A flexible printed circuit board and a method of manufacturing the same are disclosed. A flexible printed circuit board having a flexible region and a rigid region includes an inner board layer, an outer board layer laminated on the inner board layer and having a cavity formed in the rigid region, and a laminate exposing a pad in the cavity and laminated on the inner board layer in the rigid region where the pad is formed. The laminate includes a coverlay layer and a copper foil layer arranged so that the coverlay layer faces the inner board layer.

A method of manufacturing a mask includes forming a first protection layer on a first surface of a mask member, the first protection layer comprising first through-holes exposing portions of the first surface; radiating, through the first through-holes, a laser beam onto the exposed portions of the first surface to form blind holes in the mask member; and providing an etchant to form second through-holes in the mask member, the second through-holes comprising the blind bores and extending from the first surface to a second surface of the mask member opposing the first surface.

The disclosure relates to a display device and a method for manufacturing the display device. A display device includes a display panel including a plurality of light-emitting areas and a plurality of non-light-emitting areas arranged alternately with each other in a row direction and/or a column direction; a plurality of light-emitting elements disposed in the light-emitting areas of the display panel and arranged in a plurality of rows and a plurality of columns; and a plurality of micro keys disposed in the non-light-emitting area between the light-emitting areas adjacent to each other in the row direction and/or the column direction.

A method of marking information on a substrate for use in a semiconductor component is provided. The method comprises providing a substrate for use in a semiconductor component, providing a metal layer on a surface of the substrate, and providing a marking within the metal layer. A method of making a die, a radio-frequency module and a wireless mobile device; as well as a substrate, a die, a radio-frequency module and a wireless mobile device is also provided.

A welding mask according to an embodiment of the present disclosure includes a welding mask body having a laser passage portion configured to allow a laser emitted into a housing of a battery cell to pass therethrough, the welding mask body configured to cover an open portion on a side of the housing; and an insertion guide having a hollow structure, connected to the laser passage portion, and configured to be inserted into a winding center hole of an electrode assembly received in the housing.

The laser reflow apparatus of the present invention comprises a laser pressurization head module for pressing a bonding object, which includes a plurality of electronic components arranged on a substrate by a transmissive pressurization member while irradiating a laser beam through the pressurization member, to bond the electronic components to the substrate; and a bonding object transfer module for transferring the bonding object having transferred from one side of the laser pressurization head module to carry the bonding object to the other side thereof after passing through a reflow process of the laser pressurized head module.

A method for processing a workpiece by laser ablation, which includes: a) preparing a mask with a plurality of mask patterns, the plurality of mask patterns having widths corresponding to a sub-scanning direction, the widths being different from one another; b) scanning a line-shaped laser beam over said mask; c) projecting a pattern beam that passes through the mask onto a workpiece; and d) processing a processing area of the workpiece by using the plurality of mask patterns repeatedly to form a processed pattern at the bottom of the processing area.

A method of marking information on a substrate for use in a semiconductor component is provided. The method comprises providing a substrate for use in a semiconductor component, providing a metal layer on a surface of the substrate, and providing a marking within the metal layer. A method of making a die, a radio-frequency module and a wireless mobile device; as well as a substrate, a die, a radio-frequency module and a wireless mobile device is also provided.