Described is an apparatus for wafer handling and alignment. The apparatus can be used for at least handling and aligning wafers for subsequent processing by inspection stations or metrology instruments. The apparatus can include at least an end effector module, a pluck module, an alignment module, a chuck module, and a controller module.

A method for implementing a thin film deposition process includes: transporting a substrate into a first chamber; feeding a precursor into the first chamber, the precursor being adsorbed on a top surface of the substrate; supplying radiant energy to at least a part of the top surface of the substrate to facilitate reaction between the precursor and the top surface of the substrate; transporting the substrate with the top surface being precursor-adsorbed into a second chamber that is separated from the first chamber and that is spatially isolated from the first chamber; feeding a reactant into the second chamber, wherein reaction between the reactant and the precursor results in a thin film forming on the top surface.

A substrate transport apparatus including a frame, a substrate transport arm connected to the frame, the substrate transport arm having an end effector, and a drive section having at least one motor coupled to the substrate transport arm, wherein the at least one motor defines a kinematic portion of the drive section configured to effect kinematic motion of the substrate transport arm, and the drive section includes an accessory portion adjacent the kinematic portion, wherein the accessory portion has another motor, different and distinct from the at least one motor, the another motor of the accessory portion is operably coupled to and configured to drive one or more accessory device independent of the kinematic motion of the substrate transport arm.

A substrate transfer module, which provides clean environment to prevent particles from moving to a substrate, and semiconductor manufacturing equipment including the same. The substrate transfer module of the semiconductor manufacturing equipment includes a transfer chamber providing a transfer space of the substrate, having a chamber groove lowered by a predetermined height from a bottom surface to form a gap with respect to the bottom surface, a guide member provided in an inside portion of the transfer chamber, and a substrate transfer robot configured to move along the guide member and to transfer the substrate.

A transfer apparatus includes a first vacuum transfer module; a first transfer robot disposed in the first vacuum transfer module and at least one ring. In addition, a second vacuum transfer module is provided; and a second transfer robot is disposed in the second vacuum transfer module. A tubular connecting module is disposed between the first vacuum transfer module and the second vacuum transfer module. Further, the first vacuum transfer module, the second vacuum transfer module and the tubular connecting module are arranged along a first direction, with the tubular connecting module having a first length in the first direction, and the first length is smaller than the diameter of the wafer. A wafer support is rotatably attached to the tubular connecting module and at least three ring supporting members outwardly extend from the wafer support to support the at least one ring.

It is possible to increase a transfer throughput of the substrate. There is provided a technique that includes: (a) supporting a container capable of accommodating a substrate with a first container support; and (b) controlling a rotating shaft for revolving placement structures arranged in a circumferential direction, an elevating structure for elevating a transfer robot and the transfer robot such that, when transferring a container from the transfer robot to a predetermined placement structure, a second moving speed of the elevating structure at which the transfer robot is elevated is faster than a first moving speed at which the predetermined placement structure is moved to a transfer position where the container is transferable from the transfer robot.

Disclosed is a wafer aligner device including a platform, a lifting gripper disposed on the platform to be lifted up or lowered down relative to the platform, a rotating gripper disposed on the platform to be rotated relative to the platform, a rangefinder disposed next to the platform, and a control module. The control module is electrically connected to the lifting gripper, the rotating gripper, and the rangefinder. The control module drives the lifting gripper to be lifted up or lowered down to transfer a wafer between the lifting gripper and the rotating gripper. When the wafer is disposed on the rotating gripper, the control module rotates the rotating gripper relative to the platform and drives the rangefinder to detect a change in a relative distance along an edge of the wafer so as to determine a position of a notch of the wafer.

A substrate transfer robot system includes: a first arm unit that changes a position of an end with respect to a base in a first plane; a second arm unit that changes a position of the hand with respect to the end in a second plane perpendicular to the first plane; and a control unit that controls the first arm unit and the second arm unit to move the hand while compensating, by the first arm unit, for a displacement of the hand caused by a change in amount of deflection of the first arm unit and the second arm unit.

A substrate transfer robot assembly includes a tower, a first arm with a first end effector, and a second arm with a second end effector and a third end effector. The tower defines a tower axis, the first arm and the second arm extend radially outward from the tower, the first end effector is coupled to the tower by the first arm, and the second end effector and a third end effector are coupled to the tower by the second arm. The first end effector is supported by the first arm for translation from the tower radially relative to the tower axis, and the second end effector and the third end effector are supported by the second arm for translation from the tower radially relative to the tower axis. Substrate processing systems, methods of making substrate processing systems, and substrate transfer methods are also described.

An end effector is disclosed. Exemplary end effector includes a paddle, wherein a proximal end of the paddle is provided with a rear protrusion for positioning a substrate; a ring extending from the paddle, wherein the ring is provided with a circular protrusion for supporting the substrate; and a blade extending from the ring, wherein a distal end of the blade is provided with a front protrusion for positioning a substrate.