A wet-processing dark laboratory for scientific research includes a laboratory body, a wet-processing equipment, a transfer robot, a sample supplying and storing apparatus, a chemical supplying and storing apparatus, and a control apparatus. The laboratory body is configured to provide a clean space. The transfer robot includes a moving device, a mechanical arm device, at least one end effector, and an accompanying device. The accompanying device can move with the moving device and provide a temporary storage space. The mechanical arm device is mounted on the moving device. The at least one end effector is mounted on the mechanical arm device for grasping a semiconductor sample and/or a chemical tank. The above design enables 24/7 experiments conduction without the need for human presence, which forms a dark laboratory.

Proposed are article storage equipment in a semiconductor fabrication facility, the article storage equipment being capable of power supply with a more simplified configuration, and a logistics system of a semiconductor fabrication facility including the same. Article storage equipment in a semiconductor fabrication facility according to one aspect includes a storage unit installed around a rail that provides a travel route of a transport vehicle and configured to store a transport container in which a wafer is accommodated, a purge unit configured to supply an inert gas into the transport container, a control unit configured to identify the transport container stored in the storage unit and control the purge unit to supply the inert gas into the transport container, and a power supply unit configured to supply a current induced from a power supply cable installed along the rail to the control unit.

System and method for cross-fab wafer transportation are provided. A method includes providing a first FAB building and a second FAB building connected via a bridging area, the second FAB building comprising fabrication tools configured to perform fabrication processes different than fabrication processes performed by fabrication tools in the first FAB building, after performing fabrication processes in the first FAB building, configuring a first vehicle of the first FAB building to travel along a first OHT track and take the wafer to the bridging area, configuring a second vehicle of the second FAB building to travel along a second OHT track and arrive at the bridging area, where a portion of the first OHT track is in parallel with a portion of the second OHT track at the bridging area, when some predetermined conditions are met, configuring the first vehicle to transfer the wafer to the second vehicle.

Provided are a transfer unit and a substrate treatment apparatus which can stably vacuum-adsorb a substrate and can be used for a long time. The transfer unit includes: a robot arm; and an end effector connected to the robot arm, wherein the end effector includes: a body; a vacuum hole formed in the body; and a pad installed on the body to surround the vacuum hole and including a first pad layer and a second pad layer stacked sequentially, wherein the first pad layer has greater elasticity than the second pad layer, and the second pad layer has greater hardness than the first pad layer.

To provide a transport robot 1 including a first hand including a chuck mechanism to clamp and hold an outer peripheral end portion of a workpiece, and a first movement mechanism to move the first hand to an advancing position where the workpiece contained in the cassette case can be held and to a retreating position farther from a cassette case than the advancing position, in which when a direction connecting the retreating position and the advancing position is defined as an X direction, a direction from the retreating position toward the advancing position is defined as an X1 direction, and a direction from the advancing position toward the retreating position is defined as an X2 direction, a chuck mechanism includes a chuck portion openable and closable vertically, and a movement mechanism to move the chuck portion into the X direction.

Provided is an apparatus of processing a substrate. The apparatus includes: a first module; a second module; and a buffer chamber disposed between the first module and the second module and temporarily storing a substrate transferred between the first module and the second module. The transfer chamber includes: a housing providing an inner space; a support unit including a plurality of support plates supporting the substrate in the inner space; a plurality of shower plates having an injection hole for injecting the gas to the substrate supported by the support unit; and a gas supply unit for supplying the gas to the shower plate, and the support plates are provided in a stacked structure, and each of the shower plates is provided to correspond to each of the support plates.

An EFEM is provided with a circulation path including a substrate transfer space formed inside a housing and a return path configured to return gas flowing from one side to the other side of the substrate transfer space, the EFEM including: a partition wall configured to separate the substrate transfer space and the return path; a capture part provided in the return path having a higher pressure than the substrate transfer space in a state in which the gas circulates through the circulation path, and configured to capture particles contained in the gas flowing through the return path; and a connecting pipe configured to guide the gas flowing inside a predetermined device arranged in the substrate transfer space to the return path, wherein the connecting pipe is connected to the return path on an upstream side of the capture part in a gas flow direction.

A closed gas circulation system may include a sealed plenum, circulation fans, and a fan filter unit (FFU) inlet to contain, filter, condition, and re-circulate a gas through a chamber of an interface tool. The gas provided to the chamber is maintained in a conditioned environment in the closed gas circulation system as opposed to introducing external air into the chamber through the FFU inlet. This enables precise control over the relative humidity and oxygen concentration of the gas used in the chamber, which reduces the oxidation of semiconductor wafers that are transferred through the chamber. The closed gas circulation system may also include an air-flow rectifier, a return vent, and one or more vacuum pumps to form a downflow of collimated gas in the chamber and to automatically control the feed-forward pressure and flow of gas through the chamber and the sealed plenum.

A wet-processing dark laboratory for scientific research includes a laboratory body, a wet-processing equipment, a transfer robot, a sample supplying and storing apparatus, a chemical supplying and storing apparatus, and a control apparatus. The laboratory body is configured to provide a clean space. The transfer robot includes a moving device, a mechanical arm device, at least one end effector, and an accompanying device. The accompanying device can move with the moving device and provide a temporary storage space. The mechanical arm device is mounted on the moving device. The at least one end effector is mounted on the mechanical arm device for grasping a semiconductor sample and/or a chemical tank. The above design enables 24/7 experiments conduction without the need for human presence, which forms a dark laboratory.