Provided are a transfer unit and a substrate treatment apparatus which can stably vacuum-adsorb a substrate and can be used for a long time. The transfer unit includes: a robot arm; and an end effector connected to the robot arm, wherein the end effector includes: a body; a vacuum hole formed in the body; and a pad installed on the body to surround the vacuum hole and including a first pad layer and a second pad layer stacked sequentially, wherein the first pad layer has greater elasticity than the second pad layer, and the second pad layer has greater hardness than the first pad layer.

A substrate treating apparatus includes: a chill plate; a first support part installed on the chill plate and including a first tip having a first height; and a second support part installed on the chill plate and having a height changed according to a temperature, wherein at a first temperature, a maximum height of the second support part becomes equal to or lower than a height of the first tip, such that the substrate is supported by the first tip of the first support part, and at a second temperature lower than the first temperature, the second support part becomes higher than the first tip, such that the substrate is supported by the second support part.

To provide a transport robot 1 including a first hand including a chuck mechanism to clamp and hold an outer peripheral end portion of a workpiece, and a first movement mechanism to move the first hand to an advancing position where the workpiece contained in the cassette case can be held and to a retreating position farther from a cassette case than the advancing position, in which when a direction connecting the retreating position and the advancing position is defined as an X direction, a direction from the retreating position toward the advancing position is defined as an X1 direction, and a direction from the advancing position toward the retreating position is defined as an X2 direction, a chuck mechanism includes a chuck portion openable and closable vertically, and a movement mechanism to move the chuck portion into the X direction.

The present disclosure relates to a substrate transfer device for sensing deflection of an end-effector and a substrate processing apparatus having the same. The substrate transfer device includes: an end-effector extending in a first direction and supporting a substrate; an end-effector hand connected with one side in the first direction of the end-effector; a horizontal movement unit connected with the end-effector hand and moving the end-effector in the first direction; and a deflection sensing unit including a light emitting part and a light receiving part, which are respectively disposed at both sides of a movement path of the end-effector, and sensing deflection of the end-effector.

A substate gripper includes a first plate, a second plate, and a plurality of arms coupled with the first plate and the second plate. Each of the plurality of arms includes at least one flexure member configured to flex responsive to movement of the second plate with respect to the first plate. Flexure of the flexure members of the plurality of arms causes respective ends of the plurality of arms to perform a gripping action to grip a substrate.

A substrate transport robot system includes a substrate holding hand to hold a plurality of substrates, a robot arm, and a controller. The controller is configured or programmed to acquire an amount of deviation of placement of each of the plurality of substrates with respect to a predetermined reference position based on a detection result of a detector, and control a transport operation of the robot arm operable to transport the plurality of substrates based on an acquired amount of deviation such that each of the plurality of substrates is loaded separately into a mount and/or unloaded separately from the mount.

There is provided a substrate processing apparatus with improved throughput by reconsidering a configuration of an apparatus including a batch type module and a single wafer type module. In a single wafer processing region according to single wafer processing of a processing block of the present invention, a buffer unit to and from which both a first transfer mechanism and a center robot can hand over and receive a substrate(s) is provided. Therefore, the first transfer mechanism can collectively hand over and receive processed substrates and unprocessed substrates via the buffer unit. Therefore, a potential of the first transfer mechanism is drawn out, and the substrate processing apparatus having a high throughput can be provided.

Disclosed is an apparatus for processing a substrate and an apparatus for transferring a substrate. The apparatus for processing the substrate includes: an index module including a load port on which a container containing a substrate is placed and an index robot that loads or unloads a substrate into or from the container placed on the load port; and a processing module for processing the substrate transferred from the container placed on the index module, in which the processing module includes: a buffer unit on which the substrate is placed temporarily; and a main transfer robot for transferring the substrate between the buffer unit and a processing chamber that processes the substrate, the index robot is provided to approach the buffer unit, and the buffer unit includes: a plurality of buffers which is stacked on each other and supports the substrate; and an interval changing unit for changing an interval between adjacent buffers among the buffers.

An EFEM is provided with a circulation path including a substrate transfer space formed inside a housing and a return path configured to return gas flowing from one side to the other side of the substrate transfer space, the EFEM including: a partition wall configured to separate the substrate transfer space and the return path; a capture part provided in the return path having a higher pressure than the substrate transfer space in a state in which the gas circulates through the circulation path, and configured to capture particles contained in the gas flowing through the return path; and a connecting pipe configured to guide the gas flowing inside a predetermined device arranged in the substrate transfer space to the return path, wherein the connecting pipe is connected to the return path on an upstream side of the capture part in a gas flow direction.

Disclosed are an interface module capable of increasing substrate throughput, a method of operating the interface module, and a substrate processing apparatus including the interface module. The interface module configured to load and unload a substrate in the substrate processing apparatus includes a load port module including a plurality of load ports configured to allow a container accommodating a substrate to be placed thereon and an index module disposed on one side of the load port module and configured to unload the substrate from the container and load the substrate into a buffer module or to load a substrate processed in the substrate processing apparatus into the container.