The laser has a pulse width of 1×10.sup.−12 seconds or less and a peak output of less than 1 W in the flank face irradiation step.

A method of producing a glass substrate having a hole is provided. The method includes preparing the glass substrate having a first surface and a second surface facing each other; forming a hole in the glass substrate with a laser; and annealing the glass substrate placed on a first support substrate having a thermal expansion coefficient whose difference from a thermal expansion coefficient of the glass substrate is less than or equal to 1 ppm/K, where the first support substrate is placed on a second support substrate having a thermal expansion coefficient of less than or equal to 10 ppm/K.

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber providing a treating space; a substrate support unit provided in the treating space; a window provided at a top of the chamber; and an optical module provided over the window and configured to transmit a laser beam to a substrate through the window, and wherein the optical module includes: a homogenizing optics configured to homogenize the laser beam to a uniform beam profile; and an imaging optics configured to control the size of the laser beam.

Embodiments of an ultrashort pulse laser marking apparatus for forming indelible identifiers on discreet consumable articles, and corresponding methods, are disclosed. An ultrashort pulse laser transmission element of the apparatus is configured to transmit a beam of laser energy toward a marking zone to form an optically-readable indelible identifier on discrete consumable articles. The beam may have a pulse duration less than 10 picosecond, and a wavelength of less than 1.5 microns. The consumable articles may comprise a photoreactive pigment configured to undergo a color change upon exposure to the beam of laser energy, and the indelible identifier may be defined by the color change. Alternatively or in addition, the optical readability may be at least in part by way of a primary pattern reflected light intensity being distinguishable from a baseline reflected light intensity or from a secondary reflected light intensity from a viewpoint outward of the article.

Systems and methods here may be used to support a laser eye surgery device, including a base assembly mounted to an optical scanning assembly via, a horizontal x axis bearing, a horizontal y axis bearing, and a vertical z axis bearing, mounted on the base assembly, configured to limit movement of the optical scanning assembly in an x axis, y axis and z axis respectively, relative to the base assembly, a vertical z axis spring, configured to counteract the forces of gravity on the optical scanning assembly in the z axis, and, mirrors mounted on the base assembly and positioned to reflect an energy beam into the optical scanning assembly no matter where the optical scanning assembly is located on the x axis bearing, the y axis bearing and the z axis bearing.