A method of producing a light control sheet includes forming a multilayer laminate in which a light control layer comprising a liquid crystal composition is sandwiched between a first transparent conductive layer formed on a first transparent support layer and a second transparent conductive layer formed on a second transparent support layer, and conducting laser irradiation to the multilayer laminate such that a laser beam penetrates one of the first and second transparent support layers located closer to a laser source than the first transparent conductive layer, and that an insulating portion is formed in the first transparent conductive layer.

A maintenance management method for a lithography system according to a viewpoint of the present disclosure includes organizing and saving operating information for each of lithography cells that are each an apparatus group formed of a set of apparatuses and form the lithography system, organizing and saving maintenance information on consumables for each of the lithography cells, calculating a standard maintenance timing for each of the consumables for each of the lithography cells based on the operating information and the maintenance information on the consumable for each of the lithography cells, creating a maintenance schedule plan for each of the lithography cells or for each of manufacturing lines based on the standard maintenance timing, information on a downtime, and information on a loss cost due to the downtime for each of the lithography cells or for each of the manufacturing lines, and outputting the result of the creation of the maintenance schedule plan.

A method of processing a substrate includes placing a mask on a top surface of a processing substrate, the mask including openings, placing a cover substrate on the mask, the cover substrate overlapping the openings of the mask, placing the processing substrate on a vessel that accommodates an etching solution, and irradiating a beam onto the top surface of the processing substrate to form processing holes in the processing substrate, where a bottom surface of the processing substrate contacts the etching solution.

The invention relates to a method for laser welding a first component to a second component, comprising: placing the first component on the second component; applying a welding mask comprising a flat contact surface to the first component to press the first component onto the second component, the welding mask comprising a through-passage for a laser beam, defining a welding area on the first component, the contact surface at least partially surrounding said passage; emitting a laser beam by a head into the passage of the welding mask, to form a weld bead joining the first component to the second component in the welding area; wherein the welding mask is rigid and rigidly joined to the laser head and the focal length of the laser is constant, the constant focal length being ensured by the rigid mask.

A device for recording information in a data carrier, comprising a data carrier receptacle for partially receiving the data carrier in a planar manner; a data carrier cover arranged relative to the data carrier receptacle, which is designed for holding the data carrier between the data carrier receptacle and the data carrier cover; a laser source for the controlled emission of a laser beam designed to effect irreversible changes of the data carrier with the laser beam; and a mount that receives the data carrier receptacle to be pivotable about a pivot axis. The data carrier receptacle has two or more positions, that allow the data carrier receptacle to be received in the mount in such a way that the data carrier receptacle can be repositioned about the pivot axis in a pivotable manner.

Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of dicing a semiconductor wafer having a plurality of integrated circuits involves forming a mask above the semiconductor wafer, the mask composed of a layer covering and protecting the integrated circuits. The mask is then patterned with a uniform rotating laser beam laser scribing process to provide a patterned mask with gaps, exposing regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then plasma etched through the gaps in the patterned mask to singulate the integrated circuits.

Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of dicing a semiconductor wafer having a plurality of integrated circuits involves forming a mask above the semiconductor wafer, the mask composed of a layer covering and protecting the integrated circuits. The mask is then patterned with a uniform rotating laser beam laser scribing process to provide a patterned mask with gaps, exposing regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then plasma etched through the gaps in the patterned mask to singulate the integrated circuits.

This disclosure provides a mask module, a method for manufacturing a film layer, and a method for manufacturing an organic electromagnetic light-emitting display panel. The mask module is configured to manufacture a display substrate. The display substrate has at least one display area. The display area has at least one island pattern. The mask module includes at least two open type masks. Each of the open type masks has an opening area corresponding to at least one of the display areas. The opening areas of the open type masks corresponding to the same display area are not overlapped with each other, and the open type masks are stitched to constitute a joint and a blocking structure. The joint has a shape as same as that of the display area, and the blocking structure has a shape as same as that of the island pattern.

A mask sheet and a method for manufacturing the same are provided. A mask sheet includes one or more openings defined therein, and an alloy of nickel and iron, and a particle of the alloy has a single crystalline structure. A method for manufacturing a mask sheet includes preparing a base sheet including an alloy of nickel and iron, performing a heat treatment on the entire base sheet; and forming one or more openings in the heat-treated base sheet.

In a method of processing a substrate, in a second step, only some of a plurality of altered portions are exposed from an opening portion of a mask, and the remaining portions are not exposed. In this case, at the time of etching in a third step, an etching rate may be made different between the altered portions exposed from the opening portion of the mask and the altered portions which are not exposed. Accordingly, it becomes easier to obtain a desired processed shape by adjusting the altered portions exposed from the opening portion of the mask and the altered portions which are not exposed.