In a method, a resist material is dispensed through a tube of a nozzle of a resist pump system on a wafer. The tube extends from a top to a bottom of the nozzle and has upper, lower, and middle segments. When not dispensing, the resist material is retracted from the lower and the middle segments, and maintained in the upper segment of the tube. When retracting, a first solvent is flown through a tip of the nozzle at the bottom of the nozzle to fill the lower segment of the tube with the first solvent and to produce a gap in the middle segment of the tube between the resist material and the first solvent. The middle segment includes resist material residues on an inner surface wall of the tube and vapor of the first solvent. The vapor of the first solvent prevents the resist material residues from drying.

Provided is a substrate processing apparatus capable of effectively removing contaminants in an edge region of a substrate. The substrate processing apparatus comprises: a support configured to rotate a substrate; a first bath installed around the support and configured to store a cleaning liquid and form a first opening on an upper surface thereof; and a first ultrasonic oscillator installed in the first bath and configured to provide an ultrasonic wave towards a surface of the cleaning liquid exposed by the first opening and form a first water film protruding from the surface of the cleaning liquid, wherein the substrate is not immersed in the first bath, and the edge region of the substrate is cleaned by the protruding first water film while rotating the substrate by the support.

Apparatus and techniques are described herein for use in manufacturing electronic devices, such as can include organic light emitting diode (OLED) devices. Such apparatus and techniques can include using one or more modules having a controlled environment. For example, a substrate can be received from a printing system located in a first processing environment, and the substrate can be provided a second processing environment, such as to an enclosed thermal treatment module comprising a controlled second processing environment. The second processing environment can include a purified gas environment having a different composition than the first processing environment.

A substrate transfer method performed in a substrate processing apparatus including a transfer mechanism group configured to transfer a substrate into a carrier via a module group and an exposure apparatus is provided. The transfer mechanism group includes a first transfer mechanism configured to transfer the substrate in an order of a pre-stage module, the exposure apparatus, and a first post-stage module, and a second transfer mechanism configured to transfer the substrate in an order of the first post-stage module, a heating module, a developing module, and a second post-stage module, and a post-stage transfer mechanism. The substrate transfer method includes acquiring a section transfer time required to transfer the substrate to a next transfer section; and performing a carry-in or a carry-out of the substrate into/from the exposure apparatus based on a maximum section transfer time, which is the longest in the acquired section transfer times.

A substrate treating apparatus includes a treatment housing, a holder, and a liquid supplying unit. The holder is accommodated in the treatment housing. The holder holds a substrate. The liquid supplying unit is accommodated in the treatment housing. The liquid supplying unit supplies a treating liquid to the substrate held by the holder. The substrate treating apparatus further includes two exhaust pipes. The exhaust pipes are each located on a lateral side of the treatment housing. The exhaust pipes each exhaust gas. The substrate treating apparatus includes a switching mechanism. The switching mechanism is located at a level equal to that of the treatment housing. The switching mechanism switches an exhaust path of the treatment housing to one of the two exhaust pipes.

According to one embodiment, a semiconductor manufacturing device includes a processing chamber that accommodates a substrate, a support that supports the substrate, a nozzle that supplies a resist material onto the substrate, a first temperature regulator, and a second temperature regulator. The first temperature regulator is attached to the support and the second temperature regulator is attached to the processing chamber, At least one of the first temperature regulator or the second temperature regulator forms a resist film from the resist material by regulating a temperature of the resist material.

A dispensing system includes a dispense material supply that contains a dispense material and a dispensing pump connected downstream from the dispense material supply. The dispensing pump includes a body made of a first electrically conductive material, one or more first electrical contacts that are disposed on the body of the dispensing pump, and one or more first connection wires that are coupled between each one of the one or more first electrical contacts and ground. The dispensing system also includes a dispensing nozzle connected downstream from the dispensing pump and includes a tube made of a second electrically conductive material, one or more second electrical contacts that are disposed on an outer surface of the tube, and one or more second connection wires that are coupled between each one of the one or more second electrical contacts and the ground.

The present disclosure describes a lithography apparatus comprising a photoresist coating unit configured to perform one or more coating processes on a substrate. The lithography apparatus further comprises a detection unit configured to determine a contamination level of a contaminant from the one or more coating processes adheres on a sidewall of the lithography apparatus. The lithography apparatus further comprises a controller unit configured to adjust one or more operations of the lithography apparatus based on a comparison between the contamination level and a baseline cleanliness requirement of the lithography apparatus.

A liquid trap tank and a liquid supply unit for the liquid trap tank are provided. The liquid trap tank includes a tank body which has an accommodating space formed therein to accommodate a liquid and has an inlet portion formed on one side and an outlet portion formed on an opposite side; and a liquid supply unit coupled to the inlet of the tank body to supply the liquid from the outside of the tank body to the accommodating space, wherein the liquid supply unit comprises an inlet pipe portion coupled to the inlet portion to introduce the liquid into the accommodating space and a flow directing portion connected to the inlet pipe portion and configured to induce a flow of the liquid to suppress generation of air bubbles due to a drop of the liquid passing through the inlet pipe portion.

The invention includes a gas supplier for discharging a gas into a space sandwiched between a substrate and a shielding plate by supplying the gas to a gas discharge nozzle provided in the shielding plate to form a flow of the gas from a central part toward a radially outer side of the substrate. This gas supplier is controlled such that a flow velocity of the gas into a discharge space at a peripheral edge part of the substrate becomes larger than zero.