A variety of footed and leadless semiconductor packages, with either exposed or isolated die pads, are described. Some of the packages have leads with highly coplanar feet that protrude from a plastic body, facilitating mounting the packages on printed circuit boards using wave-soldering techniques.

According to the various aspects, a method is provided for dicing a semiconductor panel having a glass core with topside build-up (BU) layers, backside BU layers, and interconnects. In an aspect, a hard mask is deposited on the semiconductor panel and patterned to form openings for a plurality of cut-streets. In an aspect, the dicing of the semiconductor panel includes using plasma dicing steps to form cut-streets through the topside BU layers and the backside BU layers, and using a mechanical sawing step or plasma dicing step to cut through the glass core. In another aspect, the dicing of the semiconductor panel further includes using an acid rinse to remove metal salts when cutting through the glass core during the plasma dicing step. In another aspect, a singulated die may have a first BU sidewall and a second BU sidewall having a morphology that includes semi-sphere fillers.

In an embodiment a housing includes a first leadframe part and a second leadframe part and a housing body mechanically connecting the first and second leadframe parts to one another, wherein each first and second leadframe part has a mounting area on an inner side and each has an outer side opposite the inner side, wherein the first leadframe part has at least one solder control point and the second leadframe part has at least two solder control points, wherein each solder control point is formed as a recess at an associated outer side and is accessible from an outer side wall of the housing, and wherein the solder control points of the second leadframe part and the at least one solder control point of the first leadframe part are located on mutually opposite outer side walls of the housing body and are arranged completely offset relative to one another so that the solder control points are free of an overlap in a direction parallel to a main axis.

A method of using an apparatus to deform a J-shaped lead of a packaged semiconductor device, wherein the J-shaped lead comprises a straight extended portion, a straight lead portion and a curved tip portion, wherein the J-shaped lead extends from the packaged semiconductor device by the straight extended portion along a first direction, wherein the straight lead portion is connected between the straight extended portion and the curved tip portion, and wherein the curved tip portion is curved toward a direction perpendicular to the first direction, the method comprising: moving a force component of the apparatus along a second direction; and converting the movement of the force component along the second direction into a movement of a pusher component of the apparatus along a third direction by means of a transfer mechanism. An apparatus for deforming a J-shaped lead of a packaged semiconductor device is also presented.

According to one embodiment, a semiconductor device includes a semiconductor element provided on a first surface of a lead frame; a package member provided on the lead frame and on the semiconductor element and having a first concave part; and a first terminal provided in the first concave part and extending in a first direction that is parallel to the first surface of the lead frame. The first concave part has a concave shape having a first length in the first direction, a second length in a second direction perpendicular to the first surface of the lead frame, and a third length in a third direction perpendicular to the first direction and the second direction. The third length is shorter than a length of the package member in the third direction.

A method for manufacturing a singulated semiconductor product from a package is provided, and includes the steps of a) providing the bottom frame with the clip matrix with a semiconductor component and placing them in a mold cavity, b) closing the mold, c) moving retractable pins through openings in the mold, so that the tips of the pins come into contact with the tie bars or the clip tie-bars of the clip matrix, d) performing the molding operation using the encapsulating material, e) retracting the pins away from the package, f) opening the mold, g) removing the package from the mold, and h) singulating the package into a separate product by sawing along and trimming the microleads. With the above steps at least one encapsulated and singulated semiconductor product is formed, that has notches formed on the sides thereof, that expose either tie bars or clip tie-bars.

An electronic device package includes a frame, an electronic device mounted to the frame, surface-mount leads, and a gel at least partially filling a cavity between the electronic device and the frame. The electronic device includes electronic circuitry provided on an electronic device substrate, and the surface-mount leads are electrically connected to the electronic circuitry and extend laterally and outwardly from an outer perimeter of the frame. The gel in the cavity covers the electronic circuitry.

An electronic device includes a lead with a first portion that extends outward from a package structure and is coated with a dielectric film that extends to the side of the package structure, and an uncoated second portion that extends from the first portion to an end of the lead. A method includes forming a package structure to enclose an interior portion of a lead structure and coating an exterior first portion of the lead structure with a dielectric film that extends to a side of the package structure and leaving an exterior second portion of the lead structure uncoated.

In examples, a semiconductor package includes a semiconductor die having a device side in which circuitry is formed and a non-device side opposite the device side. The package includes a die attach film contacting the non-device side of the semiconductor die; a first conductive terminal contacting the die attach film, the semiconductor die cantilevered by the first conductive terminal; a second conductive terminal separated from the die attach film, the first and second conductive terminals configured to operate in different voltage domains; bond wires coupling the device side of the semiconductor die to the first and second conductive terminals; and a mold compound contacting the semiconductor die, the die attach film, the first and second conductive terminals, and the bond wires, the mold compound present in between the die attach film and the second conductive terminal, each of the first and second conductive terminals exposed from at least one lateral surface of the mold compound.