A laser cutting system for cutting articles, such as tubes, and method of using the same. The laser cutting system can cut slots, holes, and/or pores into each article or tube to form filtration tubes, for example. The system includes a delivery system for delivering a laser beam from a laser source, at least one mirror, a focusing objective lens, a gas source, and a delivery nozzle. A first stage holds each article in a longitudinal direction, and may rotate the article axially during delivery of the gas and laser beam towards the article and move the article longitudinally relative to the delivery nozzle. A second stage is provided in the system for moving the delivery nozzle relative to the article being held by the first stage. A controller controls actuation of the laser beam and the gas source, and movement of the first stage and the second stage.

In one embodiment, a surface has a laser-beam machined area including an array of micro-sized conical pillars that are arranged in orthogonal rows and columns across the surface and that extend upward, the conical pillars defining deep troughs between them that are configured to absorb electrons, electromagnetic radiation, or both, the conical pillars tapering from relatively wide bases to pointed tips, the conical pillars comprising outer surfaces that are covered with a plurality of nanoparticles.

A method for generating gigahertz bursts of laser pulses is provided, where: 1) time delay T2 of the delayed part with respect to the undelayed part of the input pulse is longer than a time period T1 between said input pulse and the next input pulse; 2) the bursts of output pulses have an incrementally increasing number of pulses; 3) intra-burst pulse separation inside the formed bursts is equal to T3=T2−T1 and corresponds to an ultra-high pulse repetition rate higher than 100 MHz. In another embodiment: 1) T2 is longer than M*T1, where M=2, 3, etc.; 2) output train of bursts is composed of bursts of pulses wherein M adjacent bursts have identical number of pulses; 3) T3 is equal to T3=T2−M*T1. The laser apparatus for implementing the method is provided.

A laser processing apparatus includes a semiconductor laser element, a waveform output unit for outputting input waveform data, a driver circuit for supplying a drive current having a time waveform according to the input waveform data to the semiconductor laser element, and a processing optical system for irradiating a processing object with laser light. The semiconductor laser element outputs the laser light in which two or more light pulse groups each including one or a plurality of light pulses are provided with a time interval therebetween. Time waveforms of at least two light pulse are different from each other. The time waveform includes at least one of a time waveform of each of the one or plurality of light pulses, a time width of each of the one or plurality of light pulses, and a time interval of the plurality of light pulses.

An electrochemical, media-guiding system, a contact element for electrically and mechanically contacting such a plate, and a transmission device containing such a contact element. The present disclosure further relates to the production of such a plate or such a contact element. A plate having at least one contact point forming a voltage take-off point, a current supply point, and/or a current take-off point. The at least one contact point having a laser-surface-treated region.

Additive manufacturing can include use of a laser-machining technique. Laser machining can be used to form cavities, trenches, or other features in an additively-manufactured structure. Spectroscopy can be performed to monitor a laser machining operation. For example, a laser-enhanced additive manufacturing process flow can include depositing a conductive layer on a surface of a dielectric layer, and conductively isolating a first region from a second region of the conductive layer using ablative optical energy, including applying ablative optical energy to the conductive layer, monitoring a spectrum of an ablative plume generated by applying the ablative optical energy, and controlling the ablative optical energy in response to a characteristic of the spectrum of the ablative plume.

A laser beam irradiation unit of a laser processing apparatus includes: a laser oscillator in which a repetition frequency is set so as to oscillate a pulsed laser having a pulse width shorter than a time of electronic excitation caused by irradiating the workpiece with a laser beam and oscillate at least two pulsed lasers within the electronic excitation time; a condenser that irradiates the workpiece held on the chuck table with the pulsed laser beams oscillated by the laser oscillator; and a thinning-out unit that is disposed between the laser oscillator and the condenser and guides the pulsed laser beams necessary for processing to the condenser by thinning out and discarding pulsed laser beams in a predetermined cycle.

A method of fiber laser processing of thin film deposited on a substrate includes providing a laser beam from at least one fiber laser which is guided through a beam-shaping unit onto the thin film. The beam-shaping optics is configured to shape the laser beam into a line beam which irradiates a first irradiated thin film area Ab on a surface of the thin film, with the irradiated thin film area Ab being a fraction of the thin film area Af. By continuously displacing the beam shaping optics and the film relative to one another in a first direction at a distance dy between sequential irradiations, a sequence of uniform irradiated thin film areas Ab are formed on the film surface defining thus a first elongated column. Thereafter the beam shaped optics and film are displaced relative to one another at a distance dx in a second direction transverse to the first direction with the distance dx being smaller than a length of the irradiated film area Ab. With the steps performed to form respective columns, the elongated columns overlap one another covering the desired thin film area Af. The dx and dy distances are so selected that that each location of the film area Af is exposed to the shaped laser beam during a cumulative predetermined duration.

A system comprising a beam source (110) and an optical system (304) comprising first and second portions. The system further comprises first and second torque motors integrated into respective ones of the first and second portions, The first torque motor (420) is configured to rotate first portion (416) around a first axis (434). The second torque motor (426) is configured to rotate second portion (418) around a second axis (436). The first axis is perpendicular to the second axis.

Laser ablation processing method for debris-free and efficient removal of materials comprises the step of using a refrigeration device to condense the water vapor and form a thin frost layer on the materials at temperatures below the freezing point. The residual debris produced during the ablation process deposits on the frost layer that covers the material, which is easily removed when the frost layer melts. At the same time, the frost layer in the laser irradiation area melts to a liquid layer, which can effectively reduce the deposition of debris on the inner wall of the groove and thus improve the efficiency and quality of laser ablation. The method is applicable to debris-free laser processing on an arbitrary curved surface.