A method for separating and releasing a closed-form piece from a workpiece made of a brittle material is disclosed. A first pulsed laser-beam creates defects along the outline of the closed-form piece. A second laser-beam selectively heats the closed-form piece for a first time that is sufficient to initiate cracking between the defects. The heating is stopped for a period sufficiently long for the cracks to propagate completely between the defects. The second laser-beam is applied for a second time that causes melting and deformation of the closed-form piece. The deformation opens a gap between the closed-form piece and the rest of the workpiece, thereby allowing release of the closed-form piece.

A system and method is disclosed for forming a graded index (GRIN) on a substrate. In one implementation the method may involve applying a metal layer to the substrate. A fluence profile of optical energy applied to the metal layer may be controlled to substantially ablate the metal layer to create a vaporized metal layer. The fluence profile may be further controlled to control a size of metal nanoparticles created from the vaporized metal layer as the vaporized metal layer condenses and forms metal nanoparticles, the metal nanoparticles being deposited back on the substrate to form a GRIN surface on the substrate.

A method for shaping a thin-film photovoltaic cell module from a photovoltaic cell sheet according to a predetermined contour of the module, where the cell sheet includes a flexible substrate based on a polymer or metal foil and a photovoltaic stack including one or more photo-active layers arranged on a front surface of the substrate. The method includes: providing the cell sheet, directing a laser beam towards a rear surface of the substrate; creating, by the laser beam, a trench in the rear surface, the trench shaped according to the contour such that the cell sheet is “divided” in a first portion within the contour and a second portion outside the contour; affixing a handling tool to one of the portions of the cell sheet on the rear surface of the substrate; selectively separating the portions by displacing the handling tool and one portion relative to the other portion.

A method is provided for manufacturing a mold for injection molding, especially for injection molding of optical components of automotive lighting devices. The method includes at least the following steps: providing a mold body, laser milling a pattern into a surface of the mold body, and coating the surface of the mold body by electroless nickel plating.

This laser processing apparatus is for forming modified regions in an object, which includes a sapphire substrate having a C-plane as a main surface, along cutting lines by focusing laser light on the object, and is provided with a laser light source, a spatial light modulator, and a focusing optical system. The spatial light modulator performs aberration correction by a first aberration correction amount smaller than an ideal aberration correction amount when the modified region is formed along a first cutting line along an a-axis direction of the sapphire substrate, and performs aberration correction by a second aberration correction amount smaller than the ideal aberration correction amount and different from the first aberration correction amount when the modified region is formed along a second cutting line along an in-axis direction of the sapphire substrate.

A method and an apparatus for processing an object by generation of laser radiation as a collimated laser beam, influencing the intensity distribution and/or the phase progression over the cross section of the laser beam, splitting the laser beam into two partial beams, and deflection and focusing of the partial beams so that the partial beams are superimposed in a processing zone in the material of the object.

A method of manufacturing an electronic apparatus includes: providing a work substrate including a preliminary set module including an active area including a hole formation area; and a protective film covering at least one of an upper surface and a rear surface of the preliminary set module; radiating the laser beam to the work substrate from a first start point toward a moving path removing at least a portion of the work substrate to form a first start cutting line in the hole formation area, the moving path of the laser beam defined as a boundary between the hole formation area and the active area; radiating the laser beam along the moving path; and removing the hole formation area from the preliminary set module to form a module hole, wherein the first start cutting line forms a predetermined angle with respect to a tangential line of the moving path.

Proposed is a method of processing micro-holes formed in an upper mold used for adsorbing, transferring, and laminating a thin structure. The micro-holes drilled by setting n mono-layers in a thickness direction of the upper mold, applying the femtosecond pulsed laser beam onto a second mono-layer in a given pattern, processing the micro-holes at a thickness of the next mono-layer in a 2D manner, and sequentially applying the femtosecond pulsed laser beam to the mono-layers while lowering a focus of the laser in units of 1 /n. The femtosecond pulsed laser beam is applied along inner surfaces of the micro-holes, thereby adjusting a dimension of a diameter of each of the micro-holes to be processed, and improving surface roughness of each of the inner surfaces of the micro-holes. Surroundings of an inlet-side edge are chamfered or rounded to prevent generation of the burrs and damage to the thin film sheet.

A laser processing method includes a first step of irradiating a surface of a composite material with a laser to form a hole processing groove on the composite material by scanning first paths from an outside corresponding to an inner peripheral surface side of a through hole to be formed to an inside corresponding to a center side of the through hole to be formed, the first paths extending across a width direction of the hole processing groove; and a second step of irradiating and penetrating through the hole processing groove with the laser to form the through hole by scanning second paths from the outside to the inside after the first step, the second paths extending across the width direction of the hole processing groove. The laser used at the first step has a smaller heat input amount per unit time than the laser used at the second step.

A method for scribing transparent material with a laser is provided. The method includes providing relative movement between the laser and the transparent material, pulsing the laser at a first pulse repetition rate in a kHz range to establish a speed of scribing of the transparent material, and forming each of said first laser pulses with a series of second laser pulses having a second pulse repetition rate in a MHz range, wherein each of said second lasers pulses is formed from a series of third laser pulses having a third pulse repetition rate in a GHz range.