A method for producing a document structure, wherein the method includes producing a chip structure by forming a cavity in a carrier having a top side and an under side, picking up a chip having at least one chip contact and a redistribution layer (RDL) connected to the at least one chip contact by means of a picking-up device detaching the chip from an auxiliary carrier, wherein the chip bears on the auxiliary carrier by way of the RDL, wherein the chip is lifted up from the auxiliary carrier by means of pressure being exerted on the RDL, wherein the lifted-up chip is picked up and inserted into the cavity, and wherein the RDL is oriented on the top side of the carrier, fixing the chip in the cavity by means of an adhesive, electrically conductively connecting the at least one chip contact of the RDL to an electrically conductive region of the carrier by means of an electrically conductive material, and embedding the carrier between a first paper layer and a second paper layer.

An isolator includes a substrate, a first chip, and a second chip. The substrate includes an insulation layer and a pair of coils. The pair of coils are opposite to each other in a thickness direction via the insulation layer. The first chip is disposed to face one surface of the substrate. The first chip is connected to one of the pair of coils. The second chip is disposed to face the other surface of the substrate. The second chip is connected to the other of the pair of coils.

Analyte sensor devices and methods for fabricating analyte sensor devices are presented here. In accordance with certain embodiments, a device for detecting and/or measuring one or more analytes in fluid includes a substrate and one or more analyte sensors disposed on and/or in the substrate. Further, the device includes an integrated circuit disposed on and/or in the substrate. The integrated circuit is electrically integrated with the analyte sensors.

A chip on film package according to one embodiment of the present disclosure includes: a base film; a wiring unit located on the base film; a semiconductor chip mounted on the wiring unit; a first heat dissipation unit configured to come into contact with the semiconductor chip; a second heat dissipation unit configured to come into contact with the first heat dissipation unit, and comprise a metal; and an adhesive unit configured to attach the base film on which the wiring unit is located and the semiconductor chip is mounted to the second heat dissipation unit with the first heat dissipation unit therebetween.

An embedded packaging structure and a manufacturing method thereof are disclosed. The method includes: providing a bearing plate with a first metal seed layer; processing on the first metal seed layer to obtain a substrate; removing the bearing plate to obtain the substrate, and processing on the substrate to obtain a first and a second cavities penetrating therethrough; assembling a first component in the first cavity, assembling a connecting flexible board in the second cavity, processing on a second side of the substrate to obtain a second insulating layer; processing on a first side of the substrate to obtain a second circuit layer, assembling a second component on the second circuit layer; bending the substrate through the connecting flexible board to form an included angle less than 180 degrees on the first side, and packaging the first side by using a packaging material to obtain a packaging layer.

Provided is a display device including a display panel, a circuit board electrically coupled to the display panel, and an adhesive layer between the display panel and the circuit board. The display panel includes a base substrate including a display region and a non-display region adjacent to the display region, a driving chip mounted on the non-display region, and a plurality of display pads on the non-display region, and electrically coupled to the driving chip and the circuit board. The driving chip may be provided in an opening defined in the adhesive layer, and a thickness of the driving chip may be smaller than a thickness of the adhesive layer.

In one aspect, the present disclosure relates to an electronic device comprising: a plurality of electronic chip components; a plurality of liquid metal (LM) electrical interconnects coupled to the plurality of electronic chips; and a polyimine film encapsulating the plurality of electronic chip components and the plurality of LM electrical interconnects. In some embodiments, the polyimine film comprises the product of the polymerization reaction between terephthaldehyde, 3,3diamino-N-methyldipropylamine, and tris(2-aminoethyl)amine. In another aspect, the present disclosure relates to a method for manufacturing an electronic device, the method comprising: disposing a volume of LM on a polyimine substrate to form a plurality of electrical interconnects; disposing a plurality of electronic chip components onto the polyimine substrate and in contact with the plurality of electrical interconnects; and applying a layer of polyimine onto the polyimine substrate, the plurality of electrical interconnects, and the plurality of electronic chip components.

A foldable micro-light-emitting diode (microLED) display includes a flexible supporting film, a plurality of drivers and a plurality of display panels attached to the supporting film. Each display panel includes a plurality of blocks each having a plurality of microLEDs controlled by a corresponding driver.

A flexible display module and an electronic device are provided. The flexible display module includes a flexible substrate and a plurality of pixel units. The flexible substrate has a folding region that is provided with a first gap. The first gap extends from a first side surface to a second side surface in a thickness direction of the flexible substrate. A first preset distance is reserved between one end of the first gap and the second side surface of the flexible substrate. The first gap penetrates through the flexible substrate along a lengthwise direction or a width direction of the flexible substrate. A plurality of pixel units are distributed on the first side surface of the flexible substrate at intervals. The pixel units adjacent to the first gap are spaced apart from the first gap.